Abstract: A wrench includes a pipe, a lever, a first wedge, a second wedge, an elastic element, a counter and a sensor. The lever includes a portion put in and pivotally connected with the pipe. The first wedge is attached to the portion of the lever. The second wedge is in contact with the first wedge. The elastic element biases the second wedge against the first wedge. The counter is installed on the pipe. The sensor signals the counter every time it senses movement of the first wedge past the second wedge.
Abstract: Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.
Type:
Grant
Filed:
September 16, 2002
Date of Patent:
January 31, 2006
Assignee:
Applied Materials, Inc.
Inventors:
Lizhong Sun, Liang-Yuh Chen, Siew Neo, Feng Q. Liu, Alain Duboust, Stan D. Tsai, Rashid Mavliev