Abstract: A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.

Abstract: An ingress protection assembly for leading a wire, such as a signal and/or a supply line, through a partition wall of an electrical device is provided. The ingress protection assembly includes a first wall section provided with a receiving slot extending through the first wall section in a lead-through direction and opening at an inlet facing in an assembly direction of the ingress protection assembly; and a second wall section provided with a counter slot extending through the second wall section in the lead-through direction and opening at a counter inlet facing against the assembly direction, wherein at least in a fully assembled state of the ingress protection assembly, the first wall section and the second wall section are at least partially superimposed in a projection along the lead-through direction such that the receiving slot and the counter slot together form an aperture configured for tightly encompassing the wire.

Abstract: In accordance with at least one aspect of this disclosure, a system includes a reinforcement structure configured to seat in an air gap between one or more solder balls of a ball grid array of a surface mount packaging component. The reinforcement structure is configured and reduce bending of the circuit board during acceleration of the circuit board.

Abstract: A ceramic electronic component includes an element body, a first external electrode, and a second external electrode. The element body includes a dielectric, at least one first internal electrode, and at least one second internal electrode laminated over the first internal electrode via the dielectric interposed therebetween. The element body has a top surface, a bottom surface, a pair of side surfaces, a first end surface, and a second end surface, thereby the element body having a generally cuboid shape. The first internal electrode is exposed on the first end surface. The second internal electrode is exposed on the second end surface. The side surfaces of the element body are concavely curved along a longitudinal direction, so that the element body has a longitudinal central part at which a width is less than a width at the end surface. The first external electrode is formed on the first end surface and electrically connected with the first internal electrode.

Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.