Patents Examined by Jaimie Annette McKeel
  • Patent number: 12150790
    Abstract: A method of obtaining a feature for blood pressure estimation is provided. The method includes extracting a reference feature from a bio-signal; obtaining a feature for blood pressure estimation by: obtaining, as the feature for blood pressure estimation, a first candidate feature based on the reference feature being less than a first threshold; obtaining, as the feature for blood pressure estimation, a second candidate feature based on the reference feature being greater than or equal to a second threshold that is greater than the first threshold; or obtaining, as the feature for blood pressure estimation, a combination of the first candidate feature and the second candidate feature based on the reference feature being less than the second threshold; and estimating a blood pressure by using the obtained feature.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: November 26, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Soon Park, Ui Kun Kwon, Young Soo Kim, Dae Geun Jang
  • Patent number: 12097166
    Abstract: There is provided an apparatus (12) for use in measuring blood pressure. The apparatus (12) comprises a processor (102) configured to acquire a signal indicative of pressure oscillations detected inside a cuff inflated to pressurize a measurement site of a subject undergoing cardiopulmonary resuscitation. The pressure oscillations detected inside the cuff are indicative of a pulse of the subject. The processor (102) is also configured to trigger a blood pressure measurement for the subject based on the pressure oscillations detected inside the cuff.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 24, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Maarten Petrus Joseph Kuenen, Ralph Wilhelm Christianus Gemma Rosa Wijshoff, Jens Muehlsteff
  • Patent number: 11974831
    Abstract: An apparatus for estimating a core body temperature of an object is provided. The apparatus may include a heat flow sensor configured to measure a first heat flux from an object, a first temperature sensor positioned under a thermal conducting material and configured to measure a surface temperature of the object, a second temperature sensor positioned above the thermal conducting material and configured to measure a surface temperature of the thermal conducting material, and a processor configured to obtain a second heat flux by calibrating the first heat flux based on the surface temperature of the object and the surface temperature of the thermal conducting material, and configured to estimate a core body temperature of the object based on the obtained second heat flux and the surface temperature of the object.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: So Young Lee, Sang Kyu Kim