Abstract: A heating apparatus for heating thermoplastic packaging materials to allow the materials to be heat-sealed, formed, or reformed includes two nozzles which supply heated air to the packaging materials, a suction box which sucks the heated air away from the packaging materials after the air has heated the materials, and a recirculation duct which recirculates the heated air from the suction box back to an intake of the nozzles.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby.