Abstract: A chip-type electronic device has a substrate with a vertically extending groove formed on each of its mutually opposite edges. A solder material fills these grooves partially to a height which is below the top surface of the substrate. Electrode patterns are formed on these edges of the substrate including the inner surfaces of these grooves. A semiconductor electronic element is attached onto the top surface of the substrate. A resin mold seals the entire top surface of the substrate inclusive of the semiconductor element, extending to positions of the edges of the substrate and protruding partially into the grooves so as to serve as hooks to securely attach to the substrate.