Abstract: Peroxide curable fluoroelastomer compositions and articles made therefrom are disclosed. The compositions contain 5 to 45 weight percent, based on total weight of all fluoroelastomers present in the composition, of a blend of dynamically cured fluoroelastomer particles in an uncured fluoroelastomer. The compositions are unfilled, but have tensile properties adequate for many end use applications and are particularly useful as seals in semiconductor manufacturing equipment.

Abstract: An anhydride-containing thermoplastic resin such as a styrene maleic anhydride copolymer is processed in a vented extruder in the present of a nitrogenous chemical blowing agent to both imidize at least a portion of the anhydride groups and remove volatile residues such as unreacted styrene monomer from the resin.

Abstract: Recyclable hot melt adhesive compositions suitable for plastic bonding may be prepared from styrene-ethylene-butylene-styrene tri-block and/or styrene-ethylene-butylene di-block copolymers which are tackified with at least one hydrogenated resin based on alpha-methyl styrene, vinyl toluene, styrene, coumarone-indene, dicyclopentadiene or mixtures thereof, optionally containing small amounts of white mineral oil or similar diluent. In addition, the adhesive may or may not include minor amounts of the above-described pure monomer resins (specifically composed of styrene, alpha methyl styrene or vinyl toluene or mixtures thereof) in their non-hydrogenated form to serve as end block reinforcing resins.