Abstract: An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

Abstract: A method of inspection or metrology of four sides of a sample is disclosed. The method includes providing samples in a carrier at a first side of an imaging tool and moving the samples from the carrier to the imaging tool via a pick-and-place stage assembly. The method includes imaging first and second sides of the samples via first and second channels of the imaging tool and returning the samples to the carrier. The method includes rotating the carrier by 90 degrees and translating the carrier to an opposite side of the imaging tool and moving the samples individually from the carrier to the imaging tool. The method includes imaging a third and fourth side of the sample via the first and second channel of the imaging tool and returning the one or more samples from the imaging tool to the carrier.

Abstract: A method and a system for preparing a substrate with three dimensional features for immersion based inspection. The method may include (a) receiving, by a secondary chamber, an article that includes the substrate, a housing, and a transparent element; wherein the transparent element is sealingly coupled to the housing to provide a sealed inner space; wherein the sealed inner space may include a gap between a first surface of the substrate to a second surface of the transparent element; wherein the gap is filled with gas during the receiving of the article; (b) evacuating the gas from the gap while reducing a pressure within the secondary chamber and maintaining an integrity of the transparent element; (c) filling the gap with fluid while increasing the pressure within a secondary chamber inner space and maintaining an integrity of the transparent element; and (d) outputting the article from the secondary chamber.

Abstract: A system having a sub-system that is configured to change a thermal condition of a physical component from a set-point to a new set-point, wherein the sub-system includes: a mixer operative to receive a first conditioning fluid having a first temperature and a second conditioning fluid having a second temperature different from the first temperature, and operative to supply to the physical component a mix of the first conditioning fluid and the second conditioning fluid; and a controller configured to control the mixer in dependence on the new set-point. Also a method of operating a lithographic apparatus as well as a device manufactured using the system described herein or according to methods described herein.

Abstract: An exhaust stream monitoring system for a photolithography track of an IC fabrication process comprises a reaction chamber including a housing, an inflow port and an outflow port, the housing containing a thermal plate for heating a semiconductor process wafer for a predetermined amount of time. An influent pipe coupled to the inflow port supplies a photoresist adhesion promoter in a gaseous form to the reaction chamber. An effluent pipe coupled to the outflow port is operative to remove byproducts from the reaction chamber as an exhaust stream. At least one gas sensor manifold assembly is coupled to the effluent pipe for monitoring the exhaust stream from the reaction chamber to detect presence of one or more byproducts of a reaction between the photoresist adhesion promoter and the semiconductor process wafer.

Abstract: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.

Abstract: A digital exposure apparatus includes a lens array, the lens array at least including a first lens unit and a second lens unit, a light transposition assembly arranged on an exit light path of the second lens unit, and the light transposition assembly being used for controlling a light exiting from the second lens unit to be transposed with respect to an exposure direction of the digital exposure apparatus. When the digital exposure apparatus is used for exposure, a light passing through the first lens unit and a light penetrating through the second lens unit are needed to expose the same position for multiple times.

Abstract: A photolithography device includes: a fixed slot, configured to install and fix the light source; a sensing module, configured to sense the distance information between the light source and the fixed slot; a prompt module, configured to send prompt information according to the distance information; and a determination module, configured to determine the installation status of the light source according to the prompt information.

Abstract: A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

Abstract: The present application provides an exposure machine, relates to semiconductor integrated circuit manufacturing technologies. The exposure machine includes a machine platform, a shielding device, and a drive device; the machine platform is provided with a recess portion, the recess portion has a top opening, a base and a placement table are disposed in the recess portion, the placement table is configured to carry a mask carrier, and the mask carrier can be placed on the placement table through the top opening; and the machine platform is further provided with a drive device and a movable shielding device, when the shielding device is at an initial position, the shielding device covers the top opening, and when the mask carrier needs to be placed on the placement table through the top opening, the drive device opens the shielding device to expose the top opening.

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

Abstract: A defect inspection system provides an image of a surface of a hard drive media to a machine learning model that is trained to identify predefined classifications of abnormal surface patterns on the hard drive media, each of the predefined classifications being associated in system memory with a severity indicator. The defect inspection model analyzes the image and generates and output indicating that the image includes a pattern consistent with a select classification of the predefined classifications of abnormal surface patterns. When the severity indicator for the select classification satisfies a failure condition, the defect inspection system automatically implements a corrective action.

Abstract: Embodiments of baking chambers for baking a photomask are provided herein. In some embodiments, a baking chamber includes: a chamber body enclosing a first interior volume and a second interior volume, disposed beneath and fluidly independent from the first interior volume; a radiant heat source disposed in the first interior volume; a photomask support structure configured to support a photomask disposed in the second interior volume; a window disposed between the first interior volume the second interior volume, wherein the window is made of a material that is transparent to thermal radiation; a first gas inlet and a first gas outlet coupled to the first interior volume; and a second gas inlet and a second gas outlet coupled to the second interior volume on opposite ends thereof to facilitate flow of a process gas laterally through the second interior volume and across the photomask support structure.

Abstract: A photolithography method is provided. The photolithography method includes forming a photoresist layer on a wafer, exposing a portion of the photoresist layer by using an exposure device and a mask, and forming a photoresist pattern by removing a non-exposed portion of the photoresist layer. The mask includes a substrate having a main pattern area and a blocking area outside the main pattern area, a main pattern on the main pattern area of the substrate, and a blocking pattern on the blocking area of the substrate. An external circumference of the blocking pattern extends to the maximum area of the mask that may be illuminated by the exposure device or to the outside of the maximum area of the mask.

Abstract: An exposure method of performing an exposure operation of exposing a substrate via a projection optical system is provided. The method includes executing, in an exposure period in which the exposure operation is performed, aberration correction of the projection optical system to correct an aberration generated by performing the exposure operation, measuring, in a non-exposure period succeeding the exposure period, in which the exposure operation is not performed, an aberration of the projection optical system, and correcting the aberration of the projection optical system using a correction amount adjusted based on a result of the measurement so as to reduce a correction residual in the aberration correction of the projection optical system.

Abstract: Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

Abstract: A method for making a negative-working lithographic printing plate includes subjecting an image-wise exposed, developed, and dried plate precursor to UV LED radiation.

Abstract: A shutter is provided near the immediate focus of a lithography apparatus in order to deflect tin debris generated by a source side of the apparatus away from a scanner side of the apparatus and towards a debris collection device. The activation of the shutter is synchronized with the generation of light pulses so as not to block light from entering the scanner side.

Abstract: A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.