Abstract: An apparatus for bending elongated members having different horizontal cross-sectional radiuses (e.g., different sizes of rebar) includes an extension portion, a first vise, and a second vise. The extension portion has a proximal region, a distal region, and a first aperture through the proximal region. The first vise has an aperture through the first vise. The second vise has a recessed region. The first aperture is sized to allow the extension portion to mount onto a vehicle hitch. The first vise and the second vise are located distally from the distal region of the extension portion. The aperture of the first vise is sized to accommodate an first elongated member having a horizontal cross-sectional radius (e.g., a first size of rebar). The recessed region of the second vise is sized to accommodate an second elongated member having a horizontal cross-sectional radius (e.g., a second size of rebar different from the first size of rebar).

Abstract: A portable surface cleaning apparatus has an air flow path extending from a dirty air inlet to a clean air outlet; a main body comprising a suction motor provided in the air flow path, the suction motor having a suction motor axis, an inlet end and an outlet end; a cyclone bin assembly provided in the air flow path, the cyclone bin assembly comprising a cyclone chamber and a dirt collection chamber, the cyclone chamber having a longitudinal cyclone axis, a cyclone air inlet and a cyclone air outlet provided at a lower end of the cyclone chamber and a dirt outlet provided at an upper end of the cyclone chamber; and, a handle.

Abstract: An engineered wood flooring removal apparatus for use with a buffer machine to remove bottom ply and adhesive layers of the wood flooring is provided. The apparatus effectively dislodges the bottom ply and adhesive layers with enhanced efficiency while minimizing the production of hazardous airborne particulates. The apparatus includes a base member rotatably mounted to the buffer machine, a support pad coupled to the base member, a disc member coupled to the support pad, and a plurality of cutting members coupled to the disc member. Each cutting member has an upper exposed head and a lower member that extends through the disc member, the support pad and the base member. The upper exposed heads of the cutting members contact the bottom ply and adhesive layers of the engineered wood flooring and dislodge the layers during a rotation of the base member when the buffer machine is enabled.

Abstract: A power lift assembly includes a lift stand. An actuating unit is detachably coupled to the lift stand and includes an actuating unit frame, a hydraulic unit carried by the actuating unit frame, a hydraulic piston extendable and retractable with respect to the hydraulic unit and an actuating unit arm positional between first and second positions on the actuating unit frame. The actuating unit arm operably engages the hydraulic unit to extend and retract the hydraulic piston at the first and second positions, respectively, of the actuating unit arm. A lift arm is pivotally carried by the actuating unit frame and releasably engages the lift stand. The hydraulic piston engages the lift arm.

Abstract: A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.

Abstract: The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably.

Abstract: A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.

Abstract: A polishing apparatus capable of stably controlling a pressure in a pressure chamber of a top ring is disclosed. The polishing apparatus includes: a rotatable polishing table for supporting a polishing pad; a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad; a pressure regulator configured to regulate a pressure of a gas in the pressure chamber; and a buffer tank provided between the pressure chamber and the pressure regulator. The pressure regulator includes a pressure-regulating valve, a pressure gauge configured to measure the pressure of the gas at a downstream side of the pressure-regulating valve, and a valve controller configured to control an operation of the pressure-regulating valve so as to minimize a difference between a target value of the pressure in the pressure chamber and a pressure value measured by the pressure gauge.

Abstract: A multi-functional cleaning system usable as both a vacuum cleaner and a steam cleaner includes (a) a body having a motor assembly for generating suction and a dust collector for collecting foreign matters, (b) a first cleaning head, such as a vacuum nozzle, detachably coupleable to the body and having an inlet for directing the foreign matters into the dust collector, and (c) a second cleaning head, such as a steam cleaning head, detachably coupleable to the body and having an outlet for directing steam onto a surface. Attaching the body to the first cleaning head forms a vacuum cleaner configuration. while attaching the body to the second cleaning head forms a steam cleaner configuration. Electrical wiring and connectors enable operation of the blower motor only in the vacuum cleaner configuration, and include protection against water ingress that can cause malfunctioning or create a safety hazard.

Abstract: The modular fixturing system of the present invention is modular, reusable and capable of significant customization, both in terms of system radius and system height, allowing it to be arranged and rearranged in numerous unique configurations. The system includes multiple modular stanchions having stanchion shafts and stanchion feet that removably attach to apertures in a table. Angle brackets attached to the modular stanchions support shelves. These shelves in turn provide support to work pieces during fabrication processes such as welding.

Abstract: Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m2/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 ?m or more and 20 ?m or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

Abstract: An engine hoisting assembly for supporting an engine comprises a ground supporting frame, a substantially upright member having a longitudinal axis, a boom operably connected to the upright member, lifting means to selectively move the boom up or down along upright member's longitudinal axis and engine connecting means to operably connect the boom to the engine. The boom is maintained at a substantial horizontal orientation when lifting means selectively moves boom up or down.

Abstract: A vibration assistant polishing module which comprises a polishing disk, a workpiece carrier tray, a linear guide way mechanism, a linkage, a motor and an adjustable eccentricity mechanism. The linear guide way mechanism includes a slide, a guide seat and a guide rod. The slide is pivot jointed with workpiece carrier tray and engaged in guide seat. The adjustable eccentricity mechanism comprises a base which is connected with a power shaft of the motor, and a pivot shaft of base and linkage is eccentric to the power shaft. The power shaft drives the base rotating and the linkage swinging eccentrically, and the slide moves linearly according to the limitation from guide seat, and a horizontal radial vibration and low frequency vibration is generated on the workpiece carrier tray, so the low frequency vibration is generated on the surface of the workpiece which is touched with the polishing disk.

Abstract: An operating handle assembly used with a pump to constitute a hand air pump is disclosed, including a handgrip unit having a handgrip and a pivot, and a pumping rod unit pivotally connected to the handgrip unit and turnable about a pivot center relative to the handgrip unit. The pumping rod unit includes a pivot pivotally located at the pivot of the handgrip, and a piston rod coupled to a piston hole of the pump and axially movable relative to the pump between a received position and a first extended position and turnable about the pivot center within a predetermined angle between the first extended position and a second extended position when the piston rod reaches the first extended position.

Abstract: A log section splitting assistance apparatus comprises a base with radially arranged fingers, each of which is joined to the base at an axle, each axle having an axis of rotation which is horizontally oriented and tangential to the base. The fingers extend and retract through use of a lever arm. A user places a log section on the base, between the fingers. The user engages the lever arm to hold the log section on the base with the fingers. The user splits the log section. The fingers retain the split pieces on the base in a cluster until the pieces can be removed. The base and fingers may be rotated by foot, allowing the log section to be conveniently rotated as it is split. The user avoids bending; the splitting process proceeds quickly. The apparatus is robust and easy to use.

Abstract: A tool which holds one or more logs steady, in place, and secured to a chopping block while all logs are spilt to the desired size with an axe or splitting maul. This prevents the logs from falling over, saving time, energy, and strain on the user's back.

Abstract: Apparatus polishing one side of a wafer to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth is provided. In the apparatus of the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer. The contact angle of the polishing cloth (S1) is measured; the rotation speed of the head and the surface plate is determined based on the measured contact angle of the polishing cloth (S4). One side of the wafer is polished by rotating the head and the surface plate at the determined rotation speed (S5, S6).

Abstract: Apparatus for lifting and supporting an item above a floor includes a frame and a pair of upright telescoping post assemblies having two opposite ends and which are positionable on opposite sides of the item to be lifted. A pair of guide posts are arranged as to extend substantially vertically of the frame and adjacent the post assemblies. A carriage assembly is mounted upon each post assembly for cooperating between the item and an adjacent guide post, and jacks are utilized for moving the ends of the post assemblies apart so that by positioning the carriage assemblies in cooperating relationship with the item and moving the ends of the post assemblies apart, the item is lifted by a corresponding amount and the carriage assemblies are guided along the guide posts.

Abstract: Provided is a glass base material hanging mechanism that, when hanging a starting member or a glass base material, can tightly (solidly) connect the hanging shaft tube and the hanging component and can vertically align the hanging component and the center of the glass base material.

Abstract: A vacuum cleaner having a base, an agitator cleaner, an agitator, and a motor. The agitator extends in a longitudinal direction and is mounted to the base to rotate about a longitudinal axis of the agitator and to move between a first position in which the agitator is spaced from the agitator cleaner and a second position in which the agitator engages the agitator cleaner. The motor is operatively associated with the base and configured to rotate the agitator about the longitudinal axis of the agitator while the agitator is in the second position to remove debris from the agitator by interaction between the agitator and the agitator cleaner.