Abstract: The invention is a composition comprising a) one or more isocyanate functional polyether based prepolymers containing one or more organic based polymers dispersed therein; b) one or more isocyanate functional polyester based prepolymers which is solid at 23° C.; c) one or more polyisocyanates having a nominal functionality of about 3 or greater; d) one or more conductive carbon blacks in an amount such that the composition has a dielectric constant of about 15 or less; and e) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups, wherein the composition demonstrates upon cure a modulus of 2.0 MPa or greater at 25° C. measured according to ASTM D4065; a dielectric constant of about 15 or less; a sag of an uncured sample of less than 2 mm, a press flow viscosity of about 20 to about 50 and a storage modulus of about 5.3×105 Pa or greater.
Abstract: An object of the present invention is to provide a composition useful for forming an electroconductive resin, the composition comprising a resin and a vapor-growth carbon fiber compounded with the resin, and which can be easily formed into a thin film, and to provide an electroconductive resin which is made from the composition and has various functions such as electromagnetic shielding, electric-filed shielding, electrostatic elimination, and so forth. A polar organic solvent of a film-forming component and a polar organic solvent of a vapor-growth carbon fiber are previously stirred to dissolve and disperse uniformly. The both solutions are mixed and then stirred to provide composition useful for forming electroconductive resin (solution). And the composition useful for forming electroconductive resin is solidified by reaction.
Abstract: The present invention provides a transparent conductive material containing a conductive powder, a reactive compound having an organic group capable of being bound to the conductive powder, and reactive functional groups; and a multifunctional organic compound capable of being bound to the reactive compound.
Abstract: Compositions are provided comprising at least one conductive polymer and at least one non-polymeric fluorinated organic acid, wherein the conductive polymer is selected from a polythiophene, a polypyrrole, a polyaniline, and combinations thereof. Electronic devices and applications having at least one layer comprising such compositions are further provided.
Type:
Grant
Filed:
April 13, 2004
Date of Patent:
April 8, 2008
Assignee:
E.I. du Pont de Nemours and Company
Inventors:
Che-Hsiung Hsu, Mark Andrew Harmer, Christopher P. Junk
Abstract: A composition for an overcoat layer suitable for use in an organophotoreceptor for liquid toner, an organophotoreceptor manufactured by employing the composition and an electrophotographic imaging apparatus containing the organophotoreceptor. Since the organophotoreceptor can maintain higher charge potential and low residual or discharge potential, the lifetime of the organophotoreceptor can be extended. Also, since the organophotoreceptor has good solvent resistance and abrasion resistance, it can be advantageously used for liquid toner.
Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.
Type:
Grant
Filed:
March 2, 2005
Date of Patent:
March 11, 2008
Assignee:
Hewlett-Packard Development Company, L.P.
Abstract: An electrically-conductive resin composition comprises (A) a thermoplastic resin and (B) an electrically-conductive polymer blended together. The electrically-conductive polymer is an electrically-conductive polyester doped with a dissociable inorganic salt. The doped polyester is at least one polyester selected from the group consisting of (a) polyesters each of which has a weight average molecular weight of from 50,000 to 500,000 and has been obtained by subjecting at least caprolactone as a monomer to ring-opening polymerization and (b) comb polyesters each of which has one or more polyester chains each having a weight average molecular weight of from 50,000 to 200,000 and has been obtained by subjecting a lactone to ring-opening polymerization in the presence of a trifunctional or higher functional, polyhydric alcohol as a polymerization initiator. Electrically-conductive resin moldings made of such electrically-conductive resin compositions are also disclosed.
Abstract: This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes.
Type:
Grant
Filed:
March 7, 2006
Date of Patent:
February 5, 2008
Assignee:
E. I. du Pont de Nemours and Company
Inventors:
Michael F. Barker, Keiichiro Hayakawa, Hisashi Matsuno, Hiroaki Noda
Abstract: Nano-particles 1 of a metal or the like are dispersed in a liquid fluid 2. Thereby, the reactivity or toxicity of the liquid fluid can be reduced when the liquid fluid has reactivity or toxicity. The flow resistance of the liquid fluid can be raised, and the leakage of the liquid fluid from minute cracks can be reduced. By using the liquid fluid as a heat transfer medium of a heat exchanger, the heat transfer performance equivalent to or higher than the heat transfer performance of the original heat exchanger can be obtained.
Type:
Grant
Filed:
April 13, 2005
Date of Patent:
February 5, 2008
Assignee:
Japan Nuclear Cycle Development Institute
Abstract: A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.
Type:
Grant
Filed:
March 7, 2005
Date of Patent:
February 5, 2008
Assignee:
National Starch and Chemical Investment Holding Corporation
Abstract: The invention relates to a conductive infrared-absorbing coating material consisting of indium tin oxide. According to the invention, said coating material has a yellow index of above 15.
Abstract: A process for the production of coated carbonaceous particles including: providing a carbon residue forming material; providing particles of a carbonaceous material; mixing the carbon residue forming material and the particles of a carbonaceous material at an elevated temperature; depositing a coating of the carbon residue forming material onto the surface of the particles; and stabilizing the coated particles by subjecting the particles to an oxidation reaction. These coated carbonaceous particles are particularly useful in the manufacture of electrodes in electrical storage cells, particularly in rechargeable electrical storage cells.
Type:
Grant
Filed:
January 31, 2003
Date of Patent:
January 29, 2008
Assignee:
ConocoPhillips Company
Inventors:
Zhenhua Mao, H. Ernest Romine, Mark W. Carel
Abstract: A cleaning and treating compositions for fibrous substrates, such as carpets is described. The compositions may be used to remove stains and impart anti-soiling and optionally stain release properties to the substrates.
Abstract: A method of forming metal nanoparticles using a polymer colloid that includes at least one conductive polymer and at least one polyelectrolyte. Metal ions are reduced in water by the conductive polymer to produce the nanoparticles, which may be then incorporated in the colloidal structure to form a colloid composite. The method can also be used to separate selected metal ions from aqueous solutions.
Abstract: An organic positive temperature coefficient thermistor device comprising a pair of electrodes disposed so as to oppose each other, and a thermistor body having a positive resistance-temperature characteristic disposed between the electrodes, wherein the thermistor body is constituted by a cured product of a mixture containing an epoxy resin including a flexible epoxy resin, a curing agent, and an electrically conductive particle.
Abstract: The present invention provides a Pb free Ag paste composition for a PDP address electrode comprising a) 60 to 90% by weight of an Ag powder; b) 1 to 10% by weight of a Pb free inorganic binder; c) 0.001 to 1% by weight of an inorganic thickener; and d) 5 to 38% by weight of an alkali-soluble, negative photoresist composition for fine conductive powder dispersion. The Pb free Ag paste composition according to the invention i) is environment-friendly by using a Pb free inorganic binder, ii) is suitable for the fabrication of fine electrodes by using the prior electrode formation processes, iii) can apply the formed pattern to low temperature sintering processes of not higher than 600° C., iv) does not use a surfactant and stabilizer and has excellent printing, leveling and sintering performances by using an inorganic thickener and conductive Ag powder, and v) enables sintering to be carried out at a sintering target temperature without binder burning off zone.
Type:
Grant
Filed:
June 1, 2005
Date of Patent:
November 27, 2007
Assignee:
Dongjin Semichem Co., Ltd.
Inventors:
Byung-joo Chung, Chan-seok Park, Seong-mo Park, Sin-hye Paek
Abstract: A conductive sintered compact for fixing electrodes inside an electronic device envelope is provided. The sintered compact is made of a conductive composition calcined. The conductive composition includes at least 10 vol % to 60 vol % of Ag particles, a low melting-point glass containing 10 vol % to 80 vol % of B2O3, 0 vol % to 70 vol % of ceramic particles, and a metal oxide series pigment. The total amount of the ceramic particles and the metal oxide series pigment is at least 10 vol % or more.
Abstract: It is a principal object of the present invention to provide a dielectric having a high relative dielectric constant and dielectric loss minimized in high frequency bands. That is, the present invention relates to a composite dielectric comprising conductive particles dispersed in a porous body of inorganic oxide, wherein 1) the relative dielectric constant ¥r of the dielectric in high frequency bands of 1 GHz or more is 4 or more, and 2) the dielectric loss tan? of the dielectric in high frequency bands of 1 GHz or more is 2×10?4 or less, and to a manufacturing method therefor.
Type:
Grant
Filed:
April 7, 2005
Date of Patent:
November 20, 2007
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: The invention relates to a process of preparing regioregular polymers, in particular head-to-tail (HT) poly-(3-substituted) thiophenes with high regioregularity, to novel polymers prepared by this process, to the use of the novel polymers as semiconductors or charge transport materials in optical, electrooptical or electronic devices including field effect transistors (FETs), electroluminescent, photovoltaic and sensor devices, to FETs and other semiconducting components or materials comprising the novel polymers, to a process of endcapping polymers and to endcapped polymers obtained thereof and their use in the above devices.
Type:
Grant
Filed:
August 6, 2004
Date of Patent:
November 13, 2007
Assignee:
Merck Patent Gesellschaft mit beschrankter Haftung
Abstract: Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.