Abstract: A semiconductor processing method of forming a capacitor includes, a) providing a mass of electrically insulative oxide of a first density; b) densifying the oxide mass to a higher second density, the densified oxide mass being characterized by a wet etch rate of less than or equal to about 75 Angstroms/minute in a 100:1 by volume H.sub.
Type:
Grant
Filed:
April 12, 1999
Date of Patent:
October 31, 2000
Assignee:
Micron Technology, Inc.
Inventors:
Klaus Florian Schuegraf, Bob Carstensen