Patents Examined by James Wu
  • Patent number: 10734760
    Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 4, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Tahir Cader
  • Patent number: 10736239
    Abstract: A high performance computing (HPC) and storage hyperconverged design with high core densities coupled to a board integrated Non Volatile Memory (NVM) storage ecosystem, has a novel racking and highly efficient cooling system which eliminates the hot/cold aisles normally found in a Data Center. This design enables a dramatic increase in compute cores, Random Access Memory and NVM densities directly on the board, enabling quicker processing and more efficient throughput individually or working in parallel with other compute/storage boards.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: August 4, 2020
    Inventor: John Robert Jensen
  • Patent number: 10729038
    Abstract: Mobile devices executing applications utilize data services worldwide. An application executing on these mobile devices may be tested using proxy access devices (PADs) located at various points-of-presence (POPs) at different geolocations. A PAD retainer device is used to maintain a plurality of PADs in a high density arrangement while still permitting adequate cooling, wireless connectivity, and physical connectivity to a proxy host device. In one implementation, the PAD retainer device is configured to maintain a predefined physical configuration of the PADs mounted therein, while hot spots of the PADs are exposed to the ambient atmosphere to facilitate heat dissipation.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: July 28, 2020
    Assignee: HEADSPIN, INC.
    Inventors: Brien Colwell, Manish Lachwani, Michael Ramirez
  • Patent number: 10729027
    Abstract: An engine control unit (ECU) includes a housing; a cover sealingly engaged with the housing so as to define an interior space; a circuit board disposed in the interior space; and a fastener coupling together the circuit board, the housing and the cover, the fastener serving to limit an amount of deflection of the housing relative to the housing. The circuit board and the cover are constructed and arranged to define an airflow path from an outer surface of the cover to the interior space. The airflow path allows for a leak test to be performed on the ECU, wherein upon an affirmative determination that results of the leak test shows no leaks in the ECU, sealant seals the airflow path.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: July 28, 2020
    Assignee: Vitesco Technologies USA, LLC
    Inventors: Patrick Su, Kevin D Moore, Ravi Kiran Kothamasa, Leonardo Ramon Haoava Salazar
  • Patent number: 10727757
    Abstract: A power converter includes an outer housing formed of dielectric material and including a low voltage compartment and a high voltage compartment is disclosed. The power converter also includes a low voltage DC-to-AC converter disposed in the low voltage compartment, a first coil in the low voltage compartment, a first conductive shield element lining an outer wall of the low voltage compartment, the first conductive shield element being electrically coupled to an electrical input of the DC-to-AC converter and a second conductive shield element lining an outer wall of the high voltage compartment.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: July 28, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Boris S. Jacobson, Evgeny N. Holmansky, Lev Volfson
  • Patent number: 10720378
    Abstract: The present disclosure relates to a component structure, a power module and a power module assembly structure having the component structure. The component structure comprises: a first bus bar, having one end extending to a first plane to form a first connecting terminal; a second bus bar, comprising a front portion of the second bus bar and a rear portion of the second bus bar, wherein the front portion of the second bus bar is laminated in parallel with the first bus bar, and the rear portion of the second bus bar is extended to a second plane to form a second connecting terminal; and an external circuit comprising a third bus bar, wherein the third bus bar is settled in parallel with the rear portion of the second bus bar, to reduce a parasitic inductance between the first connecting terminal and the second connecting terminal.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 21, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu Hong, Juan Cheng, Tao Wang, Zhenqing Zhao
  • Patent number: 10715031
    Abstract: In order to achieve small noise and small vibration, as well as a small size and a low cost in a power converter including a capacitor module, there is provided a power converter including a power module and a capacitor module. The capacitor module includes: a plurality of capacitor elements each having a flat wound surface; an exterior case; a resin filler; and a restraint point. The exterior case has arranged therein an inclusion serving as a beam in a direction orthogonal to a flat wound surface of at least one capacitor element of the plurality of capacitor elements, and the at least one capacitor element, and the restraint point is arranged substantially in front of the flat wound surface via the inclusion.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 14, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kengo Nishimura, Satoshi Ishibashi, Masahiro Noguchi
  • Patent number: 10712600
    Abstract: A display device includes a display pane, a frame, a first protruding structure, and an adhesive structure. The display panel has a display surface. The frame surrounds the display panel and has an opening. The first protruding structure is connected to and protrudes from the frame, in which the first protruding structure and the display surface are located at the same side of the frame and the display panel. The adhesive structure adheres to the display surface of the display panel, a top surface of the first protruding structure opposite to the frame, and the frame.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: July 14, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Guo-Tsai Liau, Cheng-Min Tsai
  • Patent number: 10714852
    Abstract: A printed circuit board (PCB)-mounted contactor including a PCB with planar surface, source and load terminals fixed to the PCB, and a contact. The contact is supported by the PCB and is movable between open and closed positions. Movement of the contact is parallel to the planar surface. Electrical assemblies having PCB-mounted contactors and methods of controlling current flow in electrical systems with PCB-mounted contactors are also described.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: July 14, 2020
    Assignee: Hamilton Sundstrand Corporation
    Inventors: David M. Kucharski, John A. Dickey
  • Patent number: 10716227
    Abstract: A bending apparatus and a display device are provided. The bending apparatus includes a first supporting portion, a second supporting portion and a bending portion. Each of the first supporting portion and the second supporting portion is formed by a retractable plate-shaped structure. The bending portion rotatably connected to the first supporting portion and the second supporting portion. The first supporting portion and the second supporting portion are retractable such that the bending portion can be moved relative to the first supporting portion and the second supporting portion. In this case, a bendable position of the bending apparatus can be changed, such that the bending apparatus is bendable at multiple positions.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: July 14, 2020
    Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
    Inventor: Lin Heng
  • Patent number: 10716232
    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 14, 2020
    Assignee: Raytheon Company
    Inventors: Derek B. Wells, Kenneth P. Walsh, Jr., Gregory S. Renaud, Dimitry Zarkh
  • Patent number: 10701834
    Abstract: An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: June 30, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Osamu Aizawa, Nobumitsu Aoki, Koji Nakagawa, Keita Hirai
  • Patent number: 10691183
    Abstract: An apparatus for minimizing installation footprints of expansion cards may include one or more expansion cards that include a short edge, a long edge that is longer than the short edge and is substantially perpendicular to the short edge, and an edge connector disposed on the short edge. The apparatus may also include an expansion-card frame dimensioned to 1) guide an expansion card toward a printed circuit board of a computing device at a substantially vertical orientation such that the short edge of the expansion card is disposed proximate the printed circuit board of the computing device and the long edge of the expansion card extends away from the printed circuit board and 2) removably couple the edge connector disposed on the short edge of the expansion card to the printed circuit board of the computing device. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Facebook, Inc.
    Inventors: John Edward Fernandes, Jon Brian Ehlen
  • Patent number: 10694631
    Abstract: An access panel having a magnetic clasp, hingedly joined to an enclosure surface, especially an enclosure housing electronic components. The access panel can removably cover electronic utilities, such as sockets, ports, controls, and the like, and seal out moisture and debris. In various implementations, the access panel is secured against the enclosure surface magnetically.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: June 23, 2020
    Assignee: NEXUS TECHNOLOGIES, INC.
    Inventor: Benjamin W. Bomer
  • Patent number: 10674238
    Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
  • Patent number: 10674637
    Abstract: A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 2, 2020
    Assignee: FUJITSU LIMITED
    Inventor: Minoru Ishinabe
  • Patent number: 10667415
    Abstract: A coupling mechanism for coupling an electronic device to an outer casing includes a plurality of hook-shaped brackets interposed between a front cover and a rear cover of the electronic device, where the plurality of hook-shaped brackets pass through an accommodation hole of the outer casing and are held to hook the outer casing while the front cover and the rear cover are coupled to each other; a plurality of main bracket-mounted portions defined in the front cover, where each of the plurality of hook-shaped brackets is mounted into each of the plurality of main bracket-mounted portions; and a plurality of auxiliary bracket-mounted portions disposed on the rear cover, where each of the plurality of auxiliary bracket-mounted portions is engaged with each of the plurality of hook-shaped brackets when the front cover and the rear cover are coupled to each other.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 26, 2020
    Assignee: LSIS CO., LTD.
    Inventor: Sang-Oh Joo
  • Patent number: 10667427
    Abstract: Embodiments of the invention provide a system design for immersion cooling. The design utilizes a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is utilized to transfer the heat to the atmosphere from the cooling loop. The fluid in the cooling loop is driven by a centralized pump or pumps and the local pumps. The fluid is supplied to the immersion cooling rack or device. The design introduces several innovations on the cooling loop infrastructure by adding heat recovery system. Under different operating conditions, both the heat recovery system and external cooing unit can be connected into or bypassed from the main immersion cooling loop. At least some of the advantages include simplified infrastructure, a total system solution, high reliability, fast deployment, feasible system operation adjustment, cost reduction, and high operating efficiency.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 26, 2020
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10667414
    Abstract: A display panel mounting device is disclosed. The device includes a body with at least one handle having an activation mechanism, and a mounting element operatively connected to the body and having at least one magnet. The mounting element is attachable to a display panel with a metallic element based on the at least one magnet generating a magnetic force to engage with the metallic element and being detachable from the display panel based on the at least one magnet disengaging from the metallic element. The activation mechanism is configured to control generation of the magnetic force by the at least one magnet.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 26, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Hanseok Kim, Seungchul Lee
  • Patent number: 10660230
    Abstract: An electronic control device includes a relay including a relay case and an electromagnet and a contact part. The relay case is structured to contain the electromagnet and the contact part. The contact part is structured to be opened and closed by action of the electromagnet. A connector terminal is electrically connected to the relay. A circuit board is structured to mount the relay and the connector terminal thereon. An exterior shell is structured to contain the circuit board such that the connector terminal is exposed outside the exterior shell. A thermal mass element is disposed in a wiring route between the relay and the connector terminal.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 19, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Nobuyuki Kuroiwa, Hiroyuki Saito, Kazuhiko Nakano