Patents Examined by Geroge Wyszomierski
  • Patent number: 6682608
    Abstract: An improved guiding member for use within a body lumen having a unique combination of superelastic characteristics. The superelastic alloy material has a composition consisting of about 30% to about 52% (atomic) titanium, and about 38% to 52% nickel and may have one or more elements selected from the group consisting of iron, cobalt, platinum, palladium, vanadium, copper, zirconium, hafnium and niobium. The alloy material is subjected to thermomechanical processing which includes a final cold working of about 10 to about 75% and then a heat treatment at a temperature between about 450° and about 600° C. and preferably about 475° to about 550° C. Before the heat treatment the cold worked alloy material is preferably subjected to mechanical straightening. The alloy material is preferably subjected to stresses equal to about 5 to about 50% of the room temperature ultimate yield stress of the material during the thermal treatment.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: January 27, 2004
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Robert M. Abrams, Sepehr Fariabi
  • Patent number: 4963974
    Abstract: The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.
    Type: Grant
    Filed: April 20, 1988
    Date of Patent: October 16, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Jiro Ushio, Osamu Miyazawa, Akira Tomizawa, Hitoshi Yokono, Naoya Kanda, Naoko Matsuura, Setsuo Ando, Hiroaki Okudaira