Abstract: A stack jack modular jack assembly is comprised of a multi-port housing, and a plurality of modular jack subassemblies. The jack subassemblies include upper and lower jack housing sandwiching therebetween, a cross-talk shield. The terminal subassembly is substantially Z-shaped, which allows for increased space there below for signal conditioning components. The terminal module also includes a center shield and a lower shield, and an outer shield, all of which are commoned together and grounded. An outer shield substantially surrounds the entire assembly, and is commoned to the other shield members.

Abstract: An IC socket (1) includes a base (10), a cover (11) pivotally mounted to one side of the base, and a plurality of electrical contacts received in the base for electrically connecting with a burn-in board. The base has six projecting members (102) to form a container for receiving an IC therein. The cover includes a frame (110) defining an opening (1101) a middle thereof, and a pressing portion (111). The pressing portion comprises a pair of bearing springs (1110), and a pair of bars (1111) interconnecting corresponding opposite ends of the bearing springs. The bars are embedded in the rear and front sides of the frame, and the bearing springs are located in opposite lateral sides of the opening. When the cover firmly engaging with the base, the bearing springs press the IC on the contacts. The IC socket thus electrically connects the IC with the burn-in board.