Abstract: Disclosed power systems include an enclosure comprising a panel formed from a single sheet of metal. The panel comprises a first formed portion facing a first direction, a second formed portion facing a second direction opposite the first direction, and a center surface. The power system further includes an engine within the enclosure and a generator within the enclosure and configured to convert mechanical power from the engine to electrical power.
Type:
Grant
Filed:
June 30, 2022
Date of Patent:
October 8, 2024
Assignee:
ILLINOIS TOOL WORKS INC.
Inventors:
Nathan Joe Jochman, Logan Matthew VandeCorput
Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.
Abstract: An universal network interface device base module including an access module, a modem module electrically connected to the access module, a dividing structure placed between the access module and modem module, and a base plate, wherein the access module, modem module and dividing structure are mounted on the base plate.
Type:
Grant
Filed:
October 28, 2011
Date of Patent:
June 28, 2016
Assignee:
AFL Telecommunications LLC
Inventors:
Ted Lichoulas, Eddie Kimbrell, Ray Mouhot
Abstract: An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.
Type:
Grant
Filed:
July 19, 2011
Date of Patent:
November 19, 2013
Assignee:
The Charles Stark Draper Laboratory, Inc.
Inventors:
Jonathan J. Bernstein, Brian R. Smith, Thomas E. Boydston