Patents Examined by J. Mitchell
  • Connection of integrated circuits
    Patent number: 6979591
    Abstract: A method for connecting a first integrated circuit having an elevated contact area lying on an elastic elevation on a main area thereof and a second integrated circuit having a corresponding non-elevated contact area on a main area thereof includes applying a liquid adhesive between the first and second main areas; aligning the first and second main areas so that the elevated contact area is opposite the corresponding non-elevated contact area; and curing the adhesive, thereby firmly connecting the first and second integrated circuits.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: December 27, 2005
    Assignee: Infineon Technologies AG
    Inventors: Harry Hedler, Roland Irsigler, Jens Pohl