Abstract: A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.
Type:
Grant
Filed:
February 15, 1996
Date of Patent:
August 5, 1997
Assignee:
Ford Motor Company
Inventors:
Kenneth Neil Kendall, Alan Robert Harrison