Patents Examined by Hao C Nguyen
  • Patent number: 12114454
    Abstract: Disclosed power systems include an enclosure comprising a panel formed from a single sheet of metal. The panel comprises a first formed portion facing a first direction, a second formed portion facing a second direction opposite the first direction, and a center surface. The power system further includes an engine within the enclosure and a generator within the enclosure and configured to convert mechanical power from the engine to electrical power.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: October 8, 2024
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Nathan Joe Jochman, Logan Matthew VandeCorput
  • Patent number: 10462904
    Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: October 29, 2019
    Assignee: Kyocera Corporation
    Inventor: Takayuki Shirasaki
  • Patent number: 9380357
    Abstract: An universal network interface device base module including an access module, a modem module electrically connected to the access module, a dividing structure placed between the access module and modem module, and a base plate, wherein the access module, modem module and dividing structure are mounted on the base plate.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: June 28, 2016
    Assignee: AFL Telecommunications LLC
    Inventors: Ted Lichoulas, Eddie Kimbrell, Ray Mouhot
  • Patent number: 8586871
    Abstract: An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: November 19, 2013
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Jonathan J. Bernstein, Brian R. Smith, Thomas E. Boydston