Abstract: A method of sealing a halogen lamp including: providing a lamp envelop having an envelop body, an open end portion and a closed end portion: inserting a mount including a filament into the lamp envelop through the open end portion thereof; heating the closed end portion of the lamp envelop to soften and shrink thereby sealingly embedding one end of the mount in the closed end portion of the lamp envelop, while providing a reduced pressure in the lamp envelop; filling the lamp envelop with a required gas; and heating the open end portion of the lamp envelop to soften and shrink thereby sealingly embedding the other end of the mount in the closed end portion of the lamp envelop.

Abstract: A method of sealing a lamp includes: providing a lamp envelop having an envelop body, and first and second end portions which are open; inserting a mount including a filament and a resilient retainer into the lamp envelop through one of the open end portions until the mount is retained within the lamp envelop by the resilient retainer; heating the first open end portion of the lamp envelop to soften and shrink and then optionally pinching the heated portion thereby sealing the first open end portion with one end of the mount embedded therein; and heating the second open end portion of the lamp envelop to soften and shrink and then optionally pinching the heated portion thereby sealing the second open end portion with an opposite end of the mount embedded therein.

Abstract: A process is disclosed for anodically bonding an array of spacer columns to one of the inner major faces on one of the generally planar plates of an evacuated, flat-panel video display. The process includes the steps of: providing a generally planar plate having a plurality of spacer column attachment sites; providing electrical interconnection between all attachment sites; coating each attachment site with a patch of oxidizable material; providing an array of unattached permanent glass spacer columns, each unattached permanent spacer columns being of uniform length and being positioned longitudinally perpendicular to a single plane, with the plane intersecting the midpoint of each unattached spacer column; positioning the array such that an end of one permanent spacer column is in contact with the oxidizable material patch at each attachment site; and anodically bonding the contacting end of each permanent spacer column to the oxidizable material layer.

Abstract: A method of manufacturing a field emission element includes the steps of: forming an overhang portion on a substrate, the overhang portion having a cross section with confronting two parts; depositing a first sacrificial film on the overhang portion with the two parts, the first sacrificial film having a cross section with two parts; depositing a reaction control film on the first sacrificial film with the two parts, the first sacrificial film controlling chemical reaction of the first sacrificial film and having a cross section with two parts; chemically react the first sacrificial film so as to make the two parts of the first sacrificial film contact each other; depositing a field emission cathode film on the contacted area of the first sacrificial film; and exposing a tip of the field emission cathode film.

Abstract: A method for producing a plasma display panel, including the steps of forming electrodes on at least one of a pair of substrates, covering the electrodes with a dielectric film, forming a protective film on the dielectric film for protecting the dielectric film from electric discharge, forming a temporary protective film on the protective film for temporarily protecting the protective film until the panel is assembled, assembling the panel from the pair of substrates, and subsequently removing the temporary protective film by generating plasma in the panel.

Abstract: In a method of manufacturing a field emission cold cathode which has an emitter chip (25) of a metal material on a conductive layer (21) and is placed in a predetermined vacuum, a protection film (26) is formed on the emitter chip to prevent an unfavourable layer from being formed directly on the emitter chip. The protection film is removed from the emitter chip at a time when the field mission cold cathode is placed in the predetermined vacuum. On the conductive layer, an insulation layer (22) and a gate electrode layer (23) are formed to define a cavity (24). In the cavity, the emitter chip is formed on an exposed surface (21a) of the conductive layer.

Abstract: A planar member for a shadow mask is provided, which is hard to generate wrinkles in or break when being pulled at four sides to apply a tension to a beam-selecting area with beam-passing apertures. The planar member comprises the beam-selecting area, a first band frame portion surrounding the beam-selecting area, a second band frame portion disposed around and spaced from the first band frame, a plurality of bridge portions bridging the first and second band frame portions at plural points, and a plurality of outer areas with plural apertures, defined by the first and second band frame portions and two bridge portions. The connecting part of the bridge portion with the second band frame portion is reinforced in such a way that the width of the bridge portion increases gradually to connect with the second band frame portion.

Abstract: In a quartz glass tube body for high-pressure discharge lamp, the devitrification occurs during lighting, a light flux decreases and finally the useful life ends, where the main cause of this devitrification phenomenon is reaction between a sealed substance and the quartz glass tube body. It is one object of the present invention to attain the longer useful life, for example, of a high-pressure discharge lamp by preventing such a phenomenon. According to the present invention, a coating is made up by forming one or more oxynitride layers of an element chosen from among aluminum, tantalum, niobium, vanadium, chromium, titanium, zirconium, hafnium, yttrium, scandium, magnesium, silicon and lanthanum rare earth elements.

Abstract: A support aligning fixture capable of facilitating fitting of supports in support holes of an aligning plate and improving positional accuracy of the supports. First and second aligning plate members of the same construction and thickness are superposed on each other while being registered with each other, to thereby provide an aligning plate. The aligning plate members each are formed with tapered support holes, to thereby facilitating insertion of supports therein. The supports are positioned by two diameter-reduced ends of the support holes of the aligning plate members, resulting in positional accuracy of the supports being increased.