Patents Examined by Hung Ngo
  • Patent number: 8633402
    Abstract: An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: January 21, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Patent number: 8633403
    Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: January 21, 2014
    Assignee: Apple Inc.
    Inventors: Gloria Lin, Wyeman Chen, Michael Nikkhoo, Michael Rosenblatt, Hammid Mahammadinia, Ziv Wolkowicki, Amir Salehi
  • Patent number: 8629355
    Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: January 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Oh Hyuck Kwon, Kyung Jin Oh
  • Patent number: 8624133
    Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: January 7, 2014
    Assignee: Fujitsu Limited
    Inventors: Albert Pedoeem, Paul V. Shannon, Mahesh Mistry, Larry Fox, Roberto Medrano, Jimmy O. Goodwin
  • Patent number: 8624111
    Abstract: A mobile device case including a housing sized to receive a mobile device; at least a portion of the housing including a first layer, a second layer, and a third layer of material, the second layer of material being disposed between the first and third layers of material and having a material with a higher durometer than the first and third layers of material.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: January 7, 2014
    Assignee: A.G. Findings & Mfg. Co.
    Inventors: Fernando Tages, Daniel Acero
  • Patent number: 8618419
    Abstract: An electric compressor includes a compression mechanism, an electric motor that drives the compression mechanism, a compressor housing that accommodates the electric motor and the compression mechanism, an inverter housing coupled to the compressor housing and including an inverter accommodation chamber that accommodates the inverter, and a sealed terminal arranged in the compressor housing. The sealed terminal electrically connects the inverter and the electric motor. The sealed terminal includes a terminal pin, which is formed from a conductive material, a terminal holder, which holds the terminal pin, and an insulative body, which insulates the terminal pin from the terminal holder. The insulative body includes a first insulative body, which is arranged in the inverter accommodation chamber and formed from a ceramic, and a second insulation body, which is arranged in the compressor housing and formed from glass.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: December 31, 2013
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Hiroshi Fukasaku, Hiroyuki Gennami
  • Patent number: 8618426
    Abstract: A device enclosing a volume shielded from certain levels of sound, light and electromagnetic radiation, such device that prevents electromagnetic communications and recording devices from transmitting and receiving communications from outside of the devices protected environment while remaining mobile and ungrounded.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: December 31, 2013
    Inventor: William Gerard Malone
  • Patent number: 8610003
    Abstract: A shielding structure includes a frame and a removable plate. The frame includes a peripheral wall, and the removable plate located in the opening may be fixed to the connecting board, the removable plate defining an access hole. A scored line is defined between the removable plate and the connecting board. The shielding structure further defines an arcuate gap between the removable plate and the connecting board and communicating with the scored line, and a mating hole, the arcuate gap is for increasing the shearing stresses on shielding structure the scored line when the removable plate must be removed.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: December 17, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Xin Fang, Guang-Fei Cao
  • Patent number: 8610002
    Abstract: Cover for electronic equipment including at least two movable metal panel elements. The panel elements are joined together along their respective edges, so they are joined together and in relation to each other immobile state form the cover. The invention is wherein the cover includes a respective connector for mechanical joining and good electric contacting along each one of the edges along which the panel elements are arranged to be joined together, in that each connector includes a respective resilient metal contacting device, which contacting device is arranged between the respectively joined together panel elements and in direct contact with both panel elements when the panel elements are in the joined together state, and thereby is compressed against the spring force of the contacting device, so that the spring force acts against the surfaces of both the respective joined together panel elements and connects them to each other electrically.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: December 17, 2013
    Assignee: Clamco Invest AB
    Inventor: Bertil Lohman
  • Patent number: 8604361
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: December 10, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne
  • Patent number: 8598470
    Abstract: An electromagnetic-wave-absorbing film comprising a plastic film, and a single- or multi-layer, thin metal film formed on at least one surface of the plastic film, the thin metal film being provided with large numbers of substantially parallel, intermittent, linear scratches with irregular widths and intervals.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: December 3, 2013
    Inventor: Seiji Kagawa
  • Patent number: 8598469
    Abstract: An electronic device enclosure includes a first cover, a second cover located below the first cover, and a bracket for receiving a disk drive. The second cover defining a hole and comprising a shielding panel covering the hole. The shielding panel is deformable to expose the hole, for the disk drive inserting into or being removed out of the bracket.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chung-Cheng Hsieh, Chieh-Chen Chen, Li-Ping Chen, Ying Gao
  • Patent number: 8598472
    Abstract: A compression unit for a modular sealing system including a compression assembly being arranged to expand in one direction as it is compressed in another direction and including an electrically conductive flexible sheet enclosing one end of the compression assembly.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: December 3, 2013
    Assignee: Roxtec AB
    Inventor: Ulf Hildingsson
  • Patent number: 8598471
    Abstract: There is provided an electric storage device having a novel fastening structure of a plastic member which can reduce cost with a simple configuration. An electric storage device according to this invention includes an electrode assembly, a case housing the electrode assembly, a plastic member arranged at an outer surface of the case, the plastic member having a joining surface facing the outer surface of the case, and an external terminal supported by the plastic member and electrically connected to the electrode assembly. The plastic member is a synthetic resin containing an inorganic fiber and is bonded to the outer surface of the case with the inorganic fiber exposed at the joining surface.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: December 3, 2013
    Assignee: GS Yuasa International Ltd.
    Inventors: Katsuhiko Okamoto, Shinsuke Yoshitake, Jun Nakamura, Masakazu Tsutsumi, Nobuyuki Naganawa
  • Patent number: 8581116
    Abstract: A component carrier is described for fastening a component on a mounting wall having a through-opening, including a receptacle device for the component, an installation device for establishing a fixation of the component carrier on the mounting wall, and a retaining device for the pre-fixation of the component carrier in the through-opening. The retaining device includes a pin structure and a rib structure extending along the pin structure, the pin structure and rib structure forming a fixation area, using which the retaining device is fixable in the through-opening. Furthermore, the retaining device includes a securing structure situated on the free end of the pin structure opposite to the rib structure, which prevents the retaining device from being pulled out of the through-opening.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: November 12, 2013
    Assignee: Robert Bosch GmbH
    Inventor: Matthias Ludwig
  • Patent number: 8563875
    Abstract: An electromagnetic shielding layer comprising at least one conductive layer and a carbon nanotube film structure, the conductive layer being disposed on the carbon nanotube film structure, and comes in contact with the carbon nanotube film structure electrically. A method for making the electromagnetic shielding layer includes the steps of: (a) providing an electronic element, the electronic element having a surface; (b) fabricating at least one carbon nanotube film; (c) forming a carbon nanotube film structure on the surface of the electronic element; and (d) forming a conductive layer on the carbon nanotube film structure, then obtaining an electromagnetic shielding layer on the surface of the electronic element.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: October 22, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Feng-Yuen Dai, Chi-Chuang Ho, Ji-Hong Pan, Yong Zheng, Kai-Li Jiang, Liang Liu
  • Patent number: 8563874
    Abstract: An electromagnetic interference shielding arrangement comprises a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro conductive engagement region that is adjacent the shielding member.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: October 22, 2013
    Assignee: Amtek Precision Technology Pte Ltd.
    Inventors: Pek Chuan Quek, Mun Ping Wong
  • Patent number: 8558124
    Abstract: A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: October 15, 2013
    Assignee: Inteva Products, LLC
    Inventors: Mauro P. Bidinost, Hector Sanchez Rojas
  • Patent number: 8558122
    Abstract: A filler panel for blocking an unused portion of a communications system. That filler panel may include an electromagnetic shielding base and a base cover removably coupled to the electromagnetic shielding base. The filler panel may also include an air dam composed substantially of low-cost, nonconductive material coupled to either the electromagnetic shielding base or to the base cover through the electromagnetic shielding base.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: October 15, 2013
    Assignee: Fujitsu Limited
    Inventors: Albert Pedoeem, Mahesh Mistry
  • Patent number: 8546702
    Abstract: Electronic devices and other apparatuses that include plastic parts ultrasonically bonded to metal parts are disclosed. A first component or part includes a metallic surface region having a surface roughness with one or more surface irregularities. A second component or part formed from a plastic material that can include an energy director is attached to the metallic surface region via an ultrasonic bond, such that a portion of the plastic material is melted or otherwise formed into the surface irregularities to attach the two components or parts together. The parts can be housings, internal components or other items. The surface irregularities can be formed as a result of a chemical etching process, a machining process, or a combination thereof, and can result in the creation of undercuts or cavities in the metallic surface region.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: October 1, 2013
    Assignee: Apple Inc.
    Inventors: Christopher David Prest, Douglas Weber