Patents Examined by J. E. Duverne
  • Patent number: 7347697
    Abstract: Interconnection assemblies which adjust their alignment and performance through the use of control feedback from the data transferred through the assemblies.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: March 25, 2008
    Assignee: Novias, Inc.
    Inventors: Kevin P. Grundy, Gary Yasumura