Abstract: Process and device is available for forming a raised contact metallization 18) on a connection surface (11) of a substrate (10) with the use of a wire bonding device with a bonding tool (26). First of all, a wire end section of a contact material wire (13), drawn from a nose-piece (27), is connected to the connection surface (11) with the application of pressure and temperature, and subsequently a separation of the wire end section (29), connected to the connection surface (11), from the remaining contact material wire (13) takes place.

Abstract: There is provided a rolled plate joining apparatus equipped with a truck that can travel reversibly in the rolling direction, tailing end pinch rolls that are mounted on the truck and can be moved vertically with the tailing end of a preceding rolled plate pinched horizontally, leading end pinch rolls that are mounted on the truck and can pinch horizontally the leading end of a succeeding rolled plate, machining apparatuses for cutting one surface of the tailing end of the preceding rolled plate and the other surface of the leading end of the succeeding rolled plate, and a pressure welding apparatus for compressing the preceding rolled plate and the succeeding rolled plate with the machined surfaces of the preceding rolled plate and the succeeding rolled plate overlapped to reduce them approximately to the thickness of the rolled plates, including a tailing end centering apparatus placed between the tailing end pinch rolls and the pressure welding apparatus for pressing the opposite width ends of the tailing

Abstract: With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit card) that includes solder. The soldering surface and solder are heated in an oven to melt the solder. While the solder is liquids, the nonvertically approaching lead is mated with the soldering surface as it is inserted into the solder. The soldering surface, solder, and nonvertically approaching lead are then cooled, and the solder solidifies to conductively mount the nonvertically approaching lead to the soldering surface.

Abstract: An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.

Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.

Abstract: A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.

Abstract: A method of making an expanded metal sandwich structure includes cleaning at least two metal superplastic core sheets to remove metal oxides and residues that would interfere with diffusion bonding of the sheets. The core sheets are placed face-to-face and a gas pressure line fitting is inserted between one edge and is welded into place. The fitting has a through bore through which gas can flow under pressure into the space between the core sheets. The core sheets are pressed together and laser welded together into a core pack along lines which will form junction lines between the core sheets when the core pack is superplastically expanded. The core pack and the two metal face sheets having superplastic characteristics are each chemically cleaned, and the face sheets are placed over and under the core pack.

Abstract: A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied across the bonding wire and an electrode, and the maximum value of the applied high voltage is detected and sent, via a peak hold circuit, to a computer that compares the maximum high voltage with an insulation breakdown voltage of a normal detection range and calculates a gap between the end of the bonding wire and the electrode, thus determining the discharge abnormalities based upon the result of the calculation of the gap.

Abstract: A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

Abstract: An apparatus (304) and method is provided for bonding wire (104) to bond sites (108) of integrated circuits (110), lead frames, and packages at room temperatures. In preferred embodiments a ball end (106) of a gold wire (104) is bonded to an aluminum bond pad (108). Apparatus (304) includes a high frequency ultrasonic energy source (306) designed to provide ultrasonic energy at frequencies above 200 kHz. The ultrasonic energy is transmitted to the bonding interface via capillary (302). In this manner, a strong bond is formed between ball end (106) and bonding site (108). The apparatus and method provided enable bonds of sufficient shear strength to be fabricated in a sufficiently short bonding time even at ambient temperatures, enabling the efficient fabrication of temperature sensitive devices such as micromechanical structures.

Abstract: A method of using a single-headed bonder (80) to form bonds to bond pads (16) is provided. A single-headed bonder (80) includes a capillary (22) having a capillary face (40) with a long dimension along a first axis (BB) and a short dimension along a second axis (CC). The long dimension of the capillary face (40) is aligned in a first orientation such that the bond pads (16) are bonded in a first direction associated with the first orientation. The capillary (22) is then rotated to place the long dimension in a second orientation such that all the bond pads (16) are bonded in a second direction associated with the second orientation. In place of rotating the capillary (22), a second single-headed bonder (90) having a capillary (22) rotated to the second orientation can be used to bond bond pads (16) in the second direction. Transportation between bonders can be done manually, by a transport mechanism (60), by a robotic arm (70), or other suitable means.

Abstract: A movement detector of the feeder of wire solder directly touches the wire solder, and the movement detector includes (a) a rotating body which revolves when the wire solder moves along a feeding direction and (b) a rotation detector which produces a rotation detecting signal by detecting a rotation of the rotating body. An abnormal halt detector of the feeder of the wire solder compares a rotation detecting signal from a rotation detector with a rotation instructing signal sent to a motor which feeds the wire solder, and calculates the comparison result, thereby judges an abnormal halt of the wire solder. When the abnormal halt is detected, a feeding roller for the wire solder is stopped, whereby the wire solder is prevented from being bent and deformed.

Abstract: A stacking and soldering apparatus for a three dimensional stack package devices includes a first base plate for receiving the first individual package devices to be stacked and having a heater for heating metal lead portions of the first individual package devices and; a second base plate for receiving the second individual package devices to be stacked and having a heater for heating metal lead portions of the second individual package devices. A package loader is used for transferring the individual packages to the first and the second base plates; and a transferring device is used for transferring the first individual package devices in the first base plate to the second base plate.

Abstract: A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.

Abstract: The specification describes a technique for solder bump bonding IC chips or chip packages to interconnection substrates. Epoxy prepolymer underfill is applied to the surface of the interconnection substrate prior to the solder bump bonding step. The presence of the prepolymer underfill material does not interfere with effective bonding. This technique reduces substantially the potential for voids in the underfill layer that tend to occur when the underfill is applied to a bonded IC chip/substrate assembly. It also enables curing of the underfill polymer in the same heating step used to effect thermocompression bonding of the solder bumps.

Abstract: A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Abstract: A rotation device (100) provides steady, non-stepwise rotation of a wire bonding capillary (10) about the longitudinal axis of the capillary (10). This enables the capillary (10) to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device can include gears (111, 122) or friction pads (211, 222). At least a part (110) of the rotation device (120) is coupled to the capillary (10). Another part (120) of the rotation device (100) is separate from the capillary (10) but is engageable with the first part to provide rotation. Sensing devices (610, 620) may be used to provide precise initial alignment of the capillary (10) and to assist in providing and confirming precise alignment and realignment of the capillary to various bonding directions during wire bonding. A computer may be used to provide automated control and rotation of the sensing devices and the rotation device.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: An adjustable magnetic jig 20 includes a first magnetic holder 22, and a second magnetic holder 26. A pivoting joint 30 connects the first 22 and second 26 magnetic holders, so that the angle A between the holders may be selectively adjusted. Pivoting joint 30 is also selectively lockable so that angle A can be fixedly maintained. Jig 20 is particularly useful in holding magnetic workpieces 500 in a desired physical relationship so that the two workpieces 500 can be welded together.

Abstract: In a pick and place machine of the type having an X-Y movable bond head there is provided a vertically movable pick up tool in the bond head having a tip for picking up and placing a device. The tip of the bonding tool is mounted opposite a radiant heating element which is juxtaposed and separated from the tip of the bonding tool. The tip of the bonding tool is heated to a predetermined control temperature with the radiant energy heating element and during a bonding operation it incurs some cooling. The amount of cooling is calculated by the time and the length of the extension of the bonding tool from its heating element and a computer controller calculates a compensation factor over a predetermined fixed time which includes retracting the bonding tool tip a predetermined vertical distance into the heater to reheat the tool and compensate for the amount of cooling that occurred during the pick and place operation.