Abstract: A light emitting device of the invention includes an electron transporting layer, a hole transporting layer provided mutually facing the electron transporting layer with a distance between the hole transporting layer and the electron transporting layer, a phosphor layer having a layer of a plurality of semiconductor fine particles sandwiched between the electron transporting layer and the hole transporting layer, a first electrode provided facing the electron transporting layer and connected electrically, and a second electrode provided facing the hole transporting layer and connected electrically: in which the semiconductor fine particles composing the phosphor layer have a p-type part and an n-type part inside of the particles and have a pn-junction in the interface of the p-type part and the n-type part and are arranged in a manner that the p type part is partially brought into contact with the hole transporting layer and at the same time, the n type part is partially brought into contact with the electron
Abstract: A method of fabricating a tri-gate semiconductor device comprising a semiconductor body having an upper surface and side surfaces and a metal gate that has an approximately equal thickness on the upper and side surfaces. Embodiments of a tri-gate device with conformal physical vapor deposition workfunction metal on its three-dimensional body are described herein. Other embodiments may be described and claimed.
Type:
Grant
Filed:
May 3, 2006
Date of Patent:
April 8, 2008
Assignee:
Intel Corporation
Inventors:
Willy Rachmady, Brian S. Doyle, Jack T. Kavalieros, Uday Shah