Abstract: The present disclosure provides a surface protective film which is used in a process of fabricating an encapsulation layer for an organic light-emitting diode, and makes it possible to prevent bubbles from being generated in the protective film or the surface smoothness of the protective film from being degraded, due to solvent volatilization from the protective film. Specifically, the present disclosure provides a surface protective film including an adhesive layer provided on one surface of a substrate layer, wherein the adhesive layer includes a cured product of an adhesive composition including: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a photoinitiator; and a photoreactive siloxane additive, the adhesive composition being solvent-free.

Abstract: A thermoplastic resin composition including 100 parts by weight of a base resin including 0.5 to 45% by weight of a graft copolymer (A-1) including acrylate rubber having an average particle diameter of 50 to 150 nm, an aromatic vinyl compound, and a vinyl cyanide compound, 20 to 80% by weight of a graft copolymer (A-2) including acrylate rubber having an average particle diameter of 151 to 600 nm, an aromatic vinyl compound, and a vinyl cyanide compound, and 10 to 45% by weight of an ?-methylstyrene-based copolymer (B) having a weight average molecular weight of 60,000 to 180,000 g/mol; and 0.5 to 10 parts by weight of an ultra-high molecular weight copolymer (C) having a weight average molecular weight of 1,000,000 to 12,000,000 g/mol. A method of preparing the thermoplastic resin composition and a molded article including the thermoplastic resin composition are also disclosed.