Abstract: A deep learning-based quality inspection system by learning only non-defective manufactured product data may include: an input unit receiving a non-defective manufactured product image data set; a preprocessor preprocessing a model to learn the images with a same size by not applying a cropping task to cut and process only an area at a specific location within each image for each of the plurality of images included in the image data set, but applying a resizing task of adjusting each image to a desired size and a padding task of adjusting the size of the image while maintaining a ratio of each image as it is; and a controller extracting a non-defective manufactured product feature which becomes a non-defective manufactured product criterion from the preprocessed image, and generating a plurality of fake defective manufactured product features by adding a Gaussian noise feature to the extracted non-defective manufactured product feature.

Abstract: A photomask includes a plurality of main patterns, a plurality of first sub-resolution assist feature patterns and a plurality of second sub-resolution assist feature patterns. The first sub-resolution assist feature patterns are located aside the main patterns. The second sub-resolution assist feature patterns are disposed between and connected to adjacent two of the first sub-resolution assist feature patterns.

Abstract: Systems, apparatuses, and methods are provided for increasing the throughput of a particle inspection system. During a first portion of an exposure time period of the particle inspection system, an example method can include irradiating a first region of a substrate surface, blocking all reflected radiation outside the first region, and generating a first sub-image of the first region based on radiation reflected from the first region. During a second portion of the exposure time period, the example method can further include irradiating a second region of the substrate surface, blocking all reflected radiation outside the second region, and generating a second sub-image of the second region based on radiation reflected from the second region. Subsequently, the example method can include generating a composite image based on the first sub-image and the second sub-image.

Abstract: A positioning device, including: a first positioning module arranged to support and position a first substrate, a second positioning module arranged to support and position a second substrate, a first positioning field in which the first and second positioning modules can be alternatingly positioned to carry out a first processing sequence, a second positioning field in which the first and second positioning modules can be alternatingly positioned to carry out a second processing sequence, wherein when one of the first and second positioning modules is carrying out or finishing the first processing sequence, the other of the first and second positioning modules has finished the second processing sequence and is positioned closer to the one of the first and second positioning modules.

Abstract: An imaging device configured to image a printed state of a target surface of a target object for inspection includes: a first light source; a diffuser including an inner periphery surface covered with a diffuse reflection material, and configured to diffusely reflect light emitted from the first light source and emit diffusely reflected light to the target surface; and a line sensor configured to receive light resulting from reflecting the diffusely reflected light from the target surface.

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

Abstract: A system is provided. The system includes an exposing device configured to generate a real-time image, including multiple first align marks, of a mask and an adjusting device configured to adjust an off-set of the mask from a pre-determined position to be smaller than a minimum aligning distance according to the first align marks and multiple align marks on a substrate, and further to move the mask closer to the pre-determined position to have a displacement, less than a minimum mapping distance, from the pre-determined position according to the real-time image and a reference image of the mask.

Abstract: A product inspection system includes an image acquisition system having a camera generating an inspection image of a product arranged between a plurality of mirrors. The inspection image has a plurality of sub images of different sides of the product. The inspection system has a calibration member with a plurality of correction patterns on different sides; the camera receives light from the calibration member reflected by the mirrors to generate a calibration image of the calibration member. A computer of the product inspection system receives the inspection image and the calibration image and determines a relative mirror position relationship between the mirrors. The computer forms a single spliced image of the product.

Abstract: A reticle is pre-heated prior to an exposure operation of a semiconductor substrate lot to reduce substrate to substrate temperature variations of the reticle in the exposure operation. The reticle may be pre-heated while being stored in a reticle storage slot, while being transferred from the reticle storage slot to a reticle stage of an exposure tool, and/or in another location prior to being secured to the reticle stage for the exposure operation. In this way, the reduction in temperature variation of the reticle in the exposure operation provided by pre-heating the reticle may reduce overlay deltas and misalignment for the semiconductor substrates that are processed in the exposure operation. This increases overlay performance, increases yield of the exposure tool, and increases semiconductor device quality.

Abstract: A semiconductor substrate stage for carrying a substrate is provided. The semiconductor substrate stage includes a base layer, a magnetic shielding layer disposed on the base layer, a carrier layer disposed on the magnetic shielding layer, a receiver disposed on the carrier layer, a storage layer disposed between the base layer and the magnetic shielding layer, and a magnetic shielding element disposed on the carrier layer and surrounding the receiver.

Abstract: The present disclosure relates to an automatic detecting device for detecting flaws on a surface of a camshaft in the field of detecting device. The automatic detecting device includes a framework, which is provided with a working platform, an elevator mechanism, a first rotating elevator mechanism and a second rotating elevator mechanism. The working platform is rotatably connected with the rotating platform. The working platform is provided with a first working position; a second working position, a third working position and a fourth working position. The rotating platform is provided with a plurality of locating members. The locating member is configured for placing a test piece. The working platform is provided with an overturning mechanism, a first visual module and a second visual module.

Abstract: Aspects of the present disclosure relate to methods and apparatus for correcting lithography systems. In one implementation, a method of operating a lithography system includes directing first light beams toward a reflective surface of a first substrate using an optical module. The method includes directing the first light beams collected through at least an objective lens toward a camera, and taking a plurality of first images of the first light beams. The method includes directing second light beams at an oblique angle toward a patterned surface of a second substrate using an illumination source disposed below the objective lens. The method includes directing the second light beams collected through at least an objective lens toward a camera, and taking a plurality of second images of the second light beams. The method includes determining a tip correction, a tilt correction, and an optimal vertical position for the optical module.

Abstract: The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer.

Abstract: A wafer stage includes an area for receiving a wafer. The wafer stage further includes a first sensor outside of the area for receiving the wafer. The wafer stage further includes a second sensor outside of the area of receiving the wafer, wherein the second sensor is spaced from the first sensor. The wafer stage further includes a first particle capture area outside of the area for receiving the wafer, wherein the first particle capture area is spaced from both the first sensor and the second sensor, a dimension of the first particle capture area in a first direction parallel to a top surface of the wafer stage is at least 26 millimeters (mm), a dimension of the first particle capture area in a second direction parallel to the top surface of the wafer stage is at least 33 mm, and the second direction is perpendicular to the first direction.

Abstract: A method for high throughput defect detection, the method may include (i) performing, using first detection channels, a simultaneous inspection process through a segmented pupil plane that comprises multiple pupil plane segments to select one or more pupil plane segments of interest out of multiple pupil plane segments; (ii) configuring one or more configurable filters related to second detection channels to pass radiation received from the one or more pupil plane segment of interest and to block radiation received from one or more non-of-interest pupil plane segments; and (iii) performing, using the second detection channels, a partially masked pupil plane inspection process.

Abstract: A system and method are disclosed for generating metrology measurements with second sub-system such as an optical sub-system. The method may include performing a training and a run-time operation. The training may include receiving first metrology data for device features from the first metrology sub-system (e.g., optical); generating first metrology measurements (e.g., critical dimensions, etc.); binning the device features into two or more device bins based on the first metrology measurements; and identifying representative metrology targets for the two or more device bins based on distributions of the first metrology measurements. The run-time operation may include receiving run-time metrology data (e.g., optical) of the representative metrology targets; and generating run-time metrology measurements based on the run-time metrology data.

Abstract: A processing method includes obtaining a processing image of a apparatus and performing a second processing on the processing image to generate a target image to analyze the target image according to a target defect detection method to realize defect detection of the apparatus. The processing image is obtained by performing a first processing on an initial image of the apparatus. The first processing includes performing scale processing on the initial image according to defect parameters corresponding to the initial image.

Abstract: This illumination optical system has a laser light source (301, 401, 501), a light collection optical system (311, 4il, 51i), and a support structure (312, 412) that is able to secure the laser light source and the light collection optical system, wherein the light from the laser light source is focused onto an object to be inspected (307, 407, 507). The light collection optical system includes a cylindrical mirror (306, 406, 506), and at least one cylindrical lens (304, 404a, 404b, 4G4c, 504a, 5046, 504c). The cylindrical mirror is an optical element that collects light in a first direction, and the cylindrical lens is an optical element that collects light in a second direction perpendicular to the first direction. The focal distance of the cylindrical lens to the object to be inspected is greater than the focal distance of the cylindrical mirror to the object to be inspected.

Abstract: Devices, methods and systems are disclosed that enable deflectometry on a wide array of objects, including convex and freeform optical components. One example deflectometry system includes a light source with a plurality of light emitting devices to illuminate an object under test with incident light, and a detector positioned to receive a reflected or transmitted light from the object under test. The deflectometry system further includes a movable stage for holding or securing the object under test. The movable stage can move in a translational or a rotational direction to cause the object under test to translate or rotate in a plurality of steps such that the light received at the detector encompasses a portion of a full illumination space surrounding the object, and the light received at the detector from all of the plurality of steps encompasses the full illumination space that contiguously surrounds the object under test.

Abstract: A measurement apparatus for mounting within an enclosure of a machine is described. The apparatus includes a measurement device and a protection means for protecting the measurement device from contaminants present within the machine enclosure. The protection means is switchable between at least a first mode that protects the measurement device from contaminants and a second mode that provides less protection of the measurement device from contaminants than the first mode. A contaminant sensor is used for sensing contamination within the machine enclosure and thereby determining when the protection means can adopt the second mode. A corresponding method is also described.