Abstract: A substrate includes a substrate body, a flux coating portion which is coated with flux promoting solder fluidity on a surface of the substrate body, a conduction portion which is disposed on the surface of the substrate body to be separated from the flux coating portion and is conductive, and a silk portion which is disposed between the flux coating portion and the conduction portion on the surface of the substrate body and is provided by silk printing.

Abstract: An electrical box includes a front surface having an opening providing access to a hollow interior of the electrical box, at least one sidewall extending rearwardly from the front surface to form the hollow interior, and a seal disposed on an exterior surface of the at least one sidewall. The seal has a triangular cross-sectional shape including a thin end configured to first enter an opening of a building structure receiving the electrical box therein. A tapered surface of the seal is compressed as the electrical box is received into the opening in the building structure to provide a seal around an exterior surface of the at least one sidewall of the electrical box.

Abstract: A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically conductive TVs penetrate through the silicon oxide interposer. The electrically interconnected RDLs are disposed over the first surface of the silicon oxide interposer, and are electrically coupled or connected to a number of the conductive TVs.

Abstract: A display apparatus may include a substrate, a component, a connection wire, a first conductive wire, and a second conductive wire. The substrate may include a first portion, a second portion, and a bent portion. The first portion may be connected through the bent portion to the second portion. The component may be positioned on at least one of the first portion and the bent portion. The connection wire may be positioned on at least the bent portion and electrically connected to the component. The first conductive wire may be formed of a first material and may end at an edge of the substrate. The second conductive wire may be formed of the first material, may be aligned with and electrically insulated from the first conductive wire, and may be electrically connected to the connection wire.

Abstract: A power module substrate of the present invention includes a ceramic substrate and a circuit layer having a circuit pattern. In an interface between the circuit layer and the ceramic substrate, a Cu—Sn layer and a Ti-containing layer are laminated in this order from the ceramic substrate side. In a cross-sectional shape of an end portion of the circuit pattern of the circuit layer, an angle ? formed between a surface of the ceramic substrate and an end face of the Cu—Sn layer is set in a range equal to or greater than 80° and equal to or smaller than 100°, and a maximum protrusion length L of the Cu—Sn layer or the Ti-containing layer from an end face of the circuit layer is set in a range equal to or greater than 2?m and equal to or smaller than 15 ?m.

Abstract: An electrical box includes a front surface having an opening providing access to a hollow interior of the electrical box, at least one sidewall extending rearwardly from the front surface to form the hollow interior, and a seal disposed on an exterior surface of the at least one sidewall. The seal has a triangular cross-sectional shape including a thin end configured to first enter an opening of a building structure receiving the electrical box therein. A tapered surface of the seal is compressed as the electrical box is received into the opening in the building structure to provide a seal around an exterior surface of the at least one sidewall of the electrical box.

Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.

Abstract: A voice-activated electronic device including a first portion with a first internal surface having a first attachment structure, and a second portion with a second internal surface having a second attachment structure. The first and second internal surfaces have compatible shapes that permit the first and second portions to be moved from a separated position to a joined position, where when the first portion and the second portion are in the joined position the first and second internal surfaces form a nested arrangement. The first and second attachment structures form a secure but separable connection to one another when the first and second portions are in the joined position. The first and second portions are configured to be joined securely and separated through manual human manipulation of one or both of the first portion and the second portion to move the first and second portions between separated and joined positions.

Abstract: Two shot knuckles include a first shot component and a second shot component. Both shot components are composed of different dielectric materials, where the first shot is composed of a relatively high strength structural material and the second is composed of a cosmetic material. The first shot component can physically couple two conductive sections together by interfacing with a coupling structure of that section. The first shot component includes second shot retaining regions and a cosmetic region. The second shot component occupies the cosmetic region and anchors itself to the first shot component using the second shot retaining regions. The second shot may be the only part of the two-shot knuckle visible to a user of an electronic device and can exhibit any desired color.

Abstract: This is directed to systems and methods for coupling sections of an electronic device together. Sections of an electronic device can be coupled together via “knuckles.” The particular shape and structure of the knuckles can be based on various design considerations. For example, in some embodiments each section can function as an individual antenna. In this case, the knuckles can be designed in order to provide electrical isolation between the sections, thus allowing proper operation of the antennas. For example, the knuckles can be formed from a dielectric material, etc. As another design example, the knuckles can be designed in order to provide increased strength in areas of high strain, and/or to counteract torsional twisting in areas of high impact. As yet another design example, the knuckle can be designed in a manner that is aesthetically pleasing or which otherwise meets cosmetic requirements.

Abstract: The present application discloses a display apparatus comprising a flexible display panel capable of undergoing deformation between a flat configuration in which the flexible display panel is substantially flat and a curved configuration in which the flexible display panel is curved; and a first arm section and a second arm section for deforming the flexible display panel between the flat configuration and the curved configuration.

Abstract: A protective encasement for an electronic device is described. The encasement includes a top member having a frame, a raised ridge extending down from an inner surface of the frame, and a seal member attached to the inside edge of the frame. The encasement further includes a bottom member having an inner surface and an outer surface, an outer perimeter extending from the inner surface and defining an outer wall, and a second seal member in contact with the outer wall to mate with the protrusion of the top member when the top member is mated with the bottom member.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: A sensor housing for a radar sensor for a vehicle comprising a housing and a printed circuit board. The housing has a venting duct for the venting of the sensor housing, as well as a press-fit guide for the reception of a positioning aid for the printed circuit board. The venting duct and the press-fit guide form a common duct.

Abstract: A server includes an adapter device, multiple storage modules and multiple controllers. The adapter device includes a base circuit board having opposite first and second surfaces, multiple first connectors disposed on the first surface along a first direction and connected to the base circuit board, and multiple second connectors disposed on the second surface along the first direction in pairs, each of which is arranged along a second direction, is connected to the base circuit board and is disposed between adjacent two of the first connectors. Each of the storage modules is connected to a corresponding first connector. Each of the controllers is connected to a corresponding second connector.

Abstract: A conductive path includes: a first conductor in which a terminal end portion serves as a first connection portion; a second conductor in which a second connection portion at a terminal end portion is coaxially fixed to the first connection portion; a support member that is more rigid than the first and second conductors, and is disposed so as to extend along a fixed portion between the first and second connection portions; and a heat-shrinkable tube (holding member) that integrates the support member with the first and second conductors while enveloping the support member. Even when an external force acts on the first and second conductors so as to skew the axes of the two conductors, the support member and the heat-shrinkable tube keep the two conductors in the coaxial state.

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Abstract: A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

Abstract: A job-site electric apparatus in one aspect the present disclosure includes a housing, an operation device, a terminal, a separator, a coupling device, and a sealing portion. The separator is configured to separate the housing into a first area and a second area, and includes a through hole that allows communication between the first area and the second area. The first area includes the operation device. The second area includes the terminal. The coupling device passes through the through hole and electrically couple the terminal to the operation device. The sealing portion seals the through hole through which the coupling device passes.

Abstract: Some features pertain to a package substrate that includes at least one dielectric layer, an inductor in the at least one dielectric layer, a first terminal coupled to the inductor, a second terminal coupled to the inductor, and a third terminal coupled to the inductor. The first terminal is configured to be a first port for the inductor. The second terminal is configured to be a second port for the inductor. The third terminal is a dummy terminal. In some implementations, the package substrate includes a solder resist layer over the dielectric layer, where the solder resist layer covers the third terminal. In some implementations, the package substrate includes a solder interconnect over the third terminal, such that the solder resist layer is between the third terminal and the solder interconnect. In some implementations, the package substrate is coupled to a die comprising a plurality of switches.