Patents Examined by Gustavo A Hincapie Serna
  • Patent number: 11962062
    Abstract: Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through channels within the ribs of the multi-function aperture to provide better heat transfer than can be achieved through air cooled systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: April 16, 2024
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: William E. Rhoden, Anders Walker, David Cripe, Ross Keith Wilcoxon, Jeremiah Wolf
  • Patent number: 11959707
    Abstract: Ultrasound devices and systems are disclosed in which cooling of an active acoustic element of an ultrasound transducer is achieved via an electrically conductive member that extends beyond a proximal side of the active acoustic element to contact a heat exchanger. The electrically conductive member delivers electrical driving signals to the active acoustic element while conducting heat to the heat exchanger. A region of the proximal surface of the active acoustic element that is free from contact with the electrically conductive member may also absent from contact with a liquid or a solid, thereby facilitating reflection of ultrasound energy. The heat exchanger may include an electrically insulating fluid that contacts the electrically conductive member to remove the heat conducted through the electrically conductive member. The active acoustic element may be a multilayer lateral mode element, and the electrically conductive member may form an electrode of the lateral mode element.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: April 16, 2024
    Assignee: SUNNYBROOK RESEARCH INSTITUTE
    Inventors: Benjamin Lucht, Samuel Gunaseelan, Kullervo Hynynen
  • Patent number: 11953274
    Abstract: A fluid heat exchanger with pump, adapted to drive a fluid for heat transfer, comprises a heat conduction unit, a diversion unit, and a housing unit. The heat conduction unit includes a heat conductor. The diversion unit includes a cover and a diversion plate. A cooling chamber is defined by the cover and the heat conductor. The cover is provided with a fluid stopper. The diversion plate is disposed in the cooling chamber, and one end of the diversion plate abuts against the fluid stopper, so that the cooling chamber is divided into an upper passage and a lower passage. The housing unit includes a housing and a pump module. The fluid in the housing is driven by the pump module to flow through the upper passage to the lower passage, and then the fluid returns to the housing to carry the heat from the heat conductor.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: April 9, 2024
    Assignee: Corsair Memory, Inc.
    Inventor: Niko Tivadar
  • Patent number: 11953268
    Abstract: A tight-fit riveting structure for a clustered radiation fin set and a heat pipe and a riveting method include a radiation fin set formed by locking a plurality of radiation fins together and at least one heat pipe. The radiation fin set has an accommodation slot for accommodating the heat pipe. The heat pipe is positioned in the accommodation slot for a tight fit by subjecting two sides of the accommodation slot of the radiation fin set to a riveting operation. First riveting and deforming portions defined on two sides of a communication mouth of the accommodation slot are riveted towards a surface of the heat pipe, which causes the deformation of the first riveting and deforming portions whereby the heat pipe is clamped in a tight fit manner.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: April 9, 2024
    Assignee: DONGGUAN HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
    Inventor: Tsung-Hsien Huang
  • Patent number: 11949078
    Abstract: A heat management system including a refrigerant circulation line including a compressor, a water-cooling condenser, an air-cooling condenser, a first expansion valve, an evaporator, a refrigerant heat exchanger, and a gas/liquid separator that discharges only a liquid refrigerant, and cooling an indoor place by circulating a refrigerant; a heating line for heating the indoor place by circulating, through the water-cooling condenser, cooling water that exchanges heat with the refrigerant; and a cooling line for cooling a battery and an electrical component by circulating air or cooling water that exchanges heat with the refrigerant. Therefore, the present invention can not only cool and heat a vehicle but also efficiently manage heat for an electrical component and a battery in a vehicle, and can reduce the number of constituent components for heating and cooling.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: April 2, 2024
    Assignee: Hanon Systems
    Inventors: Hae-Jun Lee, Moo Joong Kim, In-Guk Hwang
  • Patent number: 11946667
    Abstract: Aspects of the present disclosure relate generally to noise suppression vertical curtain apparatus for heat exchanger units. In one implementation, a heat exchanger unit includes a frame having a plurality of side regions and at least one cooler associated with at least one of the plurality of side regions. The heat exchanger unit also includes a vertical axis, an internal volume, a floor, and a fan disposed above the floor to move air through the internal volume. The heat exchanger unit also includes a first set of panels disposed between the floor and the fan, and a vertical curtain disposed between the first set of panels and the fan.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: April 2, 2024
    Assignee: FORUM US, INC.
    Inventors: John Gaska, Hamid Reza Zareie Rajani, Jonathan Penner, Kevin Visscher
  • Patent number: 11948860
    Abstract: A multilayer heat sink including a heat-receiving layer, a channel layer including cooling micropaths extending and directing a fluid in a direction orthogonal to a stacking direction, an orifice layer including jet orifices configured to jet the fluid into the cooling micropaths, and drain orifices configured to drain the fluid from the cooling micropaths, a header layer including a peripheral wall and a baffle, and a bottom layer, wherein the baffle includes parallel plates disposed parallel to each other, and end plates configured to alternately close an opening at an end and an opening at an opposite end of the parallel plates, and the orifice layer, the bottom layer, the baffle, and the peripheral wall define a supply channel to guide the fluid from a fluid inlet to the jet orifices and a drain channel to guide the fluid from the drain orifices to a fluid outlet.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: April 2, 2024
    Assignee: WELCON Inc.
    Inventors: Yutaka Suzuki, Takashi Saito, Shingo Ikarashi
  • Patent number: 11940233
    Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: March 26, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: M. Baris Dogruoz, Mehmet Onder Cap, D. Brice Achkir, Joel Richard Goergen
  • Patent number: 11940231
    Abstract: A heat dissipation device includes a heat absorbing member being provided with a first accommodating chamber for accommodating a working medium and a mounting hole in communication with the first accommodating chamber; and a valve installed in the mounting hole. The valve is adjustable between a first state and a second state to change the first accommodating chamber between a closed state and an open state. When the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside so that the working medium can be injected into or discharged from the first accommodating chamber, so as to adjust the amount of the working medium in the first accommodating chamber. Thus, the heat dissipation device is applicable to various applications with different heat dissipating requirements.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG ENVICOOL TECHNOLOGY CO., LTD.
    Inventors: Jing Zhang, Genglin Ding
  • Patent number: 11936029
    Abstract: A vehicular heat management system for individually cooling and heating a plurality of air conditioning regions of a vehicle includes a plurality of refrigerant circulation lines configured to cool and heat the air conditioning regions individually shared by the refrigerant circulation lines. The refrigerant circulation lines are provided with one or more air conditioning units for individually cooling and heating the respective air conditioning regions, and are configured to supply a refrigerant to the corresponding air conditioning units to individually cool and heat the air conditioning regions corresponding to the air conditioning units.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 19, 2024
    Assignee: Hanon Systems
    Inventors: Doo Hoon Kim, Hyeon Gyu Kim, Kyung Ju An, Jin Jae Lee, Joong Man Han
  • Patent number: 11927374
    Abstract: Methods and systems for energy storage and management are provided. In various embodiments, heat pumps, heat engines and pumped heat energy storage systems and methods of operating the same are provided. In some embodiments, methods include controlling thermal properties of a working fluid by virtue of the timing of the operation of cylinder valves. Methods and systems for controlling mass flow rates and charging and discharging power independent of working fluid temperature and system state-of-charge are also provided.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: March 12, 2024
    Assignee: GRIDWORTHY TECHNOLOGIES LLC
    Inventor: Benjamin L. Norris
  • Patent number: 11901537
    Abstract: A method for purging air from a cooling system including operating one or more pumps at a selected speed for a first time interval, waiting a second time interval with the one or more pumps off or at a reduced speed relative to the selected speed, and repeating the steps of operating and waiting multiple times.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: February 13, 2024
    Assignee: Caterpillar Inc.
    Inventors: Jonathan M. Baumann, Jared Lamkin
  • Patent number: 11892238
    Abstract: A packaging system for transporting a payload while maintaining the payload within an acceptable temperature range. The payload is cooled by two sets of U-shaped heat pipes within the payload compartment. A set of cold heat pipes is cooled by a layer of phase change material located above the payload, while a set of warm heat pipes is cooled by a layer of phase change material located below the payload.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: February 6, 2024
    Assignee: Sonoco Development, Inc.
    Inventor: Iftekhar Ahmed
  • Patent number: 11892246
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: February 6, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
  • Patent number: 11892240
    Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 6, 2024
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 11884127
    Abstract: A thermal management system includes: a first radiator, a first electric water pump, and a first coolant line configured to allow a coolant to be circulated by the first electric water pump; a second radiator, a second electric water pump, and a second coolant line configured to allow a coolant to be circulated by the second electric water pump; and a first flow control device and a second flow control device installed at front ends and rear ends of the first radiator and the second radiator so as to control a coolant flow direction between the first coolant line, the second coolant line, and a third coolant line. The third coolant line is installed so as to connect the first flow control device and the second flow control device to each other.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seong Bin Jeong, Wan Je Cho, Jae Eun Jeong, Hyun Jae Lee, Nam Ho Park, Tae Hee Kim
  • Patent number: 11856733
    Abstract: Provided is a cold plate including: a heat absorption space for a working medium to be filled therein; a heat transfer structure disposed on a base within the heat absorption space for transferring thermal energy generated from a heat source that is in contact with the base to the working medium; and a flow guide structure disposed in the heat absorption space for guiding the working medium. The flow guide structure of the cold plate can effectively improve the efficiency of thermal energy absorption of the working medium.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: December 26, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Yu-Jie Liu
  • Patent number: 11846474
    Abstract: A cooling array for cooling of an electronic component includes the electronic component, a housing which at least partially enclosing the electronic component, a heat sink support connected to the housing in a fluid-tight manner, and a heat sink which is accommodated in the heat sink support. The heat sink is thermally coupled to the electronic component in order to disperse heat generated by the electronic component.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: December 19, 2023
    Assignee: LISA DRAEXLMAIER GMBH
    Inventors: Erwin Lichtenberg, Christian Goestl, Christian Friedrich
  • Patent number: 11828547
    Abstract: A heat-dissipating device includes a casing and a heat dissipating fin set. The casing has a first hole structure. The heat dissipating fin set includes a protruding fin, a sheltering component and a bridging component. A hollow chamber of the protruding fin has a first opening and a second opening adjacent to each other. The first opening is connected to an inner space of the casing. The sheltering component is disposed on the protruding fin to shelter the second opening. The bridging component is connected to the protruding fin and fixed onto the first hole structure.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: November 28, 2023
    Assignee: Qisda Corporation
    Inventors: Chi-Cheng Lin, Po-Fu Wu, Hung-Jen Wei
  • Patent number: 11791506
    Abstract: A modular heat exchanger for battery thermal management having a plurality of similarly constructed heat exchange elements affixed to a cover plate and fluidly coupled with one another via a single external manifold structure that functions as both an inlet manifold and an outlet manifold for each of the heat exchange elements. Rigidity is improved with alternating tabs or overlapping tabs between adjacent elements, and/or side edges between adjacent elements having cutouts for receiving stiffening ribs formed in the cover plate. The external manifold structure provides additional stiffening for the interconnected heat exchange elements.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: October 17, 2023
    Assignee: Dana Canada Corporation
    Inventors: Garreth D. G. Graves, Benjamin A. Kenney, Michael A. Martin, Kenneth M. A. Abels, Lee M. Kinder