Patents Examined by Gregory N. Thompson
  • Patent number: 5737188
    Abstract: A motor vehicle control module is described comprising a control unit with a carrier body, a circuit arrangement applied on the carrier body, a housing body that at least partially encloses the carrier body, at least one stamped grid with several stamped grid connections integrated in the housing body, and also the sensors and/or actuators with sensor elements and sensor connections and respectively actuator elements and actuator connections associated to the control unit. To reduce the space requirement and the costs and to improve the susceptibility to faults in the signal transmission from the sensors/actuators to the control unit, at least some of the sensors/actuators are situated in the control unit or in the immediate proximity of the control unit and are contacted by directly joining their respective sensor connections or actuator connections with stamped grid connections of the stamped grid of the control unit.
    Type: Grant
    Filed: April 22, 1996
    Date of Patent: April 7, 1998
    Assignee: TEMIC TELEFUNKEN microelectronic GmbH
    Inventors: Werner Flierl, Michael Genzel, Armin Gottschaller, Gerhard Hettich, Thomas Schmid
  • Patent number: 5703751
    Abstract: An electrical apparatus with a detachable power supply base, including a power supply base which holds a rechargeable battery and a control circuit on the inside and has two coupling channel bars at the top, and an electrical apparatus having a base and two outward coupling flanges raised from two opposite sides of the base and adapted for detachably coupling to the coupling channel bars of the power supply base to become electrically connected to the battery of the power supply base. The control circuit detects the power level of the battery and shows it through a display for example an indicator light on the outside of the power supply base.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: December 30, 1997
    Inventor: Ming-Chou Huang
  • Patent number: 5381305
    Abstract: A spring clip for clamping a heat sink module to an electronic module. The heat sink module has a flat upper surface and a plurality of vertical cooling elements which extend upwardly from the upper surface of the heat sink module. The clip includes a central potion which engages the upper surface of the heat sink module and a pair of oppositely extending resilient end potions which are cantilevered from the central potion. A vertical leg portion is connected to the free end of each end portion of the clip and extends downwardly along one of the end surfaces of the electronic module. Each leg potion has an inwardly extending projection which has an upwardly facing edge surface for engaging a downwardly facing edge surface of the electronic module at one of the lower corners of the electronic module upon downward bending of the end potion so that the projection is biased upwardly against the lower corner of the electronic module due to the resiliency of the end potion.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: January 10, 1995
    Assignee: Wakefield Engineering, Inc.
    Inventors: Ronald A. Harmon, Giovanni Urrata
  • Patent number: 5010445
    Abstract: A DIP or surface mount type switch (10) contains a built-in electronic system for direct interfacing to an electronic circuit. The DIP switch and the built-in electronic system consisting of bias resistors (22), active buffers (14), and decoding circuitry (18), are combined as a single package. These components will be mounted and interconnected to a substrate PCB (26), or chip carrier package (31), or as an integral unit within the switch housing (12). This DIP switch also includes socket pins or mounting leads (30) to connect the assembly to a system circuit board.
    Type: Grant
    Filed: January 25, 1990
    Date of Patent: April 23, 1991
    Inventor: Christoffer S. Weinold
  • Patent number: 4920453
    Abstract: A module for electrical connection to a rack forming a part of programmable controller is provided which includes a body member having a display portion and a circuit board terminal block connected to the body member. A door is hingedly attached to the body member, and has a panel presenting a surface adapted to be marked with the usual marking pen or pencil for identifying the module. In other embodiments, the module includes an additional panel portion for placement of an identifying label, a snap fitment arrangement for attachment to the rack as well as guide slots in the rack for the circuit board and a wire tie arrangement for holding electrical wires in a consolidated manner.
    Type: Grant
    Filed: October 13, 1988
    Date of Patent: April 24, 1990
    Assignees: Allen-Bradley Company, Inc., Nippondenso Company, Ltd.
    Inventors: Kazuhiko Onose, Willard B. Ott
  • Patent number: 4918574
    Abstract: A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: April 17, 1990
    Assignee: International Business Machines Corporation
    Inventors: Joseph G. Hoffarth, Donald J. Lazzarini, John A. Welsh, John P. Wiley
  • Patent number: 4890193
    Abstract: Gas-insulated switchgear equipment includes a plurality of vertical-type circuit breakers electrically connected in series, and outside led-out devices connected to connected portions of a series connection of the circuit breakers and at least one main bus bar connected to two of the plurality of circuit breakers located at both ends of the series connection. In the equipment, the circuit breakers are a vertical type circuit breaker and are arranged on a substantial straight line and led-out portions for leading out terminals formed in the circuit breakers in a direction perpendicular to a direction of the arrangement of the circuit breakers, and connecting bus bars interconnecting the circuit breakers in series and the outside led-out devices are disposed on one side of the circuit breakers and the at least one main bus bar is disposed on the other side of the circuit breakers.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: December 26, 1989
    Assignee: Hitachi, Ltd.
    Inventor: Tohru Tsubaki
  • Patent number: 4763223
    Abstract: An apparatus including terminals for electronic devices such as display units or the like. The terminals are hermetically sealed into the structure of the electronic device during the assembly thereof. The terminal includes a bent, resilient end portion at the internal end thereof to make contact with electrical conductors within the device. The other end of the terminal extends beyond the edge of the device. The mid-region of the terminal is retained within the hermetic seal which is disposed adjacent to the edge of the apparatus.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: August 9, 1988
    Assignee: Babcock Display Products, Inc.
    Inventor: Sang T. Tang
  • Patent number: 4639829
    Abstract: A device to thermally couple a heat dissipating integrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc which is spring loaded on the back of the chip and a heat conductive hat member having an opening with a continuous tapered wall to conformally fit over the truncated conical disc. The gap between the disc and the hat is packed with a thin layer of a high thermal conductivity grease to provide a low interfacial thermal resistance and mechanical flexibility between the disc and the hat. For additional cooling enhancement of the chip, at the interface between the chip back surface and the base of the disc a self-healing alloy having a high thermal conductivity and low melting point is provided.
    Type: Grant
    Filed: June 20, 1986
    Date of Patent: January 27, 1987
    Assignee: International Business Machines Corporation
    Inventors: Carl D. Ostergren, John A. Paivanas, deceased
  • Patent number: 4523253
    Abstract: An encapsulated medium-voltage electrical load switching apparatus has four, three-position rotary switches, supported by pairs of opposing insulated half-shells, two-over-two in parallel alignment within a gas-filled sealed shut shell housing.The housing front and back have dome-shaped protrusions to maintain the seal against fluctuations in gas pressure. Bushings in the floor and ceiling of the housing, aligned with the switch face plane, provide gastight connections between the switches and external cables, enclosed fuses and transformer terminals. Switch control is provided by drives mounted on a plate at the front of the housing exterior which operate actuator arms that extend in a gastight way through the housing front and manipulate selector shafts that connect to set the switches into closed-circuited, open-circuited and grounded positions.
    Type: Grant
    Filed: February 16, 1982
    Date of Patent: June 11, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Kurt Grunberg, Rainer Poth, Peter Werner, Kurt Koch, Friedrich Schweppe, Kurt Voigtlander