Patents Examined by H. Rickman
  • Patent number: 7776388
    Abstract: Patterned media and associated methods of fabrication are provided in which vertical magnetic grains are grown on a patterned seed layer. The patterned seed layer includes a matrix of islands of a first seed material. Each island of first seed material is separated from other islands by a region of second seed material. The first seed material is selected to initiate growth of magnetic material, and the second seed material is selected to initiate growth of non-magnetic material. Subsequently, magnetic material is grown on the first seed material and non-magnetic material is grown on the second seed material. Deposition may be simultaneously. The magnetic and non-magnetic materials form well-defined vertical columns over the first and second seed materials respectively. Thus, each island behaves as an isolated magnetic unit, which switches independently from its neighbor units, which are magnetically separated by the non-magnetic material.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: August 17, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Elizabeth Dobisz, David Margulies, Olav Hellwig, Xiao Z. Wu
  • Patent number: 6146772
    Abstract: A composite wire for the manufacture of semifinished products to be subjected to an emptying process in the field of goldsmithery. The wire comprises a support core developing essentially along one of its longitudinal axes in a nonprecious metal that is removable by chemical or electrochemical means as well as a plurality of sections in precious metal having an essentially longitudinal development of which at least a portion of each one is radially engaged in the core.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: November 14, 2000
    Assignee: Cento Group S.p.A.
    Inventor: Urbano Terziani
  • Patent number: 5894053
    Abstract: In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings to metallic components, the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder is applied to the metallic surface of the base material in a second process step. Metallic adhesive powder is applied uniformly to the binder in a third process step and solder powder, which has a smaller particle size than the adhesive powder, is applied uniformly to the binder in a fourth process step. After drying the binder, a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings which are to be sprayed thereon.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: April 13, 1999
    Assignee: ABB Research Ltd.
    Inventor: Reinhard Fried
  • Patent number: 5891545
    Abstract: A blank construction for a foot orthotic is formed of a first section and a second section smaller than the first section and which is joined to the first section. The first section has a shape generally the same as a bottom inside surface of a shoe. The blank construction is heat softened at a temperature between about 65.degree. C. and about 85.degree. C. at a pressure up to about 5 psig.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: April 6, 1999
    Assignee: Gleason's Orthotics Inc.
    Inventor: Steven W. Delude