Abstract: In a method for producing a portable electronic device with an integrated circuit, a resin band is deposited around the chip of an integrated circuit and connection wires. The resin is highly viscous and can be polymerized with U.V. radiation. A low-viscosity filling resin which can be polymerized with U.V. radiation is deposited in the space defined by the resin band, and the protected resins are polymerized by exposure to U.V. radiation. The filling resin contains mechanically reinforcing fibers. The entire process can be carried out in a continuous manner.