Abstract: A heat sink includes a plate for engaging on an integrated circuit device and having a number of fins. A fastener blade is engaged in the fins and includes two hooks for engaging with the device and for securing the plate to the device without threading fasteners. The fastener blade has a middle protrusion engaged with the plate for resiliently forcing the plate to engage with the device. A cover is secured to the fins for forming an air passage between the plate and the cover and a fan is secured to the cover for drawing air through the gaps formed between the fins.