Abstract: A micro-valve includes an orifice plate including a first surface and a second surface, and an orifice extending from the first surface to the second surface. The micro-valve also includes a spacing member disposed on the first surface and offset from the orifice, a valve seat disposed on the first surface. The valve seat defines an opening in fluid communication with the orifice in a flow direction. The micro-valve also includes an actuating beam disposed on the spacing member extending from the spacing member toward the orifice, the actuating beam being moveable between an open position and a closed position. The micro-valve also includes a sealing member affixed to an end portion of the actuating beam. In a closed position, a sealing surface of the sealing member contacts the valve seat to close the micro-valve.

Abstract: A recording apparatus includes a recovery unit including a first cap configured to cap the first ejection port array and a second cap configured to cap the second ejection port array, a first tank configured to contain the first liquid to be supplied to the first ejection port array, a second tank that is arranged farther from the recovery unit than the first tank is to the recovery unit and that is configured to contain the second liquid to be supplied to the second ejection port array, a first atmosphere communication valve, a second atmosphere communication valve, and a control unit configured to, in a case where an instruction to transport the recording apparatus is input, perform control of opening the first atmosphere communication valve, and perform control of closing the second atmosphere communication valve.

Abstract: In some examples, a printing press includes a printing unit having at least four nozzle bars, each including a print head. The printing unit includes at least two cleaning devices. At least two of the nozzle bars are configured to make contact with at least one of the cleaning devices. At least one of the cleaning devices has at least one storage position and at least one usage position. In the storage position, the at least one cleaning device is arranged along a transport direction of a printing substrate. The at least two cleaning devices may include at least one guide system configured as a shared guide system, and the at least two cleaning devices may further include at least one guide element configured as a shared guide element. For example, the shared guide element may be configured as at least one of a linear guide or a rail.

Abstract: The object of the present invention is to provide a novel device and method for accurately transporting printable substrates suitable for substrates of various types, sizes and thicknesses. In addition, the invention is suitable for printing machines without contact with the substrate, such as inkjet printing machines.

Abstract: The object of the present disclosure is to optimize the time necessary for filling and the ink consumption. One embodiment of the present disclosure is a printing apparatus having: a storage unit; a print head having an ejection port from which ink supplied from the storage unit is ejected; an ink supply path that connects the storage unit and the print head; a suction unit configured to perform suction at the ejection port; and a supply control unit configured to supply ink stored in the storage unit to the ink supply path and the print head by performing suction at the ejection port by the suction unit, and the printing apparatus has an acquisition unit configured to acquire information relating to ink discharge from the ink supply path and the supply control unit determines the number of times of suction by the suction unit based on the information.

Abstract: A head cap covers an inkjet type recording head. The head cap includes a cap housing and a cap cover. The cap housing has a liquid storage space opened upward. The cap cover is provided along an open end of the cap housing. The cap cover has an opening through which the recording head enters and leaves.

Abstract: A liquid ejecting head includes a piezoelectric element and a vibrating plate configured to vibrate in response to actuation of the piezoelectric element, the vibrating plate including a first layer that contains SiO2 and a second layer that contains ZrO2 and that is stacked on the first layer. The second layer contains a first impurity element different from Zr, and the concentration of the first impurity element at an interface in contact with the first layer in the second layer is higher than the concentration of the first impurity element in an internal region that is included in the second layer and that is contiguous from the interface to the surface of the second layer.

Abstract: A printing device includes an inkjet head, a filter accommodating portion, a filter configured to be accommodated in the filter accommodating portion and extending in a given direction from one end to the other end of the filter to collect mist, and a grip portion provided at least one of the one end or the other end of the filter. The grip portion includes a handle protruding from the filter, a recessed portion recessed inside the filter, or a hole.

Abstract: A printer comprising a printhead configured to selectively cause a mark to be created on a substrate. The printer comprises a stepper motor having an output shaft coupled to the printhead, the stepper motor being arranged to vary the position of the printhead relative to a printing surface against which printing is carried out, and to control the pressure exerted by the printhead on the printing surface. The printer further comprises a sensor configured to generate a signal indicative of an angular position of the output shaft of the stepper motor. The printer further comprises a controller arranged to generate control signals for the stepper motor so as to cause a predetermined torque to be generated by the stepper motor; said control signals being at least partially based upon an output of said sensor.

Abstract: A liquid discharge head includes a head body, a driver IC, a housing, a heat dissipation plate, and a pressing member. The head body includes a discharge hole configured to discharge a liquid. The driver IC controls driving of the head body. The housing is located on the head body, and includes an opening at a side surface. The heat dissipation plate is located at the opening of the housing, and is configured to dissipate heat generated by the driver IC. The pressing member presses the driver IC against the heat dissipation plate. In addition, the heat dissipation plate is fixed to the pressing member.

Abstract: A liquid ejection head circuit board including a substrate, a heat generating resistance element that generates heat energy used for ejection of liquid, an electric wiring layer that is electrically connected to the heat generating resistance element, and an insulating film that insulates the electric wiring layer. The insulating film includes a first insulating film and a second insulating film on the first insulating film, the first insulating film is a first SiOCN film, and the second insulating film is a second SiOCN film containing more carbon than the first SiOCN film or a low-density insulating film with a lower density than the first SiOCN film.

Abstract: A recording apparatus has a receiving member provided at a carriage having thereon a recording head and reciprocally moving, and receiving a liquid cleared away from a wiper for wiping and cleaning the recording head by a cleaner member. The cleaner member can assume, with respect to the carriage, a first position capable of cleaning the wiper, and a second position allowing the receiving member to receive the liquid cleared away from the wiper by the cleaner member.

Abstract: A liquid discharge head according to an embodiment includes a head body having a first surface configured to discharge a liquid and a second surface facing the first surface, a drive IC configured to drive the head body, and a head cover configured to cover at least the second surface of the head body while housing the drive IC. The head cover includes a top plate facing the second surface of the head body and a first side plate that is connected to the top plate and that is in contact with the drive IC, and in the head cover, a thickness of the first side plate is thinner than a thickness of the top plate.

Abstract: A wafer structure including a chip substrate and plural inkjet chips is disclosed. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the first inkjet chip and the second inkjet chip. Each of the first inkjet chip and the second inkjet chip includes plural ink-drop generators. Each of the ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and form plural horizontal axis array groups having a central stepped pitch equal to 1/600 inches or less.

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

Abstract: Provided is a liquid ejection module capable of enhancing the strength of an orifice plate while achieving favorable ejection operation at each ejection port. To that end, the liquid ejection module includes a functional layer in which a plurality of energy generating elements are arranged, a flow channel forming layer in which pressure chambers, individual flow channels, and a common flow channel are formed, and an orifice plate having ejection ports formed therein. The functional layer, the flow channel forming layer and the orifice plate are stacked. In the flow channel forming layer, a beam is formed, extending from a flow channel wall of the common flow channel toward the individual flow channels and supporting the orifice plate in a region facing a first opening.

Abstract: A liquid discharging head includes a nozzle plate having a plurality of nozzles from which liquid is discharged; a plurality of individual liquid chambers that are communicably connected to the plurality of nozzles, respectively; a common liquid chamber that supplies liquid to the plurality of individual liquid chambers; and a circulation common liquid chamber that leads to a plurality of circulation channels. A part of the common liquid chamber overlaps the circulation common liquid chamber from a direction in which liquid is discharged from the nozzles, and another part of the common liquid chamber overlaps the circulation common liquid chamber from a direction orthogonal to both the direction in which liquid is discharged from the nozzles and a direction in which the nozzles are aligned.

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

Abstract: An integrated inkjet module includes: a support chassis configured for fixedly mounting over a media feed path; a maintenance chassis mounted on the support chassis; a print bar chassis liftably mounted on the maintenance chassis, the print bar chassis having a plurality of print modules mounted thereon, each print module comprising a respective printhead; and an aerosol collector fixed to the support chassis and positioned for collecting ink mist generated during printing.