Abstract: A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications.

Abstract: An in-situ hydrophobically modified aramid nano aerogel fiber as well as a preparation method and uses thereof are provided. The preparation method includes: providing an aramid nano spinning solution; preparing a hydrophobically modified aramid nano aerogel fiber by using a spinning technology, wherein the coagulating bath adopted by the spinning technology includes a first organic solvent and a halogenated reagent including a monochloroalkane, a monochloroalkane, a dibromoalkane, a dichloroalkane and a trichloroalkane; and then drying to obtain the in-situ hydrophobically modified aramid nano aerogel fiber. The in-situ hydrophobically modified aramid nano aerogel fiber has a unique three-dimensional porous network structure, low heat conductivity, high porosity, high tensile strength and elongation at break, a certain spinnability and structure stability, and can be applied to the field of textiles. A fabric knitted with the hydrophobic fibers has a self-cleaning ability.

Abstract: A polyaspartate composition is provided which comprises a reaction product of a diamine and a diester reacted at a ratio of diamine equivalents to diester equivalents of from 1:0.95 to 1:0.50. The polyaspartate compositions of the invention may be combined with polyisocyanates to produce polyurea compositions, e.g., coatings, adhesives, sealants, composites, castings, and films, which exhibit a faster cure time along with faster development time for physical properties such as hardness and tensile strength.

Abstract: The present invention provides a method for producing a polyamide with controlled activator addition, and a polyamide produced thereby, the method allowing a polymerization conversion rate and a polydispersity index (PDI) to be enhanced by controlling the addition of an activator so as to prevent a gelation phenomenon that occurs during anionic polymerization.

Abstract: A stretchable antistatic film can be formed in a production process using a specific thermoplastic polyurethane. The thermoplastic polyurethane is useful for the production of said film.

Abstract: Provided are a transparent film, an optical material including the same, and a display device including the same.

Abstract: Polyamide resins including the reaction product of an intimate mixture of at least two monomers selected from HMDA and a diamine; and an organic diacid, wherein sebacic acid is present in the organic diacid in an amount of less than or equal to about 50 mol. %, and associated articles and methods are provided herein.

Abstract: A method produces polyamide fine particles by polymerizing a polyamide monomer (A) in the presence of a polymer (B) at a temperature equal to or higher than the crystallization temperature of a polyamide to be obtained, wherein the polyamide monomer (A) and the polymer (B) are homogeneously dissolved at the start of polymerization, and polyamide fine particles are precipitated after the polymerization. Polyamide fine particles have a number average particle size of 0.1 to 100 ?m, a sphericity of 90 or more, a particle size distribution index of 3.0 or less, a linseed oil absorption of 100 mL/100 g or less, and a crystallization temperature of 150° C. or more. In particular, a polyamide having a high crystallization temperature includes fine particles having a smooth surface, a narrow particle size distribution, and high sphericity.

Abstract: Provided is a polyurethane-modified epoxy resin having favorable processing operability in casting, impregnation, or the like in a composition state, a method for producing the same, and a composition of the same. Provided is a low-concentration polyurethane-modified epoxy resin including: a polyurethane having a secondary hydroxyl group-containing bisphenol-based epoxy resin that has an epoxy equivalent of 150 to 200 g/eq and a hydroxyl equivalent of 2,000 to 2,600 g/eq, added to both terminals and/or a single terminal thereof, in which the polyurethane is a modified product of the epoxy resin that is modified with a middle- and high-molecular-weight polyol compound having an Mn of 200 or larger, a polyisocyanate compound, and a low-molecular-weight polyol compound as a chain extender having an Mn of less than 200, and the epoxy resin is used in an amount of 68 to 92 weight % based on a total amount of the components.

Abstract: The present invention provides a decanedioic acid produced by microbial fermentation process, in which the content of C10 aliphatic acid and C10 hydroxy aliphatic acid is maintained at a very low level. The present invention also provides a preparation method of the decanedioic acid and a polymer prepared by using the decanedioic acid as monomer. The decanedioic acid provided by the present invention is prepared by microbial fermentation process. The decanedioic acid product which is produced through the processes of microbial fermentation and separation has a higher purity, a higher thermal stability, and a lower impurity content. The decanedioic acid provided by the present invention could satisfy the requirements of high grade product of polyamide or polyester to produce polymer with excellent qualities.

Abstract: The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.

Abstract: Provided are a polyimide-based film, a window cover film, and a display device including the same. More specifically, a polyimide-based film having different surface energies from each other on both surfaces, a window cover film having excellent optical properties such as a visibility, and a display panel including the same are provided.

Abstract: Provided is a polyamide compound excellent in various properties such as heat resistance and impact resistance. The polyamide compound contains a dicarboxylic acid unit represented by the general formula (1) and a diamine unit having a 9,9-bisarylfluorene skeleton. This polyamide compound is excellent in heat resistance and impact resistance.

Abstract: The invention relates to power cable polymer composition which comprises a thermoplastic polyethylene having a chlorine content which is less than X, wherein X is 10 ppm, a power cable, for example, a high voltage direct current (HV DC), a power cable polymer insulation, use of a polymer composition for producing a layer of a power cable, and a process for producing a power cable.

Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.

Abstract: The present disclosure provides a polyimide thin film, a preparing method thereof, and a display device. Specifically, a polyamic acid containing an ester group structure is prepared. The polyamic acid is prepared by a two-step process. A dianhydride containing an ester group structure is introduced into a polyimide to increase the content of benzene ring. Moreover, the introduction of ester groups is conducive to flexibility, which not only improves its heat resistance component, but, by introducing components with longer flexible chains, effectively destroys the regularity of macromolecules, thereby improving the flexibility of the material. Moreover, the introduction of rigid aromatic ring groups facilitates the realization of heat resistance. The ester bond is introduced into the dianhydride through the esterification, and then participates in the preparing of the polyimide material.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.

Abstract: Methods of making fiber reinforced composite articles are described. The methods may include treating fibers with a sizing composition that includes a polymerization compound, and introducing the treated fibers to a pre-polymerized composition. The combination of the treated fibers and pre-polymerized composition may then undergo a temperature adjustment to a polymerization temperature at which the pre-polymerized composition polymerizes into a plastic around the fibers to form the fiber-reinforced composite article. Techniques for introducing the treated fibers to the pre-polymerized composition may include pultrusion, filament winding, reactive injection molding (RIM), structural reactive injection molding (SRIM), resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM), long fiber injection (LFI), sheet molding compound (SMC) molding, bulk molding compound (BMC) molding, a spray-up application, and/or a hand lay-up application, among other techniques.

Abstract: Provided are polymers, which may be crosslinked to form a main-chain liquid crystalline (LC) hydrogel with a three-dimensional network. Also provided are methods of using the hydrogel as a substrate for tissue culture. For example, the hydrogel may organize into LC phases and encapsulate a plurality of cells within its polymeric network. In some embodiments, human stem cells are cultured using the present method with good viability and demonstrate faster proliferation in the present LC hydrogel compared to a non-LC gel.