Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicular from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
Type:
Grant
Filed:
August 27, 2001
Date of Patent:
March 11, 2003
Assignee:
Micron Technology, Inc.
Inventors:
Larry D. Kinsman, Walter L. Moden, Warren M. Farnworth