Patents Examined by Jennifier M Dolan
  • Multi-chip semiconductor connector assembly method
    Patent number: 7202105
    Abstract: In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: April 10, 2007
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Stephen St. Germain, Jay A. Yoder