Abstract: Devices and techniques for NAND temperature data management are disclosed herein. A command to write data to a NAND component in the NAND device is received at a NAND controller of the NAND device. A temperature corresponding to the NAND component is obtained in response to receiving the command. The command is then executed to write data to the NAND component and to write a representation of the temperature. The data is written to a user portion and the representation of the temperature is written to a management portion that is accessible only to the controller and segregated from the user portion.

Abstract: A memory device including a memory array operatively coupled to an array data bus and a deserializer circuit operatively coupled with the array data bus. The deserializer circuit includes a first ring counter including a first set of flip-flops to sequentially output a set of rising edge clock signals based on a reference clock input and a second ring counter portion including a second set of flip-flop circuits to sequentially output a set of falling edge clock signals based on the reference clock input. A rising data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a rising data portion from a respective latch circuit in response to a rising edge clock signal. A falling data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a falling data portion from a respective latch circuit in response to a falling edge clock signal.

Abstract: Aspects of the disclosure provide a memory device. For example, the memory device can include a memory array, a bitline and a buffer. The memory array can include a plurality of memory strings. The memory strings can be divided into a first memory string group and a second memory string group. The bitline can include a first bitline segment coupled to the first memory string group and a second bitline segment coupled to the second memory string group. The first bitline segment can be disposed between the first memory string group and the buffer and be connected to the buffer through a first conduction path. The second bitline segment can be disposed between the second memory string group and the buffer and be connected to the buffer through a second conduction path.

Abstract: The present technology includes a memory device. The memory device includes memory cells, page buffers configured to store sensed data obtained from the memory cells, a current sensing circuit configured to compare a sensed voltage generated according to the sensed data and a reference voltage generated according to an allowable fail bit code, and output a pass signal or a fail signal according to a comparison result, and a fail bit manager configured to increase an allowable number of fail bits included in the allowable fail bit code until the pass signal is output from the current sensing circuit, change the allowable fail bit code according to the allowable number of fail bits, and provide the allowable fail bit code to the current sensing circuit.

Abstract: A data receiving device of a memory device comprises a first pre-amplifier configured to receive previous data, a first reference voltage, and input data, and to output differential signals by comparing the input data with the first reference voltage in response to a clock, when the first pre-amplifier is selected in response to the previous data, a second pre-amplifier configured to receive inverted previous data, a second reference voltage, different from the first reference voltage, and the input data, and outputting a common signal in response to the clock, when the second pre-amplifier is unselected in response to the previous data; and an amplifier configured to receive the differential signals and the common signal, and to latch the input data by amplifying the differential signals.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines and arranged in strings and configured to retain a threshold voltage corresponding to one of a plurality of memory states. A control circuit is coupled to the plurality of word lines and strings and is configured to erase the memory cells using a stripe erase operation in response to determining a cycle count is less than a predetermined cycle count maximum threshold. The control circuit is also configured to perform a dummy cycle operation in response to determining the cycle count is not less than the predetermined cycle count maximum threshold.

Abstract: A memory device includes a memory cell array, a page buffer circuit, and a counting circuit. The page buffer circuit includes a first and second page buffer columns connected to the memory cell array. The first page buffer column includes a first page buffer unit and the second page buffer column includes a second page buffer unit in a first stage. The first page buffer unit performs a first sensing operation in response to a first sensing signal, and the second page buffer unit performs a second sensing operation in response to a second sensing signal. The counting circuit counts a first number of memory cells included in a first threshold voltage region from a result of the first sensing operation, and counts a second number of memory cells included in a second threshold voltage region from a result of the second sensing operation.

Abstract: Methods, systems, and devices for voltage adjustment of memory dies based on weighted feedback are described. A supply voltage may be measured at various areas of a memory die, weights may be applied to the measured voltages based on the area from which the particular voltage was measured. The supply voltage may be adjusted based on the weighted signals. The signals may be weighted using digital or analog techniques. Different durations of time in which oscillations from an oscillator circuit are counted may provide weighting for a signal. Weights applied to the signals may be dynamically adjusted, which may allow the weights to be tuned or changed based on changes to operating conditions of the memory dies.

Abstract: A request to perform a read operation on a memory device is received. The memory device includes a first group of memory cells. The first group of memory cells represents a first sequence of bits based on a first sequence of charge levels formed by the first group of memory cells. The read operation is performed by obtaining a first read signal for a first memory cell and a second read signal for a second memory cell of the first group of memory cells. A first rule logic is applied to the first read signal to generate a first updated signal and a second rule logic is applied to the second read signal to generate a second updated signal. Logic functions are applied to the first and second updated signals to generate an output signal indicating the first sequence of bits stored by the first group of memory cells.

Abstract: This disclosure proposes a method to save P/E cycling information inside NAND by using 2-byte column in programmable selective devices (e.g., SGD). The proposed method is a one-way programming method, and does not perform an erase operation within the 2-byte column. The proposed methods described herein can reduce the burden of relying upon controller SRAM/DRAM. Additionally, by storing the P/E cycling information in NAND, the P/E cycling is not lost due to a power loss event. At least one application advantageous for using NAND to store P/E cycling information includes wear leveling.

Abstract: Methods, systems, and devices for imprint recovery for memory cells are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Abstract: Methods, systems, and devices for modifying memory bank operating parameters are described. Operating parameter(s) may be individually adjusted for memory banks or memory bank groups within a memory system based on trimming information. The local trimming information for a memory bank or memory bank group may be stored in a fuse set that also stores repair information for the particular memory bank or in a fuse set that also stores repair information for a memory bank in the particular memory bank group. The local trimming information may be applied to operating parameters for particular memory banks or memory bank groups relative to or instead of global adjustments applied to operating parameters of multiple or all of the memory banks in the memory system.

Abstract: A semiconductor device includes a plurality of memory cells connected to a match line; a word line driver connected to a word line; a valid cell configured to store a valid bit indicating valid or invalid of an entry; a first precharge circuit connected to one end of the match line and configured to precharge the match line to a high level; and a second precharge circuit connected to the other end of the match line and configured to precharge the match line to a high level. The plurality of memory cells are arranged between the first precharge circuit and the second precharge circuit, and the second precharge circuit is arranged between the word line driver and the plurality of memory cells.

Abstract: The present disclosure is directed to arranging user data memory cells and test memory cells in a configurable memory array that can perform both differential and single ended read operations during memory start-up and normal memory use, respectively. Different arrangements of the user data memory cells and the test memory cells in the memory array result in increased effectiveness of memory array, in terms of area optimization, memory read accuracy and encryption for data security.

Abstract: Dual-precision analog memory cells and arrays are provided. In some embodiments, a memory cell, comprises a non-volatile memory element having an input terminal and at least one output terminal; and a volatile memory element having a plurality of input terminals and an output terminal, wherein the output terminal of the volatile memory element is coupled to the input terminal of the non-volatile memory element, and wherein the volatile memory element comprises: a first transistor coupled between a first supply and a common node, and a second transistor coupled between a second supply and the common node; wherein the common node is coupled to the output terminal of the volatile memory element; and wherein gates of the first and second transistors are coupled to respective ones of the plurality of input terminals of the volatile memory element.

Abstract: A memory device and a glitch prevention method thereof are provided. The memory device includes a data strobe signal input circuitry, a transfer signal generating circuitry, a data alignment circuitry, and a blocking circuitry. The data strobe signal input circuitry is configured to input a data strobe signal. The transfer signal generating circuitry is configured to generate a transfer signal with pulses in synchronization with rising edges or falling edges of the data strobe signal in response to a transfer command. The data alignment circuitry is configured to align a data signal to be transferred in response to the generated transfer signal. The blocking circuitry is configured to block an input of the data strobe signal over a postamble timing of the data strobe signal according to a number of bursts counted in each time of data transfer.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second IO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: A semiconductor device of an embodiment includes a seed generator circuit configured to generate a seed from inputted data by using first random number sequence data generated by an XorShift circuit; and a random number generator circuit configured to receive the seed as input to generate second random number sequence data by a second XorShift circuit.

Abstract: In some embodiments of the method, patterning the opening includes: projecting a radiation beam toward the second dielectric layer, the radiation beam having a pattern of the opening. In some embodiments of the method, the single-patterning photolithography process is an extreme ultraviolet (EUV) lithography process. In some embodiments of the method, filling the opening with the conductive material includes: plating the conductive material in the opening; and planarizing the conductive material and the second dielectric layer to form the first metal line from remaining portions of the conductive material, top surfaces of the first metal line and the second dielectric layer being planar after the planarizing.

Abstract: A first programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. In response to first programming pulse, causing a program verify operation to be performed to determine a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node. A determination is made that the measured threshold voltage of the memory cell satisfies a condition and the measured threshold voltage stored in the sensing node is identified. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell.