Patents Examined by Gregory Thomspon
  • Patent number: 8199509
    Abstract: An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: June 12, 2012
    Assignee: Sony Corporation
    Inventors: Takahiro Akabori, Yuito Tsuji