Abstract: An assembly configured to protect a circuit board from electromagnetic interference. The assembly includes a metal shield and an enclosure. The metal shield includes a metal plate and a plurality of tangs. The plurality of tangs are spaced about and extend transversely away from at least a portion of a perimeter portion of the metal plate. The enclosure has a bottom wall and at least one sidewall disposed around a perimeter of the bottom wall, the at least one sidewall configured to urge the tangs of the metal shield inward when the metal shield is disposed in the enclosure.

Abstract: A docking device for a hard disk has a protective box housing an electronic unit including a printed circuit card and a fan arranged in or in the vicinity of an opening formed in a first wall of the protective box. The box also has a location for a hard disk. The fan is arranged in the vicinity of an edge of the printed circuit card so that the air stream driven by said fan sweeps over both main faces of the printed circuit card. The guide is designed to guide at least a portion of the air stream driven by the fan directly to the location for a hard disk.

Abstract: A fuse unit including a fuse element therein includes a first resin body and a second resin body. The second resin body is connected to the first resin body by a hinge portion and configured to be bended around the hinge portion with respect to the first resin body. A pair of first side walls and a pair of second side walls are provided on the first resin body and the second resin body respectively and extend in a direction intersecting an axis of the bending of the second resin body. A pair of engaging parts are provided at the lock arms provided at the first side walls respectively respectively, and each of which has a first inclined face. A pair of engaged parts are provided at the second side walls respectively, and corresponds to the engaging parts respectively, and each of which has a second inclined face configured to contact the first inclined face in surface contact in a state that the second resin body is bended.

Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Abstract: Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

Abstract: A docking station for a portable communication device includes a body portion and a guide portion which is formed to accommodate various exterior shapes of the portable communication device and detachably coupled to the portable communication device.

Abstract: A power electronics assembly for a magnetic resonance device includes a housing and at least one printed circuit board (PCB) arranged in the housing with at least one power electronics component to be cooled. The PCB has an at least one millimeter thick backside layer that may be made of copper. The power electronics assembly also includes a stabilizing cooling plate configured as part of the housing and/or the housing includes at least one coolant channel open on at least one side, so that the PCB mounted on the cooling plate comes into direct contact with coolant guided in the coolant channel in an area of the power electronics components with the backside layer.

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract: A reset rod (43) of a thermal overload relay is configured to be switchable between a manual reset position in which a reversal mechanism (21) is manually returned to an initial state prior to reversal by performing a pushing-in operation, and an automatic reset position in which a pushed-in state is held by a pushing and rotating operation from this manual reset position, and the reversal mechanism (21) is automatically returned to the initial position. In addition, axial runout restriction portions (17b, 17d, 51, 46 and 47), which restrict axial runout of the reset rod (43) when the reset rod (43) is held in the automatic reset position, are provided.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A wiring body connection structure includes a first wiring body and a second wiring body, the first wiring body having a first base material made of an elastomer and a first wiring containing an elastomer and a conductive material, the second wiring body having a second base material and a second wiring. In the wiring body connection structure, a laminated section is partitioned where a first end of the first wiring body and a second end of the second wiring body overlap in a front-rear direction. The wiring body connection structure further includes a cover member arranged on a front surface of the first wiring body, and a conductive adhesive layer bonding the first end and the second end in the laminated section while ensuring a conductive property. The cover member is interposed between a frontmost end of the second end and the first wiring in the laminated section.

Abstract: A protection circuit board is disclosed. The protection circuit board includes a main printed circuit board and an auxiliary printed circuit board. In the auxiliary printed circuit board, a thermistor is electrically interposed between an external electrode terminal and auxiliary electrodes.

Abstract: An integrated circuit device includes a support for supporting electrical circuitry, an integrated circuit having electrical circuitry disposed on the support, and a magnetic portion attached to the support around the integrated circuit. The integrated circuit and the magnetic portion are interconnected for converting a power input signal having a first characteristic to a power output signal having a second characteristic different from the first characteristic.

Abstract: In a computer system, airflow through first and second cooling regions are normally separated by a chassis wall, and are independently controlled by respective first and second fan modules. The internal chassis wall includes a bypass opening that is normally blocked by the second fan module. In response to removal of the second fan module, the bypass opening is unblocked, to fluidly couple the two cooling regions. A redundant fan module is optionally included in fluid communication with the first cooling region, to either generate airflow through the first cooling region in response to failure or removal of the first fan module, or to supplement the airflow capacity of the first fan module in response to removal of the second fan module.

Abstract: An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.

Abstract: A foldable and restrainable cable for electrical and electronic devices. The cables are preformed with bends to allow the cable to be gathered together easier for bundling. The cable also has a restrainer section at one end to hold the cable together after it is gathered and bundled for storage.

Abstract: A fixing component fixes a detachable component to a housing of an electronic apparatus. The fixing component includes a first operating portion, a first engaging portion and a second operating portion. The first operating portion is configured to receive a movement operation in a first direction and to permit movement in a second direction intersecting the first direction. The first engaging portion is connected to the first operating portion and is configured to release engagement with the detachable component when the first operating portion is moved in the second direction. The second operating portion is connected to the first engaging portion and is configured to receive a movement operation in the second direction.