Abstract: Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of ?50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

Abstract: The present invention further relates to a waterborne dispersion comprising (A) polymer P; (B) amphiphilic block copolymer obtained with a controlled radical polymerization process and comprising at least blocks [A] and [B], whereby block [A] comprises ethylenically unsaturated monomer(s) bearing water-soluble and/or water-dispersible functional groups (monomer(s) (i)), and block [B] comprises ethylenically unsaturated monomer(s) different from monomer(s) (i) (monomer(s) (ii)); and (C) crosslinker, characterized in that the polymer P is crosslinkable and comprises ethylenically unsaturated monomer(s) bearing crosslinkable functional groups different from monomer(s) (i) and monomer(s) (ii) (monomer(s) (iii)) in an amount of from 1 to 10 wt. %, based on the total weight of monomers used to prepare the polymer P, the amount of lock copolymer is higher than 1 wt. % and lower than 30 wt.

Abstract: A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

Abstract: The present invention relates to a method for preparing a polyolefin block copolymer, the method comprising: a first step of coordination polymerization of an olefin monomer with a transition metal catalyst in the presence of organozinc; and a second step of continuously adding a diacyl peroxide compound to perform polymerization, and to a polyolefin block copolymer prepared therefrom.

Abstract: Object of the invention is a process for the manufacturing of a polymer with urethane groups, wherein in a first alternative A) a five-membered cyclic monothiocarbonate B) a compound with at least two amino groups, selected from primary or secondary amino groups, and C) a compound which at least two functional groups that react with a group —SH or, in case of a carbon-carbon triple bond as functional group that react with a group —SH, a compound with at least one carbon-carbon triple bond are reacted or wherein in a second alternative A) a five-membered cyclic monothiocarbonate and D) a compound with at least one primary or secondary amino group and at least one functional group that reacts with a group —SH.

Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

Abstract: An insulation product includes mineral fibers and a binder obtained by curing a binding compound, includes as components a) compounds including at least one epoxy function, including at least one epoxy precursor chosen from aliphatic compounds including at least two epoxy functions, b) a hardener chosen from compounds including at least two reactive functions chosen from hydroxyl and carboxylic acid functions, it being possible for the carboxylic acid function(s) to be in salt or anhydride form.

Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

Abstract: To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

Abstract: The corrosion resistance of conversion-coated metal substrate surfaces is further enhanced by treating such surfaces with aqueous mixtures of preformed reaction products obtained by reacting catechol compounds, such as dopamine or a dopamine salt, and functionalized co-reactant compounds, such as a polyethyleneimine.

Abstract: There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.

Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: A resin particle includes a binder resin; a fluorescent colorant A; and a colorant B other than the fluorescent colorant A, in which the resin particle includes a region RA in which a content of the fluorescent colorant A is larger than a content of the colorant B and a region RB in which a content of the colorant B is larger than a content of the fluorescent colorant A.

Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

Abstract: Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).

Abstract: Provided are reactive silicon group-containing polymers and a curable composition containing said polymers. The curable composition provides a cured product having a low modulus, flexibility, excellent tensile strength, tensile elongation, and tear strength. The curable composition can also exhibit excellent rapid curing properties even when a low-activity catalyst has been added. In the reactive silicon group-containing polymer, a reactive silicon group, indicated by general formula (1): (—Si(R1)3-a(X)a), is bonded to the molecular chain of the polymer and an atom adjacent to the reactive silicon group has an unsaturated bond. In general formula (1), each R1 can independently indicate a C1-20 hydrocarbon group, and the R1 hydrocarbon groups can be substituted and a hetero-containing group can be used. X can be a hydroxyl group or a hydrolyzable group, and a is 1, 2, or 3.

Abstract: An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component. A cured aliphatic epoxy resin containing a precursor composition and a curing component, the precursor composition including an epoxy component and, optionally, a reactive component, and the cured resin containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component.

Abstract: The present invention relates to a method for preparing a high molecular weight polyether carbonate, by reacting an epoxide and carbon dioxide in the presence of a catalyst of formula (I), and a double metal cyanide (DMC) catalyst.

Abstract: Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.