Abstract: Techniques for solar cell electrical characterization are provided. In one aspect, a solar testing device is provided. The device includes a solar simulator; and a continuous neutral density filter in front of the solar simulator having regions of varying light attenuation levels ranging from transparent to opaque, the continuous neutral density filter having an area sufficiently large to filter all light generated by the solar simulator, and wherein a position of the continuous neutral density filter relative to the solar simulator is variable so as to control a light intensity produced by the device. A solar cell electrical characterization system and a method for performing a solar cell electrical characterization are also provided.

Abstract: A sensor is described for detecting the presence of a magnetic nanoparticle (N). The sensor is arranged on a support (1), on which a plurality of non-magnetic contacts (Iin, GND, V1, V2) electrically conductively connected to the sensor is disposed. The contacts are adapted to be connected to means for measuring magnetoresistance. The sensor includes a planar ferromagnetic nanostructure (3), comprising a detection area (31) shaped as a strip bent to form a corner. The detection area is adapted to selectively assume, as a response to an applied magnetic field, a first spin configuration comprising a transverse “head-to-head” domain wall (TW), and a second spin configuration, wherein such domain wall (TW) is absent. The transition from the first configuration to the second configuration is affected by the proximity of a magnetic nanoparticle (N) to the detection area.

Abstract: A proximity sensor interface device (PSID) for determining if a proximity sensor is in an acceptable position with respect to a target device is described. The PSID includes a frequency generator, a processing device, a memory associated with the processing device, a display, and an RC circuit. The processing device is programmed to route a signal generated by the frequency generator through the proximity sensor and the RC circuit for a prescribed period of time and the processing device is programmed to measure a discharge time of the RC circuit. The processing device is further programmed to cause the display to provide an indication of whether the relative position of the proximity sensor and the target device are within prescribed tolerances, based on the discharge time.

Abstract: A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.

Abstract: A test device for testing a printed circuit board (PCB) includes a base and a measuring device. The measuring device includes a testing pin and is capable of measuring any desired point of the PCB on condition that the pin makes contact with the point at an included angle between the pin and a back surface of the PCB which is larger than a predetermined angle. The distance between the base and the PCB satisfies: H>L tan ?, where H is the vertical distance between the PCB and the base, L is the maximum length of an orthogonal projection of the pin on the PCB when the pin is contacting the point, and ? is the predetermined angle.

Abstract: A fault signal indicates a single-pole or a double-pole fault in a three-phase electrical power grid which occurred during a present electric oscillation in the electrical power grid. The method assures that single-pole or double-pole faults occurring during oscillation can be detected with high reliability in that a symmetry signal is produced during the oscillation, which indicates whether the oscillation is symmetrical or unsymmetrical, and the phases of the electrical power grid are checked for an existing fault, wherein the symmetry signal is used for carrying out the check. The fault signal is produced if a fault was detected during the check. A protective device has an accordingly equipped control unit.

Abstract: A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Abstract: The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via.

Abstract: A system for measuring leakage resistance between a high voltage (HV) system of a vehicle and a vehicle chassis includes an emulated inductance that is connected between the HV system and the vehicle chassis and that has an inductive reactance that substantially cancels a capacitive reactance between the HV system and the vehicle chassis. A signal source outputs one of an AC current signal and an AC voltage signal between the HV system and the vehicle chassis. A sensor measures one of an AC current response to the AC voltage signal between the HV system and the vehicle chassis and an AC voltage response to the AC current signal between the HV system and the vehicle chassis.

Abstract: A resistance measuring apparatus which includes a variable voltage source, a signal display circuit, a bridge consisting of a first standard resistor, a second standard resistor, an adjustable resistor and the unknown resistor, a bridge balance display circuit and a dynamic voltage display circuit alternatively connected within the bridge. The resistance measuring apparatus is adapted to measure static resistance and dynamic resistance variation of an unknown resistor in the case of external environment having changed dramatically.

Abstract: A metering apparatus for liquids and a method for metering liquids which facilitate the operation of a further metering after detaching the pipette point or syringe.

Abstract: A method and a device for carrying out the method are disclosed in order to aid in the search for faulty photovoltaic modules. In a photovoltaic system comprising multiple PV units electrically connected in parallel, each PV unit is assigned its own fixed current sensor. Furthermore, each PV unit can be removed from the parallel circuit by a switching device.

Abstract: In A method for measuring a dimensionless coupling constant of a magnetic structure includes the following steps. A step of applying an external vertical magnetic field is performed for enabling magnetic moments of a RE-TM (Rare Earth-Transition metal) alloy magnetic layer of the magnetic structure to be vertical and saturated. A step of measuring a compensation temperature is performed when the sum of the magnetization of the RE-TM alloy magnetic layer is zero. A step of applying an external parallel magnetic field to the RE-TM alloy magnetic layer is performed. A step of adjusting the temperature of the magnetic structure to the compensation temperature and measuring a hysteresis loop of the magnetic structure under the external parallel magnetic field is performed, wherein the inverse of the slope of hysteresis loop is a dimensionless coupling constant.

Abstract: A sensor assembly includes an electrical conductor, at least one of a voltage sensor and a current sensor disposed about the electrical conductor, and a first insulator molded about the electrical conductor. The first insulator includes a plurality of structures structured to maintain concentricity between the electrical conductor and the at least one of the voltage sensor and the current sensor. A second insulator is molded about the first insulator and the at least one of the voltage sensor and the current sensor.