Abstract: A method of tracking information associated with an integrated circuit on a substrate after it has been diced. A set of parameters is collected during a first testing process. A first signature is determined for the integrated circuit, based on the set of parameters collected during the first testing process. The first signature and other information are associated with the integrated circuit. The integrated circuit is diced. The set of parameters is collected anew during a second testing process. A second signature is determined for the integrated circuit, based on the data set of parameters collected anew during the second testing process. The second signature is compared to multiple first signatures to locate the first signature that substantially matches the second signature. The other information associated with the first signature is associated with the diced integrated circuit.