Abstract: The present invention relates to silicone hydrogels exhibiting desired combinations of physical and mechanical properties, formed from a reactive monomer mixture comprising at least one N-alkyl methacrylamide, and at least one silicone-containing component. These silicone hydrogels may also contain hydrophilic components, crosslinking agents and toughening monomers. These silicone hydrogels are useful in preparing biomedical devices, ophthalmic lenses, and contact lenses.

Abstract: A polycarbonate, a preparation method thereof, and an application thereof are provided. First, an ureido-pyrimidinone type diisocyanate is prepared by a first compound and a second compound. Then, a third compound and the ureido-pyrimidinone type diisocyanate are reacted to obtain a polycarbonate. The polycarbonate replaces scratch resistant metal material to avoid the disadvantages of the signal shielding, heavy weight, and static electricity when using the scratch resistant metal material in the winter. The body housing is made of polycarbonate can have a self-healing property and a good heat resistance, so the internal components can be well protected.

Abstract: An isocyanate polymerization catalyst, a preparation method thereof and a method for preparing polyisocyanates comprising isocyanurate groups by using the same. The catalyst is a carboxylic acid salt containing a di-quaternary ammonium ion. The structure of the catalyst contains hydroxyl-containing aromatic heterocyclic residues. The catalyst is highly active. Only a small quantity of the catalyst is required for the polymerization of isocyanates. The prepared polyisocyanates have color values lower than 25 Hazen, monomer contents of less than 0.5% by weight, high contents of isocyanurates and low viscosities.

Abstract: The present invention is directed to a polypropylene composition (C) comprising a heterophasic propylene copolymer (RAHECO) and a propylene homopolymer (H-PP) as well as a process for the preparation of said polypropylene composition and a film obtained from said polypropylene composition (C).

Abstract: To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30° C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20° C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: A butene-1 polymer composition having MFR values of from 400 to 2000 g/10 min, measured according to ISO 1133 at 190° C. with a load of 2.16 kg, made from or containing A) a butene-1 homopolymer or a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of up to 5% by mole; B) a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of from 6% to 25% by mole; wherein the composition having a total copolymerized comonomer content from 5% to 18% by mole, referred to the sum of A) and B), and a content of fraction soluble in xylene at 0° C. of 65% by weight or more, determined on the total weight of A) and B).

Abstract: [Means for solving problem] The resin composition of the present invention comprises 100 parts by mass of a specific ethylene/?-olefin/non-conjugated polyene copolymer (A) and 0.1 to 5 parts by mass of a peroxide (B), and the copolymer (A) comprises structural units derived from ethylene (a1), an ?-olefin (a2) having 3 to 20 carbon atoms, and a non-conjugated polyene (a3) including intramolecularly two or more partial structures in total selected from the group consisting of structures represented by the following formulae (I) and (II), [Effect] The resin composition of the present invention is excellent in crosslinking properties and the resin composition and its crosslinked shaped article of the present invention can be used, without any limitation, in various applications known as applications of rubber composition, and can be suitably used, for example, for interior and exterior parts for automobiles and applications requiring heat resistance.

Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

Abstract: The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

Abstract: A butene-1 polymer composition having MFR values of from 400 to 2000 g/10 min, measured according to ISO 1133 at 190° C. with a load of 2.16 kg, made from or containing A) a butene-1 homopolymer or a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of up to 5% by mole; B) a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of from 6% to 20% by mole; wherein the composition having a total copolymerized comonomer content from 4% to 15% by mole, referred to the sum of A) and B), and a content of fraction soluble in xylene at 0° C. of 60% by weight or less, determined on the total weight of A) and B).

Abstract: A cross-linkable composition can be provided in the present application. In one embodiment, the cross-linkable composition can allow a membrane formed of the cross-linkable composition to have an excellent interfacial adhesion with another membrane and prevent the occurrence of a detachment phenomenon or the like.

Abstract: The present application relates to a cross-linkable composition, and for example, to a cross-linkable composition which can form a membrane having an excellent interfacial adhesion with other layers and cause no detachment phenomenon when forming a membrane in a structure of a pressure-sensitive adhesive optical member or the like.

Abstract: As a pressure-sensitive adhesive polarizing plate, for example, a pressure-sensitive adhesive polarizing plate allowing a pressure-sensitive adhesive layer in the polarizing plate to have an excellent interfacial adhesion with another layer and have no detachment phenomenon can be provided in the present application.

Abstract: An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and optionally a solvent, wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m2d, preferably of less than 60 g/m2d, in particular less than 30 g/m2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

Abstract: The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150° C.) after having been held at a temperature of 150° C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120° C., the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5<S/R<200??formula (1).

Abstract: There is provided a cured product of an epoxy resin composition, in which the compounding composition and the phase-separated structure of the epoxy resin composition are controlled so that the balance between rigidity and toughness of the cured product is superior compared with those of cured products of conventional epoxy resin compositions. A cured product of an epoxy resin composition, which has both superior rigidity and superior toughness compared with conventional materials can be produced by curing an epoxy resin composition comprising an epoxy resin, a polyrotaxane having graft-chain-modified cyclic molecules and a curing agent for the epoxy resin.

Abstract: This invention relates to flame-retardant modified maleic anhydride resins. This resin copolymer consists of styrene, maleic anhydride and, along with a halogen-free epoxy resin, interacts with a hydroxyl group to become a flame-retardant maleic anhydride copolymer that can be applied to copper clad laminate and prepreg. This composition comprises: (A) one or more epoxy resin mixtures; (B) modified styrene-maleic anhydride curing agent copolymer; (C) additives; (D) inorganic fillers. When the aggregate amount of components (A), (B) and (C) equals 100%, component (A), epoxy resin mixture, is 60%-80% in total weight, component (B), modified styrene-maleic anhydride curing agent copolymer, equals 10%-40% in total weight. This invention uses the copolymer of Styrene and Maleic anhydride to generate a flame-retardant hydroxyl group, and with the phosphorus additive, the above components eventually interact to form a flame-retardant modified maleic anhydride copolymer curing agent.

Abstract: The present invention relates to a compound having the following structure I: where Ar1, Ar2; R1, m, and n are defined herein. The compound of the present invention is useful as an open time additive in waterborne coatings compositions, particularly waterborne paint compositions.

Abstract: To provide a technique for producing an epoxy resin cured product having toughness and elasticity. (A) the amine curing agent (B) an epoxy resin curing agent characterized in that the acrylic block copolymer is dissolved.