Abstract: Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.

Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A heat exchanger core assembly includes a frame assembly and a plurality of core bundles positioned within the frame assembly. Each core bundle includes at least one row of tubing defining at least one end of the core bundle, an edge seal gasket to seal the core bundle from an adjacently placed core bundle, and an indoor face seal gasket to seal the end with respect to the frame assembly. A method of replacing a core bundle of a heat exchanger core assembly includes identifying a core bundle requiring replacement, removing the core bundle by accessing the core bundle and sliding the core bundle with respect to the remaining plurality of core bundles from the frame assembly, and inserting a replacement core bundle in a space defined by the removed core bundle.

Abstract: A heat rejection system that employs temperature sensitive shape memory materials to control the heat rejection capacity of a vehicle to maintain a safe vehicle temperature. The technology provides for a wide range of heat rejection rates by varying the shape and thus effective properties of the heat rejection system in response to temperature. When employed as a radiator for crewed spacecraft thermal control this permits the use of higher freezing point, non-toxic thermal working fluids in single-loop thermal control systems for crewed vehicles in space and other extraterrestrial environments.

Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Abstract: Apparatus comprises: a panel (100) having first and second main faces (101, 102); and a sealed system internal within the panel and comprising plural passages (103) each extending from a first manifold cavity (107) at a first end of the panel to a second manifold cavity (107) at a second end of the panel and containing a fluid in both gas and liquid states, wherein each of the passages includes one or more protruding features (122, 123, 124) on a side of the passages that is closer to the first main face.

Abstract: The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet, wherein the metal sheet has at least one core region of an aluminum base alloy and at least one structure arranged inside the fluid channel, wherein the structure lies against a surface of the metal sheet and can be soldered to the metal sheet in a flux-free manner by way of a first soldering location in a soldering operation, and wherein a soldering region of the metal sheet and a counterpart lie against one another and can be soldered to one another in the same soldering operation as a second soldering location while wetting with flux, wherein an open path between the two soldering locations exists before the soldering operation.

Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

Abstract: A water-cooling radiator structure includes at least one first and at least one second sealing element and a first water-cooling radiator main body formed by a plurality of stacked first radiator elements. The second sealing element, the first radiator elements and the first sealing element are sequentially stacked and then integrally connected together through heat treating. The first and the second sealing element have one side connected to an upper and a lower side, respectively, of the first water-cooling radiator main body to seal a top and a bottom, respectively, of at least one first flow passage defined on the first water-cooling radiator main body. At least one first and second coupling section are optionally provided on the first sealing element or at two opposite ends of the first flow passage; and the first and the second coupling section are fluidly communicable with the first flow passage.

Abstract: A hybrid plate-fin heat exchanger for exchanging heat between a first fluid and a second fluid is disclosed. The hybrid plate-fin heat exchanger comprises a plurality of plates, each of which comprises channels for conveying the first fluid. Fins are brazed onto each plate, wherein the fins define a plurality of flow channels for the second fluid. The plates are joined to one another via friction-stir welding in such a way that the brazed regions are fluidically isolated from the first fluid during operation. As a result, the heat exchanger is suitable for use in applications that use a first fluid, such as seawater or geothermal fluid, which is corrosive for the brazed regions.

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

Abstract: The present invention relates to a ceramic heat exchange plate and a ceramic heat exchange core assembled thereby. The ceramic heat exchange core comprises sealing strips, and the ceramic heat exchange plate. A plurality of ceramic heat exchange plates A and a plurality of ceramic heat exchange plates B are alternately superimposed. Side sealing strips are arranged inside top linear sealing grooves of the ceramic heat exchange plates A and bottom linear sealing grooves of the ceramic heat exchange plates B. Side sealing strips are arranged inside top linear sealing grooves of the ceramic heat exchange plates B and bottom linear sealing grooves of the ceramic heat exchange plates A. A plurality of ceramic heat exchange plates A, a plurality of ceramic heat exchange plates B and a plurality of sealing strips are assembled to form a ceramic heat exchange core. The ceramic heat exchange core is integrally sintered.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A closed channel rotary regenerative air preheater includes element supporting baskets that have first heat transfer elements having first arches arranged in an alternating order with second heat transfer elements having second arches. Each of the first arches has a first apex and a concave segment extending therefrom and each of the second arches has a second apex and a convex segment extending therefrom. Each of the convex segments is nested in a respective one of the concave segments thereby defining a contact line therebetween which extends an entire length of the first heat transfer element and the second heat transfer element. Adjacent pairs of the contact lines define a closed passageway therebetween and between the first heat transfer element and the second heat transfer element for heat transfer fluid flow therethrough.

Abstract: The present invention relates to a ceramic heat exchange plate and an air pre-heater assembled thereby. The air pre-heater comprises a housing, the housing being provided with a lining therein and an access hole thereon. A heat exchange core is arranged inside the lining, and consists of a plurality of ceramic heat exchange plates, side connecting bolt assemblies, corner connecting bolt assemblies and side sealing strips, which are superimposed in a staggered manner; the plurality of ceramic heat exchange plates form a flue gas channel and an air channel which are intersected crisscross, and the flue gas channel and the air channel are not communicated to each other; a flue gas inlet and a flue gas outlet are arranged on a front surface and a rear surface of the housing, respectively; and an air inlet and an air outlet are arranged on a left surface and a right surface of the housing, respectively.

Abstract: A heat exchanger includes a core and a tank. The tank is equipped to a side of the core. The tank has a pocket, which is a space having an opening. The pocket is configured to receive a nut through the opening and to accommodate the nut.

Abstract: This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance.

Abstract: The invention relates to a plate heat exchanger forming between its plates a first flat flow tube in which a first fluid circulates between a first inlet orifice and a first outlet orifice, and a second flat flow tube in which a second fluid circulates between a second inlet orifice and a second outlet orifice. The two flat tubes form parallel arms which extend in a longitudinal direction (L) perpendicular to a transverse air flow traversing the heat exchanger, the first tube being upstream in the air flow and the second tube being downstream.

Abstract: An active gas-gap heat switch may significantly reduce the time required to transition between the open and closed states, reduce the heat require to warm the getter, and reduce the heat that leaks from the getter to the switch body. A thermal interface at one end of the active gas-gap heat switch may include a plurality of fins. A getter assembly may be hermetically attached to the thermal interface and a containment tube may surround and house the plurality of fins.