Abstract: A microwave filter has resonator comprised of a cylindrical structure having conductive walls filled with a dielectric material where the cylindrical structure is recessed inside a multi-layered substrate. First and second conductive coupling arms are disposed on a top layer of the substrate for coupling signals to the cylindrical structure. The conductive coupling arms are separated by a dielectric layer. The first and second conductive coupling arms extend away from the center of the cylindrical structure to form a microstrip line. The cylindrical structure further comprises a bottom portion having a solid conductive bottom plate perpendicular to the axis of the cylinder and a bottom conductive ground layer separated from the conductive bottom plate by a second dielectric layer.

Abstract: A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of external bond pads. A plurality of power vias and ground vias may be routed from a first redistribution layer between the internal bond surface and the external bond surface to a second redistribution layer between the first redistribution layer and the external bond surface based on a via pattern. The via pattern may comprise routing a power via and a ground via adjacent one another spaced apart at a distance that is substantially equal to a minimum routing pitch associated with the multilayer substrate.

Abstract: According to one embodiment of the invention, an apparatus includes a housing having a front side and a bottom side adjacent the front side. The apparatus also includes a plurality of light generating devices each operable to generate light in response to operation of a particular component of the apparatus. The apparatus also includes a plurality of light pipes each associated with a respective ones of the light generating devices and operable to display light generated by the respective light generating device such that the light is visible on the front side and on the bottom side of the housing. According to another embodiment, an apparatus includes a housing having at least one heat sink disposed therein and overlying a component of the apparatus. The apparatus also includes at least one heat sink having a base and a plurality of fins extending from the base.

Abstract: An improved front panel assembly is capable of being used with an electronic equipment rack. The improved front panel assembly includes a cover, an attachment subassembly configured to attach the cover to the electronic equipment rack, and a metallic EMI shield. The cover includes (i) a central portion configured to separate an external space in front of the electronic equipment rack and an internal space within the electronic equipment rack, and (ii) side portions which extend around a periphery of the metallic EMI shield. The side portions are configured to elevate and support the central portion from the metallic EMI shield. The central portion and the side portions define a top slot which extends horizontally along a top outer edge of the central portion and a bottom slot which extends horizontally along a bottom outer edge of the central portion.

Abstract: An electronics module comprises a housing; and a plurality of electronic and electrical components for example fans. The module includes electromagnetic shielding for example perforated panels side walls etc. that is associated with the housing and/or the electronic components, and which provides a Faraday cage for the electronic components. The shielding is constructed so that one or more of the components can be removed from the module while the module is in operation substantially without affecting the integrity of the Faraday cage. The module enables certain components thereof to be replaced without adding to the downtime of the system or increasing electromagnetic interference.

Abstract: A display includes a monitor module, a base and a shielding apparatus. The base is coupled to the monitor module, and the shielding apparatus is disposed between the base and the monitor module. The shielding apparatus includes a magnetic core and a non-flexible coiled device having a number of fixed shape coils. The coiled device is put through the magnetic core so that the magnetic core is selectively surrounded by at least one of the coils of the coiled device. The monitor module is therefore grounded via the shielding apparatus.

Abstract: The present invention relates to a plug-in electronic module which has: a housing, an electronic component arranged in the housing, at least one external electrical contact connected to the electronic component, where the electronic module can be plugged into a holding structure such that the external electrical contacts on the module come into contact with associated electrical contacts on a coupling partner during the plug-in operation, and a mechanical protective apparatus which protects the electrical contacts from mechanical contact when the module is not plugged in and which exposes the electrical contacts when the module has been plugged into the holding structure, so that they can come into contact with associated electrical contacts on the coupling partner. The invention also relates to a method for connecting such an electronic module to a holding structure.

Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

Abstract: A small form factor USB Bluetooth dongle includes a printed circuit board (PCB), a USB contact area, and a radio frequency (RF) transceiver die. The PCB includes a first primary surface and a second primary surface. The USB contact area is fabricated on the first primary surface. The RF transceiver die is mounted on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.

Abstract: A bladed architecture, backplane-based network (100) having N payload slots (108) includes an N/2 slot switch module (102), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration (603) and a right-hand slot switch configuration (605), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration (601).

Abstract: Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid transporting apparatus. The liquid transporting apparatus may provide liquid communication between the sealed electronics module and an external liquid cooling module. The sealed electronics module may also include an apparatus for the cooling electronics components in the electronics module using liquid that is transported between the sealed electronics module and the external liquid cooling module.

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract: A support apparatus includes a first member and a second member. Each member has a first and a second portion. The first portions of the members are spaced apart and the second portions of the members are interconnected. The first member is a ribbed member in a first orientation and the second member is a ribbed member, identical to the first ribbed member, attached to the first ribbed member in a second orientation inverted from the first orientation.

Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.

Abstract: A phase separation jig (100) for a superconducting cable includes: a cable holder (10) maintaining each core (80) of a multi-core superconducting cable (2) in a predetermined tolerable bending manner; and a coupler (20, 30) holding the cable holder (10) for each core (80) at a predetermined spacing with each other. Each core (80) is spaced apart from each other and maintained in a tolerable bending manner by the holder (10). Accordingly, a phase separation structure can be obtained which can regulate deformation of the cable and prevent abnormal deformation even for a superconducting cable.

Abstract: An adjustable tray for a semiconductor device, and method of using the tray for handling the device, are provided. Each tray comprises a front frame segment and a back frame segment opposing the front frame segment, and a pair of opposing side frame segments secured to the front and back frame segments to form right angles, each side frame segment containing a longitudinal channel. Each tray further includes a fixed locator segment and an adjustable locator segment, each having a plurality of slots for receiving semiconductor devices therein. The distal ends of the locator segments are secured to the pair of opposing side frame segments at right angles. The adjustable locator segment can be manipulated such that the fixed and adjustable locator segments are spaced apart a distance commensurate with the width of the semiconductor device. The device is friction fit into a slot such that the device is only contacted at keep-out areas on the device.

Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.

Abstract: The invention relates to a capacitor device comprising the combination of a cylindrical capacitor and a holder for holding the capacitor in a sideways position. The holder includes a capacitor holding part that has an opening at the top and is arc-shaped in cross section, and a mounting part for mounting the holder itself to another device. The capacitor is held in a sideways position in the holding part of the holder with a heat shrinking resin tube interposed therebetween. Accordingly, the height of the capacitor device is reduced, so that the size of the capacitor device can be reduced. In addition, the connection distance between the capacitor device and another electronic device is shortened, so that the inductance can be made smaller.

Abstract: It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board (3, 4), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination (113) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.

Abstract: An electronic device, including: a plurality of contacts pads on a surface of a substrate; the contacts pads spaced apart a first predetermined distance in a first direction; and the contact pads spaced apart a second predetermined distance in a second direction, the first predetermined distance different from the second predetermined distance, the first direction perpendicular to the second direction.