Patents Examined by Gordon Jones
  • Heat exchanger
    Patent number: 11137210
    Abstract: A heat exchanger includes a header and a side plate. The header has a face plate that defines a plurality of orifices. The header has a protrusion that extends outward from the header and down such that a gap is formed between the header and the protrusion. An external portion of the protrusion is configured to break away from the header during thermal expansion. The side plate is disposed adjacent to an array of alternating tubes and fins. Each tube extends into one of the orifices of the plurality of orifices. The side plate has an end that is secured to the external portion of the protrusion.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: October 5, 2021
    Assignee: DENSO International America, Inc.
    Inventor: Mark Holmes
  • Embedded type air conditioner outdoor unit and an air conditioner
    Patent number: 11137151
    Abstract: The present disclosure relates to an embedded type air conditioner outdoor unit and an air conditioner. The embedded type air conditioner outdoor unit comprises: a housing comprising an air inlet and an air outlet which are provided on the same side surface of the housing; a heat exchanger provided within the housing, for heat exchange with air introduced by the air inlet; and a cross-flow fan provided within the housing, for flowing the air introduced by the air inlet through the heat exchanger. By applying the technical solution of the present application, the air introduced by the air inlet after heat exchange by the heat exchanger is expelled via an exhaust port by using the cross-flow fan, thereby improving the problem of much noise of the embedded type air conditioner outdoor unit.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: October 5, 2021
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Kai Yu, Handong Xue, Caizhou Zeng
  • Liquid cooled optical cages for optical modules
    Patent number: 11122705
    Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: September 14, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: M. Baris Dogruoz, Mandy Hin Lam, Pirooz Tooyserkani
  • Heat transfer apparatus
    Patent number: 11122706
    Abstract: A heat transfer apparatus and method of manufacture is disclosed. The manifold may have a first mechanical interface, a second mechanical interface remote from the first mechanical interface and one or more internal walls defining at least first and second channels within the manifold between the first and second mechanical interfaces. An evaporator member may be attached to the manifold so as to seal the first mechanical interface. A condenser member may be attached to the manifold so as to seal the second mechanical interface. The manifold, evaporator and condenser members may provide a contained heat transfer system in which a working fluid moves between the condenser member and the evaporator member.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: September 14, 2021
    Assignee: Nokia Technologies Oy
    Inventor: Nicholas Jeffers
  • Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies
    Patent number: 11112839
    Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: September 7, 2021
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Brian Magann Rush, Corey Bourassa, William Dwight Gerstler, Gary Mandrusiak
  • Cooling device
    Patent number: 11106255
    Abstract: In order to enhance heat reception from a cooling target object by a heat sink to efficiently cool a device, the cooling target object, a cooling device including a heat sink and a fluid path is provided. Further, the heat sink includes a heat receiving face. The fluid path is formed so as to allow a predetermined fluid to pass therethrough. The heat exchange portion includes a first path arranged approximately in parallel to the heat receiving face of the heat sink.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: August 31, 2021
    Assignee: NEC Platforms, Ltd.
    Inventor: Mitsuhide Watanabe
  • Collector plate for a motor vehicle heat exchanger
    Patent number: 11092390
    Abstract: A collector plate for a motor vehicle heat exchanger may include a first receiving zone for tubes of a first tube bundle of a heat exchanger. The collector plate may include a second receiving zone for tubes of a second tube bundle of a heat exchanger and a groove extending between the first and second receiving zones. The collector plate may be thinner in a region of the groove. Further, the collector plate may have a channel reducing the thickness of the collector plate from a first face of the collector plate and opposing a second face of the collector plate including the groove.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: August 17, 2021
    Assignee: Valeo Systemes Thermiques
    Inventors: Rémi Tournois, Yves Seynat, Christian Riondet
  • Thermal management system
    Patent number: 11096311
    Abstract: Various implementations disclosed herein include a thermal management system suitable electronic devices. In some implementations, a thermal management system includes an air guide and a cage wall, which together provide: an air intake having a first airflow area to produce a first air pressure; an airflow constriction, following the air intake, having a second airflow area smaller than the first airflow area to produce a second air pressure, and defining a first region; and an outlet following the airflow constriction having a third airflow area greater than the second airflow area to produce a third air pressure. The device cage has at least one aperture in the first region. The second air pressure is less than the first air pressure and the third air pressure and is sufficiently low to draw heated air from within the device cage through the at least one aperture to be expelled through the outlet.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 17, 2021
    Assignee: Cisco Technology, Inc.
    Inventors: Perry L. Hayden, Gary Chan, Bob Dillman
  • Manufacturing method and structure of heat pipe with adjustable working temperature range
    Patent number: 11092386
    Abstract: A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 17, 2021
    Assignee: CELSIA TECHNOLOGIES TAIWAN, INC.
    Inventors: George A. Meyer, IV, Chien-Hung Sun
  • Thermal control system
    Patent number: 11083620
    Abstract: A thermal control unit for delivering temperature-controlled fluid to one or more patient therapy devices (e.g. pads, blankets, etc.) that are in contact with a patient is disclosed. The thermal control unit includes a fluid circuit with an inlet and outlet, a reservoir, a heat exchanger, a pump, and a controller. The thermal control also includes any one or more of the following: (1) an air eliminator with an air filter for filtering air vented from the fluid circuit to the ambient surroundings; (2) a plug that moves in response to changing fluid levels and that fluidly isolates the air filter from the fluid; (3) a second air filter coupled to the reservoir; (4) a check valve to prevent fluid from back flowing into the reservoir; and/or (5) a liquid filter coupleable to the reservoir to filter liquid entering or exiting the reservoir.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: August 10, 2021
    Assignee: Stryker Corporation
    Inventor: Gregory S. Taylor
  • Refrigerator
    Patent number: 11079164
    Abstract: A refrigerator includes a body configured to include a storage compartment, a door portion configured to include an inner door pivotably coupled to the body to open/close the storage compartment and an outer door pivotably provided in front of the inner door, an ice making chamber formed at the door portion to be divided from the storage compartment by the inner door and to be opened or closed by the outer door, an ice making system accommodated in the ice making chamber, a dispenser provided at the door portion to provide water and ice, and a water filter mountable at the door portion to purify water supplied from an external water supply source. The ice making chamber is easily accessible by opening only the outer door while the inner door is closed and prevent cold air in the storage compartment from flowing out.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 3, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Jeong, Bong Su Son, Do Yun Jang, Yeon Woo Cho, Yong Jong Park, Kook Jeong Seo
  • Heat transfer device and spacecraft comprising such a heat transfer device
    Patent number: 11067341
    Abstract: A heat transfer device is disclosed having a housing including a first main wall and a second main wall, the housing having a sealed internal cavity, a liquid contained in the internal cavity, and a mixer able to set the liquid in motion, the heat transfer device being able to be switched between a first state and a second state in which the liquid is in motion and transfers heat by convection between the first main wall and the second main wall, the thermal conductance between the first main wall and the second main wall in the first state being four times less than the thermal conductance between the first main wall and the second main wall in the second state.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 20, 2021
    Assignee: AIRBUS DEFENCE AND SPACE SAS
    Inventor: Andrew Walker
  • Loop heat pipe
    Patent number: 11060797
    Abstract: A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: July 13, 2021
    Inventor: Yoshihiro Machida
  • Heat transferring module
    Patent number: 11039549
    Abstract: A heat transferring module adapted to contact a heating element is provided. The heat transferring module includes a first plate, a second plate and a working fluid. The second plate is connected to the first plate to form a cavity therewith, and the cavity extends along an extension direction of a reference plane. The working fluid is located in the cavity, wherein the cavity is a first area, and a portion of the first plate or a portion of the second plate extending beyond the cavity is a second area. The first area transfers heat by heat convection, and the second area transfers heat by heat conduction.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: June 15, 2021
    Assignee: HTC Corporation
    Inventor: Ya-Lin Hsiao
  • Interface-free thermal management system for high power devices co-fabricated with electronic circuit
    Patent number: 11022383
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 1, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Heat exchanger and water heater including same
    Patent number: 11022342
    Abstract: A heat exchanger includes a second heat transfer tube disposed in a case on the upstream side of a first heat transfer tube and a plurality of fins in a heating gas flow direction and provided in contact with the inner surface of a side wall portion of the case, and a heat shield member. The heat shield member includes a tube cover portion that covers an outer peripheral surface inside portion of a part of the second heat transfer tube near the plurality of fins, and a first extension portion that extends from the tube cover portion toward the plurality of fins so as to close at least a part of a first gap formed between the second heat transfer tube and the plurality of fins. Thus, a problem whereby the second heat transfer tube corrodes easily can be eliminated, and the thermal efficiency of the heat exchanger can be improved.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 1, 2021
    Assignee: NORITZ CORPORATION
    Inventor: Masaki Kondo
  • Air conditioner
    Patent number: 11022325
    Abstract: Disclosed is an air conditioner including a housing having a suction port and a discharge port, a discharge panel having a plurality of discharge holes and disposed at the discharge port, a blowing fan provided inside the housing, and a reinforcing member disposed at a rear of the discharge panel to support the discharge panel. With this configuration, it is possible to prevent the discharge panel from being deformed by pressing, and to minimize the exposure of the inside of the air conditioner through the discharge hole of the discharge panel.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyeong Ae Lee, KwonJin Kim, Sung Jae Kim, Seon Uk Na, Yeon Seob Yun, Young Uk Yun, Byung Han Lim, Sung June Cho, Jong Kweon Ha
  • Interface-free thermal management system for high power devices co-fabricated with electronic circuit
    Patent number: 11015879
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 25, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Heat transfer tube for heat exchanger
    Patent number: 11015878
    Abstract: A thermal energy exchange tube for a heat exchanger includes a tube inner surface and a tube outer surface radially offset from the tube inner surface. The tube outer surface includes patterned porosity with a plurality of high porosity regions of the tube outer surface having relatively high porosity to promote flow of fluid radially inwardly via capillary flow, and a plurality of low porosity regions of the tube outer surface having relatively low porosity to facilitate vapor departure from the tube outer surface.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: May 25, 2021
    Assignee: CARRIER CORPORATION
    Inventors: Abbas A. Alahyari, Miad Yazdani
  • Refrigerator and cold air flow rate monitoring system thereof
    Patent number: 11015858
    Abstract: A refrigerator and a cold air flow rate monitoring system for the refrigerator, the refrigerator including a main body having a refrigerating chamber therein, a cold air passage duct disposed within the main body and provided with a cold air passage therein, a control case coupled to the cold air passage duct and provided with a cold air discharge opening, a knob installed on the control case and opening and closing at least part of the cold air discharge opening in a manner of reciprocally moving in one direction, and a sensing unit provided with a conductive member mounted on the knob and a circuit portion provided on the control case, and configured to sense relative position of the knob with respect to the control case to acquire information related to an opening and closing amount of the cold air discharge opening.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: May 25, 2021
    Assignee: LG ELECTRONICS INC.
    Inventor: Sunghun Lee