Patents Examined by Hoanganh Le
  • Patent number: 9819094
    Abstract: A lensed antenna system is provided. The lensed antenna system includes a first column of radiating elements having a first longitudinal axis and a first azimuth angle, and, optionally, a second column of radiating elements having a second longitudinal axis and a second azimuth angle, and a radio frequency lens. The radio frequency lens has a third longitudinal axis. The radio frequency lens is disposed such that the longitudinal axes of the first and second columns of radiating elements are aligned with the longitudinal axis of the radio frequency lens, and such that the azimuth angles of the beams produced by the columns of radiating elements are directed at the radio frequency lens. The multiple beam antenna system further includes a radome housing the columns of radiating elements and the radio frequency lens. There may be more or fewer than two columns of radiating elements.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: November 14, 2017
    Assignees: CommScope, Inc. of North Carolina, Matsing Pte. Ltd.
    Inventors: Serguei Matitsine, Igor E. Timofeev, Kevin E. Linehan
  • Patent number: 9698483
    Abstract: Provided are an aerial device applied to an electronic apparatus and corresponding method for setting the aerial device that include a first aerial unit located at the first position of the electronic apparatus, having a first communication bandwidth, and radiating a first aerial signal in a first polarization direction; and a second aerial unit located at the second position adjacent to the first position of the electronic apparatus, having a second communication bandwidth, and irradiating a second aerial signal in a second polarization direction orthogonal to the first polarization direction. In the present invention, the polarization directions of aerial signals of adjacent aerial units are orthogonalized to improve the isolation between adjacent aerial units, thus enabling different aerial units to be arranged adjacent to one another so as to reduce the footprint of an aerial device.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: July 4, 2017
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventors: Jin Liu, Jinqiang Lin
  • Patent number: 9698470
    Abstract: A wireless terminal is disclosed. The wireless terminal includes a first antenna, a second antenna, a printed circuit board, a bracket, and a resonator, where the first antenna is located at one side of the printed circuit board, the second antenna is located at another side of the printed circuit board, the printed circuit board functions as a metal ground of the first antenna and the second antenna, the resonator is located on the bracket, a ground point of the resonator is located on the printed circuit board, and a clearance exists between the resonator and the printed circuit board. Not only does the wireless terminal improve isolation between multiple antennas, but also the resonator can better radiate energy of the antennas because a clearance exists between the resonator and the PCB.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: July 4, 2017
    Assignee: Huawei Device Co., Ltd.
    Inventors: Liang Zhao, Hanyang Wang, Qing Liu, Huiliang Xu, Yi Fan, Yao Lan, Zhongying Long, Dongxing Tu
  • Patent number: 9698474
    Abstract: The invention concerns a helical antenna comprising a shape of revolution and a plurality of radiating strands helically wound around the shape of revolution, characterized in that each radiating strand is defined by a repetition of a fractal pattern comprising segments formed by a sinusoidal curve.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 4, 2017
    Assignees: Centre National de la Recherche Scientifique (CNRS), CENTRE NATIONAL D'ETUDES SPATIALES
    Inventors: Hervé Aubert, Hubert Diez, Daniel Belot, Alexandru Takacs
  • Patent number: 9692475
    Abstract: An attachment for an electronic communications device including a conducting element that is coated on one side with layers of material and securely affixed to a nonconducting substrate such that the overall dimensions and thickness of the attachment are sufficiently small that it may be attached to a surface of an electronic communications device whilst allowing the use of any protective casing preferred by the user.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: June 27, 2017
    Assignee: CLASSIC PROMOTIONS PTY LTD.
    Inventor: Aaron Leibovich
  • Patent number: 9692107
    Abstract: An antenna structure includes a first carrier, a second carrier and an antenna main body. The antenna main body includes a main antenna and a sub antenna. The main antenna is printed on the first carrier, the sub antenna is printed on the second carrier. The present invention also provides a wireless communication device using the antenna structure.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: June 27, 2017
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Xiao-Kai Liu, Chang-Hai Gu, Yao-Yao Qin, Jing-Hai Zheng
  • Patent number: 9685995
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: June 20, 2017
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand Konanur, Eric Hong
  • Patent number: 9673510
    Abstract: An antenna structure includes a first frame, a feed end, at least one ground end, a first radiator, a first extending section, a second extending section, a coupling section, and a second radiator. The first radiator is coupled to the feed end and is parallel to the first frame. The first extending section is coupled between the feed end and first frame. The second extending section is coupled between the feed end and the first frame. The coupling section is coupled to the first frame. The second radiator is coupled between the at least one ground end and the first frame.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: June 6, 2017
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Yen-Hui Lin
  • Patent number: 9673511
    Abstract: An antenna element forms a ring slot antenna comprising a first slot and second slot. The antenna element is located on a first surface of a conductive chassis that encases a body or a volume for wireless communication signals to be received or transmitted. A coupling component is located on an opposite side of the conductive chassis and behind the antenna element. The coupling component facilitates a coupling between a communication component and the antenna element as a function of the orientation and geometric shape of the coupling component to facilitate different resonant frequencies via the first and second slots of the antenna element.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: June 6, 2017
    Assignee: Intel Corporation
    Inventors: Kwan Ho Lee, Songnan Yang, Anand Konanur, Ulun Karacaoglu
  • Patent number: 9666933
    Abstract: A wireless local area network (“WLAN”) antenna array (“WLANAA”) is disclosed. The WLANAA may include a circular housing having a plurality of radial sectors and a plurality of primary antenna elements. Each individual primary antenna element of the plurality of primary antenna elements may be positioned within an individual radial sector of the plurality of radial sectors.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: May 30, 2017
    Assignee: Xirrus, Inc.
    Inventor: Abraham Hartenstein
  • Patent number: 9666951
    Abstract: A printed circuit board antenna includes a printed circuit board and a feedpoint that is disposed on the printed circuit board. A copper coating is disposed on the printed circuit board. A split is disposed on the copper coating on the printed circuit board. The split is connected to a board edge of the printed circuit board. A slot perpendicular to the split is disposed on the copper coating on the printed circuit board. The slot is connected to the split. The copper coating at two sides of the split forms a first antenna and a second antenna. The feedpoint is configured to, together with the first antenna and the second antenna, form a first resonance loop and a second resonance loop. Resonance frequencies of the first resonance loop and the second resonance loop are different.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: May 30, 2017
    Assignee: Huawei Device Co., Ltd.
    Inventor: Hanyang Wang
  • Patent number: 9660331
    Abstract: An on board diagnostic (OBD) device having a radio modem is provided. An antenna of the radio modem is connected to a printed circuit board (PCB) housed within a plastic housing, where the PCB has a ground plane which is extended by a conductive extension. The conductive extension lengthens an effective length of a counterpoise of the antenna without necessitating an increase in size of the OBD device/plastic housing, resulting in maintaining a small form factor for the OBD device, while increasing antenna efficiency and/or bandwidth.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: May 23, 2017
    Assignee: Novatel Wireless, Inc.
    Inventors: William Babbitt, Kevin Clancy, Pedro Gutierrez
  • Patent number: 9653409
    Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 16, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Dinhphuoc Vu Hoang
  • Patent number: 9643841
    Abstract: An antenna system includes an elongated conductive plane and an elongated dielectric layer that is disposed on the conductive plane. An elongated graphene nanoribbon is disposed along an axis and is coupled to the dielectric layer at a graphene/dielectric interface. A feeding mechanism is coupled to the conductive plane. The feeding mechanism is configured to accept a signal that excites surface plasmon polariton waves at the graphene/dielectric interface. In a method of making a surface plasmon polariton wave antenna, an elongated conductive plane is formed. An elongated dielectric layer is applied on a surface of the conductive plane. An elongated graphene nanoribbon is applied to the dielectric layer. A signal source is coupled to the elongated conductive plane.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: May 9, 2017
    Assignee: Georgia Tech Research Corporation
    Inventors: Ian F. Akyildiz, Josep Miquel Jornet
  • Patent number: 9634730
    Abstract: A power transmission system produces a magnetic field at a source that is wirelessly coupled to a receiver. Both the source and receiver are capacitively coupled LC circuits, driven at or near resonance.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: April 25, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Nigel P. Cook, Paul Meier, Lukas Sieber, Marc Secall, Hanspeter Widmer
  • Patent number: 9634399
    Abstract: An antenna system can impart orbital angular momentum (OAM) to an incident electromagnetic (EM) signal from a feed antenna. The antenna system can include a partial OAM antenna with a reflective surface that has only part of a full OAM shaped surface. The antenna system can thus reflect the incident EM signal as a partial OAM beam rather than a full OAM beam.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 25, 2017
    Assignee: L-3 Communications Corp.
    Inventors: Johnny M. Harris, Osama S. Haddadin, Zachary C. Bagley, Brandon G. Walsh, Jonathan C. Landon
  • Patent number: 9626618
    Abstract: The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: April 18, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Konami Izumi
  • Patent number: 9627774
    Abstract: Embodiments of the present application disclose an antenna device and system. The antenna device includes: an antenna array, configured to radiate or receive an electromagnetic wave signal; a feed network, configured to connect the antenna array and a signal multiplexer; at least one signal multiplexer, configured to divide one path of signal from the feed network into at least two paths of signal, or combine at least two paths of signal to one path of signal and transmit the one path of signal to the feed network; and at least two interface modules connected to a passive module or an active module, is configured to receive a signal sent from the passive module or the active module, or send a signal to the passive module or the active module. The present application can be used for sharing the antenna array and other parts in the active and passive antenna systems.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: April 18, 2017
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tao Pu, Pinghua He, Mengda Mao
  • Patent number: 9627745
    Abstract: An antenna device attached to a vehicle includes a base to which an antenna is fixed, a cover that is attached to the base, and a flexible pad that covers and supports an edge of the base, contacts an edge of the cover, and is located between the vehicle and the cover. A protrusion is provided on a surface of the pad on the cover side, and includes a body portion formed along the edge of the base, and a plurality of rib-like portions extending from the body portion to an edge of the pad.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: April 18, 2017
    Assignee: HARADA INDUSTRY CO., LTD.
    Inventors: Makoto Hayashi, Toshiro Yokoyama
  • Patent number: 9614592
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: April 4, 2017
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong