Patents Examined by Ivan Carpio
  • Patent number: 7342470
    Abstract: A microwave filter has resonator comprised of a cylindrical structure having conductive walls filled with a dielectric material where the cylindrical structure is recessed inside a multi-layered substrate. First and second conductive coupling arms are disposed on a top layer of the substrate for coupling signals to the cylindrical structure. The conductive coupling arms are separated by a dielectric layer. The first and second conductive coupling arms extend away from the center of the cylindrical structure to form a microstrip line. The cylindrical structure further comprises a bottom portion having a solid conductive bottom plate perpendicular to the axis of the cylinder and a bottom conductive ground layer separated from the conductive bottom plate by a second dielectric layer.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: March 11, 2008
    Inventor: Fred Bassali
  • Patent number: 7327583
    Abstract: A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of external bond pads. A plurality of power vias and ground vias may be routed from a first redistribution layer between the internal bond surface and the external bond surface to a second redistribution layer between the first redistribution layer and the external bond surface based on a via pattern. The via pattern may comprise routing a power via and a ground via adjacent one another spaced apart at a distance that is substantially equal to a minimum routing pitch associated with the multilayer substrate.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: February 5, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jerimy Nelson, Mark D. Frank, Peter Shaw Moldauer, Karl Bois
  • Patent number: 7277295
    Abstract: According to one embodiment of the invention, an apparatus includes a housing having a front side and a bottom side adjacent the front side. The apparatus also includes a plurality of light generating devices each operable to generate light in response to operation of a particular component of the apparatus. The apparatus also includes a plurality of light pipes each associated with a respective ones of the light generating devices and operable to display light generated by the respective light generating device such that the light is visible on the front side and on the bottom side of the housing. According to another embodiment, an apparatus includes a housing having at least one heat sink disposed therein and overlying a component of the apparatus. The apparatus also includes at least one heat sink having a base and a plurality of fins extending from the base.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: October 2, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Craig A. Zimmerman, Earl W. Boone, Matthew D. Grimm, William C Johnson, Daniel Nix
  • Patent number: 7262972
    Abstract: An improved front panel assembly is capable of being used with an electronic equipment rack. The improved front panel assembly includes a cover, an attachment subassembly configured to attach the cover to the electronic equipment rack, and a metallic EMI shield. The cover includes (i) a central portion configured to separate an external space in front of the electronic equipment rack and an internal space within the electronic equipment rack, and (ii) side portions which extend around a periphery of the metallic EMI shield. The side portions are configured to elevate and support the central portion from the metallic EMI shield. The central portion and the side portions define a top slot which extends horizontally along a top outer edge of the central portion and a bottom slot which extends horizontally along a bottom outer edge of the central portion.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: August 28, 2007
    Assignee: EMC Corporation
    Inventors: C. Ilhan Gundogan, W. Brian Cunningham, Gerald J. Cote, Lawrence J. Feroli
  • Patent number: 7256995
    Abstract: An electronics module comprises a housing; and a plurality of electronic and electrical components for example fans. The module includes electromagnetic shielding for example perforated panels side walls etc. that is associated with the housing and/or the electronic components, and which provides a Faraday cage for the electronic components. The shielding is constructed so that one or more of the components can be removed from the module while the module is in operation substantially without affecting the integrity of the Faraday cage. The module enables certain components thereof to be replaced without adding to the downtime of the system or increasing electromagnetic interference.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: August 14, 2007
    Assignee: Sun Microsystems, Inc.
    Inventors: Sean Conor Wrycraft, Brian Benstead
  • Patent number: 7251144
    Abstract: A display includes a monitor module, a base and a shielding apparatus. The base is coupled to the monitor module, and the shielding apparatus is disposed between the base and the monitor module. The shielding apparatus includes a magnetic core and a non-flexible coiled device having a number of fixed shape coils. The coiled device is put through the magnetic core so that the magnetic core is selectively surrounded by at least one of the coils of the coiled device. The monitor module is therefore grounded via the shielding apparatus.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: July 31, 2007
    Assignee: Benq Corporation
    Inventor: Yao-Wen Chu
  • Patent number: 7248482
    Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: July 24, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Asahi, Yutaka Taguchi, Yasuhiro Sugaya, Seiichi Nakatani, Toshio Fujii
  • Patent number: 7248469
    Abstract: The present invention relates to a plug-in electronic module which has: a housing, an electronic component arranged in the housing, at least one external electrical contact connected to the electronic component, where the electronic module can be plugged into a holding structure such that the external electrical contacts on the module come into contact with associated electrical contacts on a coupling partner during the plug-in operation, and a mechanical protective apparatus which protects the electrical contacts from mechanical contact when the module is not plugged in and which exposes the electrical contacts when the module has been plugged into the holding structure, so that they can come into contact with associated electrical contacts on the coupling partner. The invention also relates to a method for connecting such an electronic module to a holding structure.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: July 24, 2007
    Assignee: Finisar Corporation
    Inventors: Mario Festag, Uwe Fischer
  • Patent number: 7245502
    Abstract: A small form factor USB Bluetooth dongle includes a printed circuit board (PCB), a USB contact area, and a radio frequency (RF) transceiver die. The PCB includes a first primary surface and a second primary surface. The USB contact area is fabricated on the first primary surface. The RF transceiver die is mounted on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: July 17, 2007
    Assignee: Broadcom Corporation
    Inventors: Craig Alan Kochis, Thomas Herbert Ramsthaler
  • Patent number: 7242578
    Abstract: A bladed architecture, backplane-based network (100) having N payload slots (108) includes an N/2 slot switch module (102), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration (603) and a right-hand slot switch configuration (605), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration (601).
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: July 10, 2007
    Assignee: Motorola, Inc.
    Inventors: Douglas L. Sandy, Mark S. Lanus, Robert C. Tufford
  • Patent number: 7236363
    Abstract: Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid transporting apparatus. The liquid transporting apparatus may provide liquid communication between the sealed electronics module and an external liquid cooling module. The sealed electronics module may also include an apparatus for the cooling electronics components in the electronics module using liquid that is transported between the sealed electronics module and the external liquid cooling module.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: June 26, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Christian L. Belady
  • Patent number: 7227759
    Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: June 5, 2007
    Assignee: Silicon Pipe, Inc.
    Inventors: Kevin P. Grundy, Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram
  • Patent number: 7221564
    Abstract: A support apparatus includes a first member and a second member. Each member has a first and a second portion. The first portions of the members are spaced apart and the second portions of the members are interconnected. The first member is a ribbed member in a first orientation and the second member is a ribbed member, identical to the first ribbed member, attached to the first ribbed member in a second orientation inverted from the first orientation.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: May 22, 2007
    Assignee: Dell Products L.P.
    Inventor: Robert M. McAlister
  • Patent number: 7215540
    Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: May 8, 2007
    Assignee: Optimum Care International Tech. Inc.
    Inventor: Shih-Hsiung Lien
  • Patent number: 7211723
    Abstract: A phase separation jig (100) for a superconducting cable includes: a cable holder (10) maintaining each core (80) of a multi-core superconducting cable (2) in a predetermined tolerable bending manner; and a coupler (20, 30) holding the cable holder (10) for each core (80) at a predetermined spacing with each other. Each core (80) is spaced apart from each other and maintained in a tolerable bending manner by the holder (10). Accordingly, a phase separation structure can be obtained which can regulate deformation of the cable and prevent abnormal deformation even for a superconducting cable.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: May 1, 2007
    Assignees: Sumitomo Electric Industries, Ltd., The Tokyo Electric Power Company Incorporated
    Inventors: Masayuki Hirose, Hiroyasu Yumura, Takeshi Kato, Yoshihisa Takahashi, Kimiyoshi Matsuo, Shoichi Honjo, Tomoo Mimura
  • Patent number: 7209359
    Abstract: An adjustable tray for a semiconductor device, and method of using the tray for handling the device, are provided. Each tray comprises a front frame segment and a back frame segment opposing the front frame segment, and a pair of opposing side frame segments secured to the front and back frame segments to form right angles, each side frame segment containing a longitudinal channel. Each tray further includes a fixed locator segment and an adjustable locator segment, each having a plurality of slots for receiving semiconductor devices therein. The distal ends of the locator segments are secured to the pair of opposing side frame segments at right angles. The adjustable locator segment can be manipulated such that the fixed and adjustable locator segments are spaced apart a distance commensurate with the width of the semiconductor device. The device is friction fit into a slot such that the device is only contacted at keep-out areas on the device.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: April 24, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Eric Matthews
  • Patent number: 7207104
    Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: April 24, 2007
    Assignee: Apple Computer, Inc.
    Inventors: Robert Steinfeld, Cheung-Wei Lam
  • Patent number: 7206185
    Abstract: The invention relates to a capacitor device comprising the combination of a cylindrical capacitor and a holder for holding the capacitor in a sideways position. The holder includes a capacitor holding part that has an opening at the top and is arc-shaped in cross section, and a mounting part for mounting the holder itself to another device. The capacitor is held in a sideways position in the holding part of the holder with a heat shrinking resin tube interposed therebetween. Accordingly, the height of the capacitor device is reduced, so that the size of the capacitor device can be reduced. In addition, the connection distance between the capacitor device and another electronic device is shortened, so that the inductance can be made smaller.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: April 17, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Tsunezaki, Tsuyoshi Yoshino
  • Patent number: 7200009
    Abstract: It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board (3, 4), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination (113) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: April 3, 2007
    Assignee: Nokia Corporation
    Inventors: Katri Narhi, Roope Takala, Jari Nousiainen, Pentti Ahlgren, Pia Tanskanen
  • Patent number: 7196908
    Abstract: An electronic device, including: a plurality of contacts pads on a surface of a substrate; the contacts pads spaced apart a first predetermined distance in a first direction; and the contact pads spaced apart a second predetermined distance in a second direction, the first predetermined distance different from the second predetermined distance, the first direction perpendicular to the second direction.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: March 27, 2007
    Assignee: International Business Machines Corporation
    Inventors: Timothy W. Budell, David B. Stone, Jerzy M. Zalesinski