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Patents
Patents Examined by Hui Chinl
Patents Examined by Hui Chinl
Adhesive compositions
Patent number:
8236886
Abstract:
Adhesive compositions suitable for use as tie-layer adhesives in multi-layer films and sheets are provided. The adhesive compositions contain an olefin polymer base resin, a modified polyolefin and a paraffinic liquid hydrocarbon.
Type:
Grant
Filed:
July 30, 2009
Date of Patent:
August 7, 2012
Assignee:
Equistar Chemicals, LP
Inventors:
Chun D. Lee, Charles S. Holland