Abstract: A wiring board having a conductor layer formed on a substrate and a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface, the conductor layer having a resin inflow prevention portion which is provided adjacently to the said connecting pad disposition portion and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion, the resin inflow prevention portion being capable of overcoming the problem of prior art that an adhesive resin (resin layer) of a prepreg or an adhesive flows out onto the upper surface of the pad, due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element onto the pad.