Abstract: A film-forming composition that attains an improvement in the solubility of a hole-injecting/transporting material and/or an electron-accepting compound and has a drying rate appropriate for stable formation of a uniform coating film, being suitable for the formation of a hole-injecting/transporting layer. This composition comprises a hole-injecting/transporting material and/or an electron-accepting compound and a liquid in which the hole-injecting/transporting material and/or the electron-accepting compound are dissolved. This liquid mainly contains a solvent whose molecule has an aromatic ring and/or an aliphatic ring and an oxygen atom and which has either a boiling point of at least 200° C. or a vapor pressure of 1 torr or lower at 25° C.