Patents Examined by Heather Chon
  • Patent number: 5150922
    Abstract: The improved electrofusion joint and header for supplying hot water that perform satisfactorily at elevated temperatures as evidenced by high heat resistance, that exhibit good sealing property and that can be handled efficiently in mounting and various other operations have a crosslinked thermoplastic resin layer and at least one joining portion which comprises a non-crosslinked thermoplastic resin layer that is formed a as an integral part of said crosslinked thermoplastic resin layer in the area where it contacts a tubular member to be joined, and a heating electric wire provided either within or on the outer or inner surface of said non-crosslinked thermoplastic resin layer. Such electrofusion joint and header are applicable to any part of a piping system for supplying hot water and they will withstand use for a prolonged period.
    Type: Grant
    Filed: January 9, 1990
    Date of Patent: September 29, 1992
    Assignees: Osaka Gas Co., Ltd., Mitsui Petrochemical Ind., Ltd., Shinwa Sangyo Co., Ltd.
    Inventors: Akio Nakashiba, Hiroyuki Nishimura, Fumio Nagatani, Kazunori Mito, Toshio Shibabuchi, Mikio Nakaoka