Abstract: An indoor unit for an air-conditioning apparatus includes an insulation box that has a space that receives a heat exchanger, an insulation panel that is disposed between the insulation box and an outer panel and that has an air inlet passage and an air outlet passage, and a casing to which the outer panel is attached. The casing contains the insulation box and the insulation panel. The insulation box has a first outside-air introduction passage that is located apart from the space and that is communicable with an outside of the casing. The insulation panel has a second outside-air introduction passage that is located apart from the air outlet passage and that is communicable between the first outside-air introduction passage and the air inlet passage.

Abstract: A heat exchanger element has upper and lower walls defining upper and lower flow surfaces of a flow path; turbulators on the upper and lower flow surfaces; and a fin pack between the upper and lower surfaces, the fin pack having alternating angled walls extending between the upper and lower surfaces to define triangular flow passages in the flow path between the upper and lower walls. A heat exchanger stack can have multiple layers of the heat exchanger element, and a method for making the heat exchanger is disclosed. The structure produces advantageous flow characteristics.

Abstract: A fill pack includes a first sheet and a second sheet. The first sheet has a first end, a second end and a first plurality of flutes. A first microstructure includes first top flat strips, first bottom flat strips and first conduit sides connecting the first top flat strips to the first bottom flat strips. A plurality of first radii connect the first top flat strips to the first conduit sides and the first bottom flat strips to the first conduit sides. The second sheet has a second plurality of flutes. A second microstructure includes second top flat strips, second bottom flat strips and second conduit sides connecting the second top flat strips to the second bottom flat strips. A plurality of second radii connect the second top flat strips to the second conduit sides and second bottom flat strips to the second conduit sides.

Abstract: The disclosed embodiments relate to a system that provides a polymer heat exchanger with internal microscale flow passages. The system includes a set of plates comprised of a polymer that includes internal microscale flow passages, which are configured to carry a liquid. The set of plates is organized into a stack, wherein consecutive plates in the stack are separated by fins to form intervening air passages. The system includes a liquid flow pathway, which flows from a liquid inlet, through the internal microscale flow passages in the stack of plates, to a liquid outlet. It also includes an airflow pathway, which flows from an airflow inlet, through the intervening air passages between the consecutive plates in the stack of plates, to an airflow outlet. The liquid flow pathway flows in a direction opposite to a direction of the airflow pathway to provide a counterflow design that optimizes heat transfer between the liquid flow pathway and the airflow pathway.

Abstract: A device is provided that includes a heat conductive structure; a heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the heat transfer structure to rotate above the heat transfer structure without making contact with the heat transfer structure so as to define a boundary layer between the heat conductive structure and heat transfer structure, wherein the heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the heat conductive structure includes small geometric turbulators.

Abstract: A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

Abstract: A plate for a heat exchanger between a first medium and a second medium, the plate being associated with a main plane of extension and a main longitudinal direction and including a first heat transfer surface, extending substantially in parallel to the main plane and arranged to be in contact with the first medium, generally flowing along the first surface in a first flow direction; and a second heat transfer surface, extending substantially in parallel to the main plane and arranged to be in contact with the second medium, generally flowing along the second surface in a second flow direction. The first surface includes protruding ridges defining at least two parallel and open-ended channels extending in the first flow direction. The second surface includes a plurality of protruding dimples arranged in the channels between neighbouring respective pairs of the ridges.

Abstract: Disclosed is a microchannel heat exchanger comprising a primary core including a first header and a second header and a secondary core including a first auxiliary header and a second auxiliary header, further comprising a first header interconnect extending between the first header and the first auxiliary header and having a first interconnect fluid passage extending therethrough; and a second header interconnect extending between the second auxiliary header and the second header and having a second interconnect fluid passage extending therethrough.

Abstract: This disclosure relates to a manufacturing method of a vapor chamber that includes the following steps. Form a containing space and a flow channel on a first cover. Place a second cover on the first cover, such that the first cover and the second cover together form a chamber at the containing space of the first cover and form a passage at the flow channel of the first cover. Enlarge part of the passage so as to create a circular passage portion and a flat passage portion in the passage. Insert a degassing tube into the circular passage portion of the passage. Draw gas from the chamber and fill working fluid into the chamber via the degassing tube. Seal a joint between the chamber and the flat passage portion by a resistance-welding process. Cut off parts of the first cover and the second cover that surround the passage.

Abstract: A cooling pipe system, including an evaporation pipe slantly arranged, a water inlet pipe, and a water removal assembly. An output end of the water inlet pipe is connected to an input end of the evaporation pipe, the water inlet pipe is connected to a three-way valve for introducing low molecular weight gas into the evaporation pipe. The water removal assembly is located below the evaporation pipe and includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline extending upwards and communicated with the input end of the evaporation pipe, a lower end of the first pipeline is connected to a molecular sieve for preventing water vapor from passing through, and the water removal assembly is configured for absorbing the water vapor.

Abstract: Cooling units are provided. The cooling units include a base having a housing with control components and a cooling tower attached to the base and having an inner flow path and an exterior surface. An air distribution system is attached to the cooling tower and includes an air distribution chamber defined between first and second enclosures, air dispensers are configured in the first enclosure, and a cover is disposed on an exterior surface of the second enclosure. The control components are configured to convey air through the base, the cooling tower, and the air distribution system to dispense air through the cool air dispenser and the warm air dispenser. A cooling unit water supply is arranged to provide cooling water to the air distribution system through the cooling tower and a water treatment module connected to the cooling unit water supply to treat the cooling water.

Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.

Abstract: A plate kind heat exchanger (1) has a plurality of stacked plates (2) forming flow paths for heat exchanging fluids there between, a first inlet channel being fluidly connected to inlets of a first set of flow paths, a second inlet channel being fluidly connected to inlets of a second set of flow paths, a first outlet channel being fluidly connected to outlets of the first set of flow paths, and a second outlet channel being fluidly connected to outlets of the second set of flow paths. The first inlet channel is provided with a stack (15) of rings (5) forming fluid passages towards the inlets of the first set of flow paths.

Abstract: A phase change thermal management device includes a casing, a plurality of inner walls and a phase change material. The casing defines an internal space. The inner walls are arranged in the internal space and crossed one another to form a plurality of accommodation cells. Two adjacent accommodation cells are communicated with each other through at least one opening on one of the inner walls. The phase change material is provided in at least portions of the accommodation cells.

Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.

Abstract: An outdoor unit for an air-conditioning apparatus, having a compressor, a top cover configured to cover an upper surface of the compressor, and a side cover configured to cover a side of the compressor and a side of the top cover, the side cover including a rectangular cutout portion formed in a part of an upper end of the side cover. The outdoor unit has a non-water-absorbent draining element disposed across from a central portion of the top cover to a bottom portion of the cutout portion, and tilts down from the central portion of the top cover toward the bottom portion of the cutout portion.

Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.

Abstract: An outdoor unit includes a housing having a front surface formed with an outlet and a back surface facing the front surface, an airflow flowing through the outlet; a substrate horizontally placed in the housing, an electric component being mounted on the substrate; and a heat dissipator including a plurality of fins, each of the fins having a heat dissipation surface, the heat dissipator dissipating, due to the airflow, heat generated by the electric component. The heat dissipation surface of each of the fins is parallel to the back surface or is angled at greater than 0 degrees and less than 90 degrees relative to the back surface in top view.

Abstract: A bendable vapor chamber structure includes a first plate body and a second plate body assembly. The first plate body has a first face and a second face on upper and lower sides. The second plate body assembly has multiple plate bodies and at least one bendable connection body. The bendable connection body is disposed between the plate bodies and connected with the plate bodies. The second plate body assembly is correspondingly mated with the first plate body to together define a receiving space. A first capillary structure is disposed in the receiving space. A working liquid is filled in the receiving space. By means of the bendable connection body, the vapor chamber is bendable.