Abstract: A detection apparatus for detecting a mark formed on a substrate uses a detection optical system that irradiates light on the mark on the substrate held by a stage and detects an image of the mark, and a processor that performs a detection process of the mark based on the image of the mark. The processor finds a detection value indicating a position of the mark in an observation field of the detection optical system based on the image of the mark, finds a subregion in which the mark is located among a plurality of subregions in the observation field, and corrects the detection value based on a correction value corresponding to the found subregion among correction values predetermined for the plurality of subregions, respectively.

Abstract: A method of controlling a wafer stage includes moving the wafer stage to position an immersion hood over a first sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a second sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a first particle capture area on the wafer stage after moving the wafer stage to position the immersion hood over the second sensor. The method further includes moving the wafer stage to define a routing track over the first particle capture area. The method further includes moving the wafer stage to position the immersion hood over an area for receiving a wafer on the wafer stage after defining the routing track over the first particle capture area.

Abstract: An apparatus, method, and system for identifying and obtaining information related to a substrate support and/or a pre-heat ring in a process chamber via imaging and image processing. In an embodiment, a substrate support is provided. The substrate support generally includes a top surface configured to receive a substrate in a process chamber and a marking feature disposed on the top surface of the substrate support, the marking feature configured to be detectable by an imaging apparatus coupled to the process chamber to provide information related to the substrate support via imaging when the substrate support is disposed within the process chamber.

Abstract: Disclosed is target arrangement comprising a first target region having at least a first pitch and at least a second pitch a second target region having at least a third pitch, wherein a portion of the first target region having a second pitch overlaps with a portion of the second target region.

Abstract: A method for preparing a substrate for an exposure process of a lithographic manufacturing method, the method including imposing different local temperatures across the substrate so as to induce different thermal expansion across the substrate before the exposure process. This method is for compensating for deformation of the substrate induced when the substrate is positioned on a substrate table of a lithographic apparatus. There is also provided a local temperature applicator to implement this technique and to a lithographic apparatus including such a local temperature applicator.

Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

Abstract: A detection device (20) according to the present disclosure includes an acquisition unit (11) that acquires point cloud data indicating a distance to an object and luminance information obtained from reflected light of a beam emitted when the point cloud data is measured, an edge detection unit (12) that performs edge detection based on the luminance information, a classification unit (21) that classifies, based on distribution of points contained in a crack candidate being a set of points detected as an edge, a plurality of the crack candidates into one of groups, and a label assignment unit (23) that accepts input of a label regarding the group from a user having visually recognized a shape of the crack candidate belonging to the group.

Abstract: The invention relates to an inspection system for quality analysis of a food product, comprising a conveyor for moving it to an inspection area, a lighting device consisting of LEDs that emit a light sequence directed towards the inspection area to light up the product by transmission, a linear camera with at least one line of pixels for collecting a plurality of images in each light sequence of the lighting device, and a focusing member for focusing the beam emitted by the lighting device. Advantageously, the lighting device is activated in a pulsed manner, generating a light sequence with at least two different illuminations, at least one of which is a transmission-pulsed illumination. The lighting device is aligned on the axis formed by the product to be inspected and the linear camera.

Abstract: A method for assessing contrasts on surfaces, in particular for optically identifying structured and/or pictorial surfaces, e.g. of paintings or sculptures, is simple to use independently of the location and safe. For this purpose, the method involves the steps of: focusing a camera onto a prominent image dot on the surface; creating at least two images of a recognizable, high-contrast area of the image dot; and storing the image having the greatest depth of detail as a reference image.

Abstract: A processor of the inspection support device acquires an image obtained by imaging a structure to be inspected and detects damage to the structure on the basis of the acquired image. In a case where two or more types of damage (cracking B and linear free lime C2) to the structure are detected, the processor determines whether or not two or more types of damage are detected from the same or adjacent positions. In a case where determination is made that the cracking B and the linear free lime C2 are detected from the same or adjacent positions when the processor outputs the damage detection result (a damage image, a damage diagram, and the like), the processor preferentially outputs a damage detection result of the linear free lime C2 in accordance with a priority of a damage type.

Abstract: A mirror, e.g. for a microlithographic projection exposure apparatus, includes an optical effective surface, a mirror substrate, a reflection layer stack for reflecting electromagnetic radiation incident on the optical effective surface, at least one first electrode arrangement, at least one second electrode arrangement, and an actuator layer system situated between the first and the second electrode arrangements. The actuator layer system is arranged between the mirror substrate and the reflection layer stack, has a piezoelectric layer, and reacts to an electrical voltage applied between the first and the second electrode arrangements with a deformation response in a direction perpendicular to the optical effective surface. The deformation response varies locally by at least 20% in PV value for a predefined electrical voltage that is spatially constant across the piezoelectric layer.

Abstract: Provided are a dark-field confocal microscopy measurement apparatus and method.

Abstract: The present disclosure provides a measurement system and a measurement method related to the field of measurement techniques, the measurement system comprising: a light source configured to produce an original beam, wherein a return beam is formed by the original beam returning from a measured area of a measured object; an optical assembly configured to obtain a pending beam based on the return beam, wherein at least part of the pending beam acts as a first beam; a first detection device configured to obtain first detection information based on the first beam; a mobile device configured to move the optical assembly and the measured object with respect to each other in a direction of an optical axis of the optical assembly; and a processing system configured to determine an actual distance between the optical assembly and a fixed plane of the measured object at each first moment according to the first detection information at each first moment of a plurality of first moments.

Abstract: Aspects of the present disclosure provide a wafer processing device for optimizing wafer shape. For example, the wafer processing device can include a first hot plate, a second hot plate and a controller. The first hot plate can be configured to heat a wafer. For example, the first hot plate can provide uniform heating across a surface of the first hot plate. The second hot plate has multiple heating zones with each heating zone independently controllable such that each heating zone can be set to a temperature value independent of other heating zones. The controller is configured to control the first hot plate to provide the uniform heating, receive a bow measurement from wafer curvature measurement of a wafer, and set the multiple heating zones of the second hot plate to their respective temperature values that correspond to the bow measurement.

Abstract: A heat treatment unit U2 includes a heat plate 20 configured to place a wafer W thereon and heat the wafer W placed thereon; multiple gap members 22 formed along a front surface 20a of the heat plate 20 on which the wafer W is placed, and configured to support the wafer W to secure a clearance V between the heat plate 20 and the wafer W; a suction unit 70 configured to suck the wafer W toward the heat plate 20; and an elevating pin 51 configured to penetrate the heat plate 20 and configured to be moved up and down to move the wafer W placed on the heat plate 20 up and down. The front surface 20a of the heat plate 20 has a concave region 20d inclined downwards from an outer side toward an inner side thereof.

Abstract: The invention relates to a device and a method for the alignment of substrates.

Abstract: A method setting respective relative laser intensities to a plurality of pixels representing a lithographic exposure includes: decreasing a relative laser intensity of each pixel from a respective first relative laser intensity to a respective second relative laser intensity, adjusting a laser dose translation of relative laser intensity of pixels from a first laser dose translation of the first relative laser intensity to a second laser dose translation of the second relative laser intensity, such that a respective effective exposed laser dose of each pixel achieved by the second laser dose translation is equal to a respective effective exposed laser dose of each pixel that would have resulted from the first laser dose translation, and increasing, by a constant additive term, the respective relative laser intensity of an edge pixel or of a neighbouring pixel from the respective second relative laser intensity to a respective third relative laser intensity.

Abstract: A method includes providing a workpiece to a semiconductor apparatus, the workpiece including a material layer including a first strip having: a first plurality of exposure fields; and a second plurality of exposure fields alternatingly arranged with the first plurality of exposure fields. The method further includes: scanning the first strip along a first scan route from a first side of the workpiece to a second side of the workpiece to generate first topography measurement data; scanning the first strip along a second scan route from the second side to the first side to generate second topography measurement data; and exposing the first plurality of exposure fields and exposing the second plurality of exposure fields according to the first topography measurement data and the second topography measurement data.

Abstract: An automated optical double-sided inspection apparatus includes a first image-capturing portion, a second image-capturing portion, a platform, a first light-blocking portion, a second light-blocking portion, and a processing portion. The platform carries an external object. When the processing portion operates in a first capturing mode, the second light-blocking portion blocks visible light from passing therethrough, while the first light-blocking portion allows visible light to pass therethrough, so that the first image-capturing portion shoots a first side of the external object through the first light-blocking portion to obtain a first image.