Patents Examined by Hung S. Bui
  • Patent number: 10381761
    Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 13, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Maw-Zan Jau, Jen-Mao Chen, Chun Chang
  • Patent number: 10383240
    Abstract: Embodiments relate generally to systems and methods for retaining a sensor package within a carrier. A sensor package assembly may comprise a sensor package comprising at least one sensor element located within a sensing face of the sensor package; and a carrier comprising retention features configured to retain the sensor package while completely exposing the sensing face of the sensor package. A method for retaining a sensor package within a carrier may comprise inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier; retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package; and exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements located in the sensing face of the sensor package.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: August 13, 2019
    Assignee: Honeywell International Inc.
    Inventors: J. L. Hunter, Anthony J. Bussan
  • Patent number: 10372174
    Abstract: A laminate curtain can suppress electromagnetic radiation leakage from an electronic appliance, as well as assist in managing cables interconnected to the electronic appliance. More specifically, a laminate curtain can include a conductive elastomer panel that absorbs spurious electromagnetic radiation generated by the electronic appliance, a conductive adhesive film disposed along one side of the conductive elastomer panel, and a conductive support frame affixed to the conductive adhesive film. The laminate curtain can be installed within a mounting frame, which secures the laminate curtain to the electronic appliance. Electromagnetic radiation that is absorbed by the conductive elastomer panel can travel to the electronic appliance via the conductive adhesive film, the conductive support frame, and the mounting frame. Thus, the conductive elastomer panel can be used to form a ground plane that catches and shunts the spurious electromagnetic radiation to the electronic appliance, which is grounded.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 6, 2019
    Assignee: Gigamon Inc.
    Inventors: Henry Baum, Ravichandran Venkatachalam
  • Patent number: 10366087
    Abstract: Telecommunications enclosures are described in this document. In one aspect, a telecommunications enclosure includes side panels having seals and an enclosure top connected, independent of a frame, to top ends of the side panels. The enclosure top has an enclosure top outer end that extends between the side panels and includes a seal. An interior panel is connected, independent of a frame, to side panels and has an interior panel outer end that extends between the side panels. The interior panel is separated from the enclosure top by a first distance and separated by a second distance from bottom ends of the side panels. A removable door is formed to engage the seals when the removable door is secured to the frameless telecommunications enclosure.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: July 30, 2019
    Assignee: ADTRAN, Inc.
    Inventors: Jeremy Lee Harris, Paul S. Wein, Jr., Jon Michael Chalmers
  • Patent number: 10362669
    Abstract: According to one embodiment, an electronic device includes housing, a circuit board in the housing, a semiconductor package, and a support plate on a second surface of the circuit board. The support plate is arranged at a position corresponding to a corner of the first area and includes a main portion, a first projecting portion in contact with the main portion at a first side of the main portion, and a second projecting portion in contact with the main portion at a second side of the main portion. The first projecting portion and the second projecting portion are arranged such that an imaginary line connecting a corner of the first projecting portion and a corner of the second projecting portion is outside the main portion.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 23, 2019
    Assignee: Toshiba Client Solutions CO., LTD.
    Inventors: Shinya Hayashiyama, Akihisa Shimizu
  • Patent number: 10356919
    Abstract: A foldable module and a flexible display device are provided. The foldable module includes a metal frame disposed along a periphery of a flexible display panel, a protective housing configured to hold the flexible display panel and the metal frame, and a flexible hinge for securing to the protective housing. The flexible hinge includes rotating shafts, fixed washers, biasing gaskets, movable washers, and disc springs. The flexible can achieve that it is positioned within a predetermined angular range.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: July 16, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Wei Bi
  • Patent number: 10356905
    Abstract: The present disclosure provides a bracket for an electronic component. The bracket includes a bearing part configured to bear an electronic component and two side walls. The two side walls are oppositely arranged and disposed at the same side of the bearing part. The two side walls of the bracket are configured to be disposed on a mainboard and define together with the mainboard and the two side walls an accommodating space. The present disclosure further provides an electronic component assembly and a mobile terminal.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: July 16, 2019
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Zeshuo Qiu, Yu Jiang, Jing Yang, Qianqiang Chen
  • Patent number: 10356922
    Abstract: This disclosure provides a middle frame and a flexible display device. The middle frame comprises a first framework component, a second framework component and a flexible component comprising a first chain link element, a second chain link element, a third chain link element, a fourth chain link element, a flexible element and a plurality of rotors. Under collaboration of the plurality of the rotors, the third chain link element is connected to the first framework component and the third chain link element, the third chain link element is connected to the flexible component, the second chain link element is connected to the second framework component and the fourth chain link element, and the fourth chain link element is connected to the flexible component.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: July 16, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Jun Chen
  • Patent number: 10348919
    Abstract: A covering structure for cable adaptable for connecting between a first and a second electronic modules that are electrically connected via a cable. When the first electronic module is pivoted relative to the second electronic module to be opened, a portion of the cable is exposed outside the first and the second electronic modules. The covering structure for cable includes a cover, a first shaft, and a second shaft. The first shaft is disposed on one side of the cover and pivoted to the first electronic module; the second shaft is disposed on an opposite side of the cover and pivoted to the second electronic module. The first electronic module is opened/closed relative to the second electronic module and drives the cover such that the cover covers a portion of the cable that is exposed outside the first and the second electronic modules when being opened.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: July 9, 2019
    Assignee: Kinpo Electronics, Inc.
    Inventors: Hung-Huan Sung, Sung-Po Lin, Chung-Hsin Wei
  • Patent number: 10340668
    Abstract: A stackable module has a housing provided to receive an electric/electronic component, and a clamping device for attachment to a support rail, wherein the clamping device has two latching/gripping hooks, which are displaceable in mutually opposite directions between an open position and a fastening position, and a force deflection mechanism for adjusting the latching/gripping hooks between the open position and the fastening position, said mechanism being actuable by means of an actuating element and able to be subjected to an actuating force from an outer side. In this case, the latching/gripping hooks bound a free opening distance which, for release fastening to the support rail, is greater in the open position and smaller in the fastening position than a provided support rail extent.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: July 2, 2019
    Assignee: H & B ELECTRONIC GMBH & CO. KG
    Inventors: Achim Siehler, Jan Bayerbach, Jochen Heimsch
  • Patent number: 10342119
    Abstract: A compliant electronics assembly mount frame and package are provided. The compliant frame may include a number of spring features configured to flexibly maintain and/or orient an attached PCBA inside a thermal conduction package. These spring features disposed in the compliant frame may be shaped, sized, and even tuned, to bias heat generating components attached to the PCBA evenly against a thermally controlled surface of the thermal package. The frame may be made or stamped from metal, such as sheet metal, and may be formed to include one or more integral spring features.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: July 2, 2019
    Assignee: NIO USA, Inc.
    Inventor: Nermin Mujcinovic
  • Patent number: 10342153
    Abstract: Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: July 2, 2019
    Assignee: Delta Electronics, Inc.
    Inventors: Le Liang, Zhenqing Zhao
  • Patent number: 10342152
    Abstract: The invention relates to an electronic device having a multi-part printed circuit board, the printed circuit board parts of which are connected to one another by current-carrying, flexible regions, having a support, around which the printed circuit board bent around the flexible regions of the printed circuit board is arranged and fixed, and having a housing in which the printed circuit board mounted on the support is fixed.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: July 2, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Christian Harrer, Andreas Bernhardt
  • Patent number: 10342148
    Abstract: An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: July 2, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Sheng-Hung Wang, Hui-Lian Chang, Ming-Wang Lin, Pan-Jen Chen, Wei-Lung Huang, Ting-Hui Liao
  • Patent number: 10340673
    Abstract: An electronic device includes a support frame, an electronic unit and a cable. The support frame includes a frame body and a first cable management unit. The frame body has a cable management recess and a cable management hole, wherein the cable management recess communicates with the cable management hole. The first cable management unit is connected to the frame body and rotatably located in the cable management recess. The electronic unit is disposed on the frame body. The cable has a first end and a second end opposite to the first end. The first end is connected to the electronic unit and the second end passes through the cable management hole to enter the cable management recess. The first cable management unit limits the cable in the cable management recess. When the cable is pulled to move, the first cable management unit rotates along with the cable.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: July 2, 2019
    Assignee: BenQ Corporation
    Inventor: Chih-Wen Li
  • Patent number: 10338330
    Abstract: The optical transceiver includes a case that has a second engagement portion engaging with a first engagement portion provided in the cage to prevent the optical transceiver from being ejected from the cage, a slider that moves relative to the case in the first direction with respect to the case, and a pusher that is oscillatably supported by the case via an oscillation shaft extending in a second direction and disengages the first engagement portion and the second engagement portion from each other by pushing the first engagement portion in a third direction while being interlocked with a movement of the slider. The oscillation shaft is positioned in an ejecting direction with respect to an interlocking part of the slider and the pusher.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: July 2, 2019
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Yuko Takeuchi, Hidemi Sone, Masato Hino
  • Patent number: 10330242
    Abstract: A supporting apparatus allowing a user to rotate a display panel comprises a first bracket and a second bracket. The first bracket and the second bracket cooperate to provide lateral and fore and aft support and allow rotation of the display panel with a friction damping arrangement to allow stable orientation and reorientation of the display panel as desired.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: June 25, 2019
    Assignee: HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO., LTD.
    Inventors: Te-Hsu Wang, Quan-Guang Du
  • Patent number: 10331106
    Abstract: A rack storage unit for use in an automation system for a storage of work pieces and/or work piece pallets and/or tools, which includes a base frame with a rack stand and two rack side parts arranged at a distance from one another, wherein facing surfaces of the rack side parts are provided with interfaces for mounting placement devices. It is provided that the base frame is produced as a one-piece cast body from artificial stone, and that the interfaces are held by adhesive force as separately formed insert parts in the facing surfaces of the rack side parts.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 25, 2019
    Assignee: MASCHINENFABRIK BERTHOLD HERMLE AG
    Inventors: Franz-Xaver Bernhard, Tobias Schworer, Michael Dietmann, Frank Bille
  • Patent number: 10321863
    Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: June 18, 2019
    Assignee: Abbott Diabetes Care Inc.
    Inventors: Mohammad E. Moein, Louis G. Pace, Udo Hoss, Phu X. Le, Samuel M. Curry
  • Patent number: 10324493
    Abstract: An electronic device is provided. The electronic device includes a window panel having a front area and a curved area extending from the front area, a display panel disposed beneath the window panel, and a fixed part which supports a curved area of the display panel. The display panel includes a front display area, a side display area extending from the front display area so as to be curved, and a wiring area extending from the side display area, and the fixed part supports a curved shape of the side display area or the wiring area.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 18, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Woon Geun Kwak, Jung Sik Park, Do Hun Cha