Abstract: A method for forming a generally uniform liquid layer on a surface of an upper surface microelectronic substrate. The apparatus can include a support that engages less than the entire lower surface of the microelectronic substrate and rotates the microelectronic substrate at a selected rate. A barrier can extend over the upper surface of the microelectronic substrate and can rotate at about the same rate as the substrate to separate a rotating air mass adjacent to the upper surface and within the barrier from a stationary air mass external to the barrier. The rotating air mass can reduce the likelihood for liquid/air interface disturbances that create non-uniformities in the liquid layer. Accordingly, the method can increase the range of thicknesses to which the liquid layer can be formed and can reduce the topographical non-uniformities of the liquid layer.
Abstract: The invention concerns a method and a device for depositing at least one thin film of a liquid agent on a wireframe element such as an optical fiber designed to form a very fine coating on said wireframe element consisting in spraying the liquid agent on the wireframe element with spraying means, the wireframe element and the spraying means being in relative movement with respect to each other. Preferably, the liquid agent used is obtained from novel acrylphosphorus or metacrylphosphorus compounds. The method is most particularly adapted for coating optical fibers and enables to substantially improve the stress corrosion factor “n” of the fibers and to maintain said factor “n” after aging.
Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
Type:
Grant
Filed:
December 10, 1999
Date of Patent:
July 10, 2001
Assignee:
International Business Machines Corporation
Inventors:
Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du B. Nguyen, Richard G. Smith, Alexander J. Swinton, Richard A. Wachnik
Abstract: In a color filter manufacturing method according to the present invention, a color filter is manufactured by coloring the respective pixels with a plurality of discharged inks arranged in the scanning direction while an ink-jet head having a plurality of ink discharging nozzles in a direction substantially perpendicular to the scanning direction is scanned over a substrate. A coloring operation is performed while the ink discharging pattern is changed for each of the arrayed pixels or each pixel group.
Abstract: Coating for the tube sheets and heat exchanger coolant tubes extending from them, especially steam condensers, based on hardening plastic mixtures, obtainable by cleaning the surfaces provided for coating using an abrasive; closing the tube inlets and outlets (or tube inlets only) with removable plugs; applying at least one layer of a hardening plastic coating on the tube sheet; allowing the coating to harden so that additional mechanical processing can ensue, and processing the surface; removing the plugs from the tube inlets and outlets (or tube inlets only) as well as applying at least one layer of a hardening plastic coating at least in the inlet area of the coolant tube, and allowing it to harden, coating of the coolant tubes by timed applications being done reactively to the tube sheet coating and the coolant tube coating exhibiting in comparison to the tube sheet coating a greater elasticity having an elongation at tear at least 2% greater in accordance with ASTM D522 with respect to the elongation at
Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
Type:
Grant
Filed:
December 29, 1998
Date of Patent:
July 3, 2001
Assignee:
Silicon Valley Group, Inc.
Inventors:
Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Reese Reynolds, Scott C. Wackerman
Abstract: Method and apparatus for forming thin films by the application of a film forming liquid to a substrate at rest or rotating a speed up to 500 rpm and then rotating the film forming liquid on the substrate at a speed and for a time sufficient to form the thin film. Such films can be used for analysis by spectrophotometric methods. Apparatus for forming such thin films is also disclosed.
Abstract: A resist film having a thickness of 5500 Å or less is coated on the wafer having a large diameter of 8 inches or more by the spin coat process. A resist is dripped while allowing the wafer to be rotated at a rotation speed of 500 rpm to 1200 rpm and the dripping of the resist is suspended at the time of spreading the resist on the whole surface of the wafer. The rotation speed is raised to the predetermined rotation speed which regulates the thickness of the resist film and is determined from the correlation of the predetermined rotation speed and the thickness of the resist film. The wafer is rotated for 1 second to 5 seconds at the predetermined rotation speed. Then, the wafer is rotated for 15 seconds or more at the rotation speed which is lower than the predetermined rotation speed.
Abstract: A method for applying fibrous cellulose insulation to a wall, ceiling, or floor which includes in at least certain embodiments mixing cellulose fibers with an adhesive without water producing a mixture, and applying (e.g. by blowing or spraying) the mixture to a surface. The method further includes spraying the mixture with a spray nozzle onto the wall by introducing cellulose fibers under pressure through a first hose into the spray nozzle, introducing the adhesive in aqueous solution under pressure through a second hose into the spray nozzle, and spraying from the spray nozzle the mixture onto the wall. In one aspect acid-containing fibers are sprayed with a PVOH adhesive (cooked with or without an acidic medium) to create the mixture.
Abstract: In a method of application of a coating medium by use of a spray device onto a moving surface, which in the direct application method is the surface of a material web, specifically a paper or cardboard web, an atmosphere of back-moistening and/or moistening medium for the atomized coating medium is maintained in the area of the spray device.
Abstract: Disclosed is method and apparatus for distributing a chemical over the surface of a substrate. The method includes depositing the chemical on a portion of the surface of a substrate near the center of the substrate. The method further includes controlling the temperature of the surface of a substrate so that the viscosity of the chemical is calibrated to cause the chemical to be deposited on the surface of the substrate in a substantially uniform manner.
Abstract: A method of removing a ceramic coating, such as a thermal barrier coating (TBC) of yttria-stabilized zirconia (YSZ), from the surface of a component, such as a gas turbine engine component. The method generally entails subjecting the ceramic coating to an aqueous solution of ammonium bifluoride, optionally containing a wetting agent, such as by immersing the component in the solution while maintained at an elevated temperature. Using the method of the invention, a ceramic coating can be completely removed from the component and any cooling holes, with essentially no degradation of the bond coat.
Abstract: A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°.
Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.
Type:
Grant
Filed:
September 8, 1999
Date of Patent:
May 29, 2001
Assignee:
Silicon Valley Group, Inc.
Inventors:
Robert P. Mandal, James C. Grambow, Ted C. Dettes, Donald R. Sauer, Emir Gurer, Edmond R. Ward
Abstract: The application of (for example, elongated strip-shaped) spots of adhesive paste to successive objects (such as paper or cardboard blanks which are to be converted into soft or hinged-lid packs for arrays of cigarettes) which are advanced stepwise below the nozzle or nozzles of one or more pasters at an adhesive-applying station is regulated by a control unit which receives signals denoting the speed of the conveyor for the objects and the position of the object at the adhesive-applying station. The control unit regulates the operation of the valve for each nozzle of the paster by taking into consideration the inertia of electrical and mechanical constituents of the paster. This ensures the application of spots having an optimum shape and an optimum position relative to the respective objects and containing predetermined quantities of adhesive.
Abstract: The invention relates to a process for depositing a layer based on a fluorine-containing metal oxide, especially a layer of fluorine-doped tin oxide F:SnO2, on a glass substrate by a chemical vapor deposition technique using at least two precursors, including at least one metal precursor and at least one fluorine precursor. According to the invention, the fluorine precursor consists essentially of nitrogen trifluoride NF3.
Abstract: A method of providing a protective layer for a glass sheet. The protective layer provided by depositing a solution of a polymer and water on a glass sheet at a temperature high enough to provide a layer that is insoluble in water below a temperature of about 20° C. The layer is soluble in water at a temperature above about 60° C., so that the protective layer can be removed by rinsing in hot water.
Abstract: A resin-impregnated endless belt for a long nip press or calender of the shoe type, or for other papermaking and paper-processing applications, has an open base fabric in the form of an endless loop with an inner surface, an outer surface, a machine direction and a cross-machine direction. A coating of a polymeric resin is on the inner surface of the base fabric. The polymeric resin impregnates and renders the base fabric impermeable to liquids, and forms a layer on the inner surface thereof. The coating is smooth and provides the belt with a uniform thickness. The belt is manufactured by mounting the base fabric about a first roll and a second roll, which are separated to place the base fabric under tension in the machine direction. A conveyor belt is placed within the base fabric at a preselected distance from the inner surface thereof.
Abstract: Processes are disclosed for the use of subcritical compressed fluids, such as carbon dioxide or ethane, to reduce viscosity and to enhance atomization when spray applying coating compositions containing low molecular weight polymers to substrates, by using spray conditions that produce choked flow in the liquid mixture being sprayed, wherein the subcritical compressed fluid is a gas at standard conditions of 0° C. temperature and one atmosphere pressure and is miscible with the coating composition.
Type:
Grant
Filed:
November 18, 1998
Date of Patent:
April 24, 2001
Assignee:
Union Carbide Chemicals & Plastics Technology
Corporation
Abstract: The disclosed invention consists of a means for conveying a gypsum or gypsum/cellulose fiber board to a rotary cylinder brush station where pMDI resin is delivered onto the rotary cylinder brush just as the board passes under the brush. A resin distribution system is used to coat the rotary cylinder brush applicator with pMDI. Optionally, a second rotary cylinder brush station is included, if desired, to smooth out and spread the pMDI resin over the surface of the gypsum board substrate to achieve complete coverage.
Type:
Grant
Filed:
July 23, 1999
Date of Patent:
April 17, 2001
Assignee:
United States Gypsum Company
Inventors:
Michael L. Bolind, Michael J. Porter, Mark B. Scalf